Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1996
05/14/1996US5516032 Method for forming bump electrode
05/14/1996US5516031 Soldering method and apparatus for use in connecting electronic circuit devices
05/14/1996US5516029 Method and apparatus for bonding a semiconductor device
05/14/1996US5516026 Pellet bonding apparatus
05/14/1996US5516023 Wire bonding apparatus
05/14/1996US5515986 Plasma treatment apparatus and method for operating same
05/14/1996US5515985 Chlorine etching
05/14/1996US5515984 Method for etching PT film
05/14/1996US5515618 Substrate transportation system
05/14/1996CA2040660C Epitaxial silicon layer and method to deposit such
05/09/1996WO1996013967A1 Programmable high density electronic testing device
05/09/1996WO1996013942A1 Illumination system for displays panels
05/09/1996WO1996013864A1 Heterojunction energy gradient structure
05/09/1996WO1996013863A2 Field effect device
05/09/1996WO1996013862A1 Silicon-on-insulator device with floating collector
05/09/1996WO1996013861A1 High resolution active matrix lcd cell design
05/09/1996WO1996013860A1 Ferroelectric memory
05/09/1996WO1996013858A2 Integrated microwave semiconductor device with active and passive components
05/09/1996WO1996013857A1 Stable high voltage semiconductor device structure
05/09/1996WO1996013856A1 Layered low dielectric constant technology
05/09/1996WO1996013853A1 Coating solution comprising siloxane polymer and process for producing the same
05/09/1996WO1996013793A1 Method of making radio frequency identification tags
05/09/1996WO1996013741A1 Beamsplitter in single fold optical system and optical variable magnification method and system
05/09/1996WO1996013731A1 Semiconductor test chip with on-wafer switching matrix
05/09/1996WO1996013620A1 In situ getter pump system and method
05/09/1996WO1996013353A1 A method for joining metals by soldering
05/09/1996WO1996013350A1 Heat sink and method of fabricating
05/09/1996DE19540894A1 Verfahren zur Verhinderung der Absorption von Feuchtigkeit in eine Störstellen enthaltende Isolationsschicht A method for preventing absorption of moisture in an impurity-containing insulating layer
05/09/1996DE19535101A1 Local connection formation in semiconductor device
05/09/1996DE19508617C1 Ultrasonic key-wire bonding for microwires of aluminium@, palladium@ and/or copper@
05/09/1996CA2204136A1 Silicon-on-insulator device with floating collector
05/09/1996CA2203026A1 Illumination system for display panels
05/08/1996EP0711100A1 Plasma production device, allowing a dissociation between microwave propagation and absorption zones
05/08/1996EP0710989A2 Field-effect transistor and method of producing same
05/08/1996EP0710988A2 Manufacturing method for semiconductor devices controlled by field effect
05/08/1996EP0710984A1 Method of fabricating monolithic multifunction integrated circuit devices
05/08/1996EP0710981A2 Improvements in or relating to electronic devices
05/08/1996EP0710980A2 Soi substrate
05/08/1996EP0710979A2 Improvements in or relating to semiconductor devices
05/08/1996EP0710978A1 Erosion resistant electrostatic chuck
05/08/1996EP0710977A1 Surface treatment method and system
05/08/1996EP0710972A1 Micromechanical relay
05/08/1996EP0710890A1 Device fabrication using DUV/EUV pattern delineation
05/08/1996EP0710886A1 Positive photoresist composition
05/08/1996EP0710885A1 Radiation sensitive composition
05/08/1996EP0710432A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products
05/08/1996EP0710430A1 Processing low dielectric constant materials for high speed electronics
05/08/1996EP0710402A1 Integrated laser structuring process for thin film solar cells
05/08/1996EP0710400A1 Structures for preventing reverse engineering of integrated circuits
05/08/1996EP0710399A1 Process for fabricating semiconductor devices having arsenic emitters
05/08/1996EP0710398A1 Control of the properties of a film deposited on a semiconductor wafer
05/08/1996EP0710299A1 Stationary aperture plate for reactive sputter deposition
05/08/1996EP0710161A1 Post treatment of a coated substrate with a gas containing excited halogen to remove residues
05/08/1996EP0676086B1 Wafer transport module with rotatable and horizontally extendable wafer holder
05/08/1996EP0628091B1 A method of coating a piezoelectric substrate with a semi-conducting material and a method of producing a droplet ejector arrangement including the coating method
05/08/1996EP0620931A4 Improved mask for photolithography.
