| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 08/05/1997 | US5654240 Preventing trenching into substrate |
| 08/05/1997 | US5654239 Method of manufacturing a contact structure of an interconnection layer for a semiconductor device and a multilayer interconnection SRAM |
| 08/05/1997 | US5654238 Method for etching vertical contact holes without substrate damage caused by directional etching |
| 08/05/1997 | US5654237 Method of manufacturing semiconductor device |
| 08/05/1997 | US5654236 Method for manufacturing contact structure capable of avoiding short-circuit |
| 08/05/1997 | US5654235 Method of manufacturing contact structure using barrier metal |
| 08/05/1997 | US5654234 Method for forming a void-free tungsten-plug contact in the presence of a contact opening overhang |
| 08/05/1997 | US5654233 Step coverage enhancement process for sub half micron contact/via |
| 08/05/1997 | US5654232 Wetting layer sidewalls to promote copper reflow into grooves |
| 08/05/1997 | US5654231 Method of eliminating buried contact trench in SRAM technology |
| 08/05/1997 | US5654230 Heating substrates in process tube, introducing doping and film forming gases, decomposing gases |
| 08/05/1997 | US5654227 Method for local oxidation of silicon (LOCOS) field isolation |
| 08/05/1997 | US5654226 Wafer bonding for power devices |
| 08/05/1997 | US5654225 Integrated structure active clamp for the protection of power devices against overvoltages, and manufacturing process thereof |
| 08/05/1997 | US5654224 Capacitor construction with oxidation barrier blocks |
| 08/05/1997 | US5654223 Method for fabricating semiconductor memory element |
| 08/05/1997 | US5654222 Forming electroconductive and dielectric layers over connector node |
| 08/05/1997 | US5654221 Method for forming semiconductor chip and electronic module with integrated surface interconnects/components |
| 08/05/1997 | US5654220 Method of making a stacked 3D integrated circuit structure |
| 08/05/1997 | US5654219 Annealed poly-silicide etch process |
| 08/05/1997 | US5654218 Method of manufacturing inverse t-shaped transistor |
| 08/05/1997 | US5654217 Dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers |
| 08/05/1997 | US5654216 Formation of a metal via structure from a composite metal layer |
| 08/05/1997 | US5654215 Doping various concentration dopant, forming symmetrical and non-symmetrical spacers |
| 08/05/1997 | US5654214 Method of manufacturing a semiconductor device having at least two field effect transistors with different pinch-off voltages |
| 08/05/1997 | US5654213 Method for fabricating a CMOS device |
| 08/05/1997 | US5654212 Method for making a variable length LDD spacer structure |
| 08/05/1997 | US5654211 Method for manufacturing ultra-high speed bipolar transistor |
| 08/05/1997 | US5654210 Implanting group iv single crystal semiconductor material with group iv atoms to form first barrier region, forming second barrier region between doped region and surface of substrate |
| 08/05/1997 | US5654209 Method of making N-type semiconductor region by implantation |
| 08/05/1997 | US5654208 Method for producing a semiconductor device having a semiconductor layer of SiC comprising a masking step |
| 08/05/1997 | US5654205 Apparatus and method for depositing particles onto a wafer |
| 08/05/1997 | US5654204 Die sorter |
| 08/05/1997 | US5654203 Method for manufacturing a thin film transistor using catalyst elements to promote crystallization |
| 08/05/1997 | US5654128 Single resist layer lift-off process for forming patterned layers on a substrate |
| 08/05/1997 | US5654127 Forming cavities in substrate, lining and covering with flexible layer, metal layer, second flexible layer, removing substrate to expose flexible material, removing to expose metal, forming metal tip, removing rest of substrate |
| 08/05/1997 | US5654121 Positive-working radiation-sensitive mixture |
| 08/05/1997 | US5654081 Integrated circuit assembly with polymeric underfill body |
| 08/05/1997 | US5654041 Vertical movement of aperture of capillary slot |
| 08/05/1997 | US5654017 Modular molding apparatus |
| 08/05/1997 | US5653894 Active neural network determination of endpoint in a plasma etch process |
| 08/05/1997 | US5653891 Etching thermally conductive material to separate into plurality of convex heat sinks each having projecting portion |
| 08/05/1997 | US5653851 Method and apparatus for etching titanate with organic acid reagents |
| 08/05/1997 | US5653834 Insulating opening with nickel oxideand glass; filling with conductive metal |
| 08/05/1997 | US5653813 For vapor deposition chamber |
| 08/05/1997 | US5653811 System for the plasma treatment of large area substrates |
| 08/05/1997 | US5653810 Apparatus for forming metal film and process for forming metal film |
