Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1996
06/04/1996US5524093 Semiconductor memory device having an arrangement to reduce stresses on non-selected ferroelectric capacitors while achieving high integration
06/04/1996US5524092 Multilayered ferroelectric-semiconductor memory-device
06/04/1996US5524042 Exit window for X-ray lithography beamline
06/04/1996US5524039 Projection exposure apparatus
06/04/1996US5524036 Charge transfer device having charge injection source for reset drain region
06/04/1996US5523976 Non-volatile semiconductor memory device having a memory cell group operative as a redundant memory cell group for replacement of another group
06/04/1996US5523969 Electrically erasable programmable non-volatile semiconductor memory device and method for manufacturing the same
06/04/1996US5523966 Memory cell and a memory device having reduced soft error
06/04/1996US5523965 Semiconductor memory device and method of manufacturing same
06/04/1996US5523964 Ferroelectric non-volatile memory unit
06/04/1996US5523952 Production progress control method
06/04/1996US5523841 Distance measuring apparatus using multiple switched interferometers
06/04/1996US5523787 Solid-state imaging device adapted for an interlaced scanning and a non-interlaced scanning and method for driving same
06/04/1996US5523697 Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof
06/04/1996US5523678 Contact mechanism for transportation comprising suction unit equipped with floating mechanism
06/04/1996US5523652 Microwave energized ion source for ion implantation
06/04/1996US5523628 Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
06/04/1996US5523627 Wiring pattern of semiconductor integrated circuit device
06/04/1996US5523626 Semiconductor device and fabrication process therefor
06/04/1996US5523625 Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit
06/04/1996US5523624 Integrated circuit device structure with dielectric and metal stacked plug in contact hole
06/04/1996US5523623 Ohmic electrode for a p-type compound semiconductor and a bipolar transistor incorporating the ohmic electrode
06/04/1996US5523621 Semiconductor device having a multilayer ceramic wiring substrate
06/04/1996US5523617 For use in a semiconductor package
06/04/1996US5523616 Semiconductor device having laminated tight and coarse insulating layers
06/04/1996US5523615 Porous dielectric material with improved pore surface properties for electronics applications
06/04/1996US5523614 Bipolar transistor having enhanced high speed operation through reduced base leakage current
06/04/1996US5523613 Band gap reference power supply device
06/04/1996US5523612 Method of manufacturing an antifuse with doped barrier metal layer and resulting antifuse
06/04/1996US5523607 Integrated current-limiter device for power MOS transistors
06/04/1996US5523606 BiCMOS semiconductor device having SiGe heterojunction and Si homo-junction transistors
06/04/1996US5523605 Semiconductor device and method for forming the same
06/04/1996US5523603 Semiconductor device with reduced time-dependent dielectric failures
06/04/1996US5523602 Multi-layered structure having single crystalline semiconductor film formed on insulator
06/04/1996US5523600 Active device constructed in opening formed in insulation layer
06/04/1996US5523598 Semiconductor integrated circuit device
06/04/1996US5523597 Electronic device achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10
06/04/1996US5523596 Semiconductor device having capacitor and manufacturing method therefor
06/04/1996US5523595 Humidity resistant titanium oxynitride film; corroosion resistance
06/04/1996US5523594 Aluminum gallium arsenide/gallium arsenide junction in which a base doping concentration is high to cause band gap narrowing
06/04/1996US5523588 Diamond film field effect transistor with self aligned source and drain regions
06/04/1996US5523587 Method for low temperature growth of epitaxial silicon and devices produced thereby
06/04/1996US5523585 Semiconductor device having a superlattice structure
06/04/1996US5523582 Method and apparatus for measuring the curvature of wafers with a laser source selecting device
06/04/1996US5523580 Reticle having a number of subfields
06/04/1996US5523574 Exposure apparatus
06/04/1996US5523542 Method for making dynamic random access memory cell capacitor
06/04/1996US5523518 Purification by electrolysis
06/04/1996US5523396 Esterification of polyhydroxy compound with 1,2-naphthoquinonediazide-5-sulfonyl chloride in the presence of a basic catalyst
06/04/1996US5523345 Mixture of a conjugated diene and vinyl-substituted aromatic monomer