05/08/1996CN1122053A Semiconductor device and method for fabricating the same
05/08/1996CN1122005A Improved method for manufacturing an array of thin film actuated mirrors
05/08/1996CN1121845A System for supplying photoresist
05/07/1996US5515526 Apparatus for detecting redundant circuit included in logic circuit and method therefor
05/07/1996US5515505 Semiconductor integrated circuit with boundary scan circuit
05/07/1996US5515410 Irradiation device for deep x-ray lithography
05/07/1996US5515323 Non-volatile memory circuit for lengthening service life of non-volatile memory devices
05/07/1996US5515319 Non-volatile memory cell and level shifter
05/07/1996US5515318 Method of evaluating the gate oxide of non-volatile EPROM, EEPROM and flash-EEPROM memories
05/07/1996US5515313 Static-type semiconductor memory device
05/07/1996US5515311 Method of driving ferroelectric memory
05/07/1996US5515291 Apparatus for calculating delay time in logic functional blocks
05/07/1996US5515226 Integrated circuit incorporating a system of protection against electrostatic discharges
05/07/1996US5515225 Integrated circuit protected against electrostatic overvoltages
05/07/1996US5515167 Transparent optical chuck incorporating optical monitoring
05/07/1996US5514994 Bootstrap circuit
05/07/1996US5514949 Current mirror with at least one PNP-transistor
05/07/1996US5514913 Resin-encapsulated semiconductor device having improved adhesion
05/07/1996US5514912 Method for connecting semiconductor material and semiconductor device used in connecting method
05/07/1996US5514911 Highly integrated semiconductor device contact structure
05/07/1996US5514910 Semiconductor device having multi-level interconnection structure
05/07/1996US5514909 Aluminum alloy electrode for semiconductor devices
05/07/1996US5514908 Semiconductors
05/07/1996US5514904 Semiconductor device with monocrystalline gate insulating film
05/07/1996US5514903 Compound semiconductor single-crystalline substrate for liquid phase epitaxial growth
05/07/1996US5514902 First and second implantation layer include a material selected from nitrogen, fluorine, argon, oxygen and carbon; source and drain regions are of p-conductivity
05/07/1996US5514897 Graded implantation of oxygen and/or nitrogen constituents to define buried isolation region in semiconductor devices
05/07/1996US5514896 Nonvolatile semiconductor memory device
05/07/1996US5514894 Protection circuit device for a semiconductor integrated circuit device
05/07/1996US5514891 N-type HIGFET and method
05/07/1996US5514890 Electrically erasable programmable memory device with improved erase and write operation
05/07/1996US5514889 Non-volatile semiconductor memory device and method for manufacturing the same
05/07/1996US5514886 Image sensor with improved output region for superior charge transfer characteristics
05/07/1996US5514885 Charge coupled device
05/07/1996US5514883 Field effect transistor
05/07/1996US5514880 Field effect thin-film transistor for an SRAM with reduced standby current
05/07/1996US5514879 Gate insulated field effect transistors and method of manufacturing the same
05/07/1996US5514876 Multi-terminal resonant tunneling transistor
05/07/1996US5514852 Heat treatment device
05/07/1996US5514832 Microcavity structures, fabrication processes, and applications thereof
05/07/1996US5514822 Precursors and processes for making metal oxides
05/07/1996US5514628 Two-step sinter method utilized in conjunction with memory cell replacement by redundancies
05/07/1996US5514625 Method of forming a wiring layer
05/07/1996US5514624 Method of manufacturing a microelectronic interlayer dielectric structure