| 08/05/1997 | US5653803 Method of manufacturing a substrate for manufacturing silicon semiconductor elements |
| 08/05/1997 | US5653802 Method for forming crystal |
| 08/05/1997 | US5653799 Method for controlling growth of a silicon crystal |
| 08/05/1997 | US5653798 Method of making substrates for the growth of 3C-silicon carbide |
| 08/05/1997 | US5653599 Method and apparatus for retention of a fragile conductive trace with a protective clamp |
| 08/05/1997 | US5653587 Method for transporting an article through process housing while minimizing a loss of a controlled atmosphere therefrom |
| 08/05/1997 | US5653586 Curing device |
| 08/05/1997 | US5653575 Apparatus for transferring lead frame |
| 08/05/1997 | US5653565 SMIF port interface adaptor |
| 08/05/1997 | US5653380 Wire bonding apparatus and wire bonding method |
| 08/05/1997 | US5653375 Wire bonding apparatus |
| 08/05/1997 | US5653317 Vibration removing apparatus and method thereof |
| 08/05/1997 | US5653045 Method and apparatus for drying parts and microelectronic components using sonic created mist |
| 08/05/1997 | US5653020 Method for forming plastic packages, in particular thin packages, for semiconductor electronic devices |
| 08/05/1997 | US5653019 Repairable chip bonding/interconnect process |
| 08/05/1997 | US5653017 Method of mechanical and electrical substrate connection |
| 08/05/1997 | CA2111784C Methods and apparatus for cleaning objects |
| 07/31/1997 | WO1997027727A1 Process for producing a conductor structure |
| 07/31/1997 | WO1997027646A2 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby |
| 07/31/1997 | WO1997027632A1 Semiconductor neuron with variable input weights |
| 07/31/1997 | WO1997027630A1 Bipolar transistor having a collector region with selective doping profile and process for manufacturing the same |
| 07/31/1997 | WO1997027629A1 Mesa schottky diode with guard ring |
| 07/31/1997 | WO1997027628A1 Semiconductor device with self-aligned insulator |
| 07/31/1997 | WO1997027624A1 Pressurized underfill encapsulation of integrated circuits |
| 07/31/1997 | WO1997027623A1 Method for making a high-frequency or high-temperature transistor |
| 07/31/1997 | WO1997027622A1 Semiconductor manufacturing apparatus |
| 07/31/1997 | WO1997027621A1 Selective-etch edge trimming process for manufacturing semiconductor-on-insulator wafers |
| 07/31/1997 | WO1997027620A1 A self-aligned lightly-doped-drain structure for mos transistors |
| 07/31/1997 | WO1997027619A2 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method |
| 07/31/1997 | WO1997027614A1 Method and apparatus for controlling dust particle agglomerates |
| 07/31/1997 | WO1997027613A1 Ion source for an ion beam arrangement |
| 07/31/1997 | WO1997027492A1 Method for mounting bare chip and bare chip carrier |
| 07/31/1997 | WO1997027452A1 Device and process for measuring two opposite surfaces of a body |
| 07/31/1997 | WO1997027346A1 Misted precursor deposition method and apparatus with uv radiation applied to mist |
| 07/31/1997 | WO1997027133A1 Vacuum integrated smif system |
| 07/31/1997 | WO1997022138A3 Flip-chip process for producing a multi-chip module |
| 07/31/1997 | WO1997021240A3 Cmos device |
| 07/31/1997 | DE3051130C2 Bipolar or isolated gate transistor |
| 07/31/1997 | DE19702866A1 Semiconductor electronic component to printed circuit board mounting apparatus for integrated circuit element |
| 07/31/1997 | DE19700988A1 Semiconductor device with reduced-noise output buffer |
| 07/31/1997 | DE19632077A1 Power semiconductor device, especially gate-controlled transistor |
| 07/31/1997 | DE19631133A1 Semiconductor device with fuse layer |
| 07/31/1997 | DE19631132A1 Verfahren und Vorrichtung zum Herstellen einer Halbleitervorrichtung Method and apparatus for manufacturing a semiconductor device |
| 07/31/1997 | DE19629736A1 Semiconductor memory device for DRAM cell |
| 07/31/1997 | DE19612950C1 MOS transistor circuit structure |
| 07/31/1997 | DE19603962A1 Integrated circuit multi-lead connector of chip-and-foil type |
| 07/31/1997 | DE19602445A1 Vorrichtung und Verfahren zum Vermessen von zwei einander gegenüberliegenden Oberflächen eines Körpers Apparatus and method for measuring two mutually opposite surfaces of a body |
| 07/31/1997 | DE19602444A1 Structured metallised surface preparation |
| 07/30/1997 | EP0786871A2 programmable logic array integrated circuits |
| 07/30/1997 | EP0786840A1 Method of making a 45 degree inclined plane on an InP substrate and optical device |
| 07/30/1997 | EP0786819A1 Process for preparing thin-film transistor, process for preparing active matrix substrate, and liquid crystal display |
| 07/30/1997 | EP0786817A1 Side components in a power semi-conductor device |
| 07/30/1997 | EP0786816A2 Bipolar transistor having an improved epitaxial base region and method of fabricating the same |