06/04/1996US5523262 Rapid thermal annealing using thermally conductive overcoat
06/04/1996US5523259 Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer
06/04/1996US5523258 Method for avoiding lithographic rounding effects for semiconductor fabrication
06/04/1996US5523257 Mis semiconductor device and method of fabricating the same
06/04/1996US5523255 Method for forming a device isolation film of a semiconductor device
06/04/1996US5523254 Method for production of SOI transistor device and SOI transistor
06/04/1996US5523252 Method for fabricating and inspecting semiconductor integrated circuit substrate, and semi-finished product used for the sustrate
06/04/1996US5523251 Method for fabricating a self aligned mask ROM
06/04/1996US5523250 Method of manufacturing a MOSFET with LDD regions
06/04/1996US5523249 Method of making an EEPROM cell with separate erasing and programming regions
06/04/1996US5523248 Method for manufacturing MOS transistors with high breakdown voltage
06/04/1996US5523247 Method of fabricating self-aligned planarized well structures
06/04/1996US5523246 Method of fabricating a high-voltage metal-gate CMOS device
06/04/1996US5523245 Process for fabricating high-performance facet-free small-sized bipolar transistor
06/04/1996US5523244 Transistor fabrication method using dielectric protection layers to eliminate emitter defects
06/04/1996US5523242 Method of manufacturing a BiMOS device
06/04/1996US5523240 For neutralization of alkaline ions and dangling bonds to improve reliability
06/04/1996US5523187 Method for the fabrication of liquid crystal display device
06/04/1996US5523185 Method for manufacturing stencil mask
06/04/1996US5523184 Chromium pattern formed on a transparent reticle having light exposure energy attenuation
06/04/1996US5523163 Electronic substrate prepared by applying hydrogen silsesquioxane resin, heating to form si-o containing ceramic, annealing with hydrogen gas
06/04/1996US5523160 Highly-oriented diamond film
06/04/1996US5523137 Adhesive paper for tape automated bonding
06/04/1996US5523126 Method of continuously forming a large area functional deposited film by microwave PCVD
06/04/1996US5523063 Swirling flow pattern
06/04/1996US5523049 Molding with filler of thermoconductive particles; debinding; densifying into monolithic structure
06/04/1996US5522966 Dry etching process for semiconductor
06/04/1996US5522963 Method for machining and depositing metallurgy on ceramic layers
06/04/1996US5522938 Generating a sonic wave in an enclosure after heating a cleaning fluid to above its critical temperature to cause pressure variations and dislodge contaminants from the surface of a wafer
06/04/1996US5522937 Welded susceptor assembly
06/04/1996US5522935 Plasma CVD apparatus for manufacturing a semiconductor device
06/04/1996US5522767 Method of guiding air in an accommodation space and apparatus for dealing with small parts
06/04/1996US5522520 Annealing laminate of titanium nitride-titanium-silicon dioxide films to diffuse nitrogen and oxygen into titanium prior to dry-etching
06/04/1996US5522412 Vacuum treatment apparatus and a cleaning method therefor
06/04/1996US5522263 Apparatus and method for inspecting soldering condition of electronic component by using ultrasonic oscillation
06/04/1996US5522225 Thermoelectric cooler and temperature sensor subassembly with improved temperature control
06/04/1996US5522215 Substrate cooling apparatus
06/04/1996US5522133 Coining method for bonding pad surface
06/04/1996US5522131 Electrostatic chuck having a grooved surface
06/03/1996CA2163676A1 Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal
06/03/1996CA2160185A1 Low-power-dissipation cmos circuits
05/1996
05/30/1996WO1996016531A1 An apparatus for generation of a linear arc discharge for plasma processing
05/30/1996WO1996016484A1 Low cost, high average power, high brightness solid state laser
05/30/1996WO1996016447A1 Polycrystalline ferroelectric capacitor heterostructure employing hybrid electrodes
05/30/1996WO1996016446A1 Lateral bipolar transistor
05/30/1996WO1996016443A1 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened
05/30/1996WO1996016442A1 Core metal soldering knob for flip-chip technology
05/30/1996WO1996016440A1 Interconnection elements for microelectronic components
05/30/1996WO1996016439A1 CONSTRUCTING CMOS VERTICALLY MODULATED WELLS BY CLUSTERED MeV BURIED IMPLANTED LAYER FOR LATERAL ISOLATION
05/30/1996WO1996016438A1 Method of forming a silicon-on-insulator (soi) material having a high degree of thickness uniformity
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