| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/19/1997 | US5659492 For removing a film from a wafer |
| 08/19/1997 | US5659429 Illuminating optical apparatus and method |
| 08/19/1997 | US5659383 Exposure apparatus and exposure quantity control method |
| 08/19/1997 | US5659255 Method of evaluating signal conditions in a probe measurement network having a plurality of separate measurement channels |
| 08/19/1997 | US5659241 DC/DC converter and audio device incorporating the same |
| 08/19/1997 | US5659203 Sealing space between surface of chip and surface of substrate with thermoplastic polymer containing a filler and having specified glass transition temperature and that does not degrade at solder relow temperatures |
| 08/19/1997 | US5659202 Semiconductor device with a pair of dummy electrodes below an inner lead |
| 08/19/1997 | US5659200 Semiconductor device having radiator structure |
| 08/19/1997 | US5659199 Resin sealed semiconductor device |
| 08/19/1997 | US5659198 TCP type semiconductor device capable of preventing crosstalk |
| 08/19/1997 | US5659197 Hot-carrier shield formation for bipolar transistor |
| 08/19/1997 | US5659194 Semiconductor device having metal silicide film |
| 08/19/1997 | US5659193 Semiconductor device and method for manufacturing the same |
| 08/19/1997 | US5659192 SOI substrate fabrication |
| 08/19/1997 | US5659191 DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof |
| 08/19/1997 | US5659190 Semiconductor device in a thin active layer with high breakdown voltage |
| 08/19/1997 | US5659188 Capped anneal |
| 08/19/1997 | US5659187 Low defect density/arbitrary lattice constant heteroepitaxial layers |
| 08/19/1997 | US5659184 III-V compound semiconductor device with a polycrystalline structure with minimum grain size of 0.6 μm and printer and display device utilizing the same |
| 08/19/1997 | US5659183 Thin film transistor having a drain offset region |
| 08/19/1997 | US5659179 Ultra-small semiconductor devices having patterned edge planar surfaces |
| 08/19/1997 | US5658994 Microelectronics |
| 08/19/1997 | US5658834 Introducing into chamber containing substrate a precursor vapor containing carbon and boron, energizing vapor to form boron carbide film |
| 08/19/1997 | US5658830 Method for fabricating interconnecting lines and contacts using conformal deposition |
| 08/19/1997 | US5658829 Semiconductor processing method of forming an electrically conductive contact plug |
| 08/19/1997 | US5658828 Method for forming an aluminum contact through an insulating layer |
| 08/19/1997 | US5658827 Method for forming solder balls on a substrate |
| 08/19/1997 | US5658826 Forming t-shaped gate electrode |
| 08/19/1997 | US5658825 Tuning to specific wavelength range by varying ratio of arsenic and antimony |
| 08/19/1997 | US5658822 Locos method with double polysilicon/silicon nitride spacer |
| 08/19/1997 | US5658821 Method of improving uniformity of metal-to-poly capacitors composed by polysilicon oxide and avoiding device damage |
| 08/19/1997 | US5658820 Forming lower electrode, ferroelectric thin film, upper platinum electrode, forming photoresist on upper electrode, patterning, etching |
| 08/19/1997 | US5658819 Antifuse structure and process for manufacturing the same |
| 08/19/1997 | US5658818 Semiconductor processing method employing an angled sidewall |
| 08/19/1997 | US5658817 Method for fabricating stacked capacitors of semiconductor device |
| 08/19/1997 | US5658816 Method of making DRAM cell with trench under device for 256 Mb DRAM and beyond |
| 08/19/1997 | US5658815 Patterning gate conductive line on gate insulating film, depositing conductive layer, implanting low density impurity, converting first conductivity layer to second conductivity layer, patterning, implanting high density impurity |
| 08/19/1997 | US5658814 Method of forming a line of high density floating gate transistors |
| 08/19/1997 | US5658813 Method for manufacturing a semiconductor integrated circuit device having a stack gate structure |
| 08/19/1997 | US5658812 Nonvolatile semiconductor memory device and its manufacturing method |
| 08/19/1997 | US5658811 Introducing impurity to form a punch-through stopper between source and drain; on first tungsten film inside opening, second tungsten film is selectively deposited to form gate electrode |
| 08/19/1997 | US5658809 SOI substrate and method of producing the same |
| 08/19/1997 | US5658808 Method of fabricating polycrystalline silicon thin-film transistor having symmetrical lateral resistors |
| 08/19/1997 | US5658807 Methods of forming conductive polysilicon lines and bottom gated thin film transistors |
| 08/19/1997 | US5658806 Method for fabricating thin-film transistor with bottom-gate or dual-gate configuration |
| 08/19/1997 | US5658805 Method of fabricating thin-film transistors |
| 08/19/1997 | US5658804 Method for measuring parasitic components of a field effect transistor and a semiconductor integrated circuit |
| 08/19/1997 | US5658711 Forming resist film containing base generator, generating base by radiation, forming metal oxide film, etching |
| 08/19/1997 | US5658706 Resist composition for forming a pattern comprising a pyridinium compound as an additive |
| 08/19/1997 | US5658700 Tracking location of wafer moved between exposure position and replacement position |
| 08/19/1997 | US5658696 Overlapping of light screen pattern and phase shift film |
| 08/19/1997 | US5658695 Ultrafine semiconductor circuit |
| 08/19/1997 | US5658636 Method to prevent adhesion of micromechanical structures |
| 08/19/1997 | US5658472 Method for producing deep vertical structures in silicon substrates |
| 08/19/1997 | US5658440 Sputter etching patterned photoresists |
| 08/19/1997 | US5658438 Exposing substrate alternately to collimated sputtered particle flux and less-collimated sputtered particle flux |
| 08/19/1997 | US5658425 Method of etching contact openings with reduced removal rate of underlying electrically conductive titanium silicide layer |
| 08/19/1997 | US5658418 Apparatus for monitoring the dry etching of a dielectric film to a given thickness in an integrated circuit |
| 08/19/1997 | US5658417 HF vapor selective etching method and apparatus |
| 08/19/1997 | US5658389 Thin film forming method and apparatus |
| 08/19/1997 | US5658387 Semiconductor processing spray coating apparatus |
| 08/19/1997 | US5658381 Method to form hemispherical grain (HSG) silicon by implant seeding followed by vacuum anneal |
| 08/19/1997 | US5658123 Container-less transfer of semiconductor wafers through a barrier between fabrication areas |
| 08/19/1997 | US5658120 Article transport system and carriage for use therewith |
| 08/19/1997 | US5658115 For transferring generally planar articles |
| 08/19/1997 | US5658114 Modular vacuum system for the treatment of disk-shaped workpieces |
| 08/19/1997 | US5658028 Vertical wafer carrier handling apparatus |
| 08/19/1997 | US5657975 Clip head apparatus for retaining a semiconductor wafer on a pedestal |
| 08/19/1997 | US5657879 Combination wafer carrier and storage device |
| 08/19/1997 | US5657553 Substrate drying apparatus |
| 08/19/1997 | US5657538 Method of centering integrated circuit lead frame |
| 08/19/1997 | US5657537 Method for fabricating a stack of two dimensional circuit modules |
| 08/19/1997 | US5657534 Tool for surface mounting device head |
| 08/19/1997 | CA2096627C Reference voltage generator for dynamic random access memory |
| 08/19/1997 | CA2057619C Cantilever probe and apparatus using the same |
| 08/19/1997 | CA2054597C Superconducting circuit and a process for fabricating the same |
| 08/14/1997 | WO1997029519A1 Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
| 08/14/1997 | WO1997029518A1 Field effect controlled semiconductor component |
| 08/14/1997 | WO1997029516A1 Read-only memory cell device with insulating trenches and method for the production thereof |
| 08/14/1997 | WO1997029515A2 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse |
| 08/14/1997 | WO1997029511A1 High dielectric constant barium-strontium-niobium oxides for integrated circuit applications |
| 08/14/1997 | WO1997029509A1 Laser separation of semiconductor elements formed in a wafer of semiconductor material |
| 08/14/1997 | WO1997029222A2 Production of bevelled galvanic structures |
| 08/14/1997 | WO1997029218A1 Device and process for coating substrates |
| 08/14/1997 | WO1997028925A1 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers |
| 08/14/1997 | WO1997028922A1 Method of bonding insulating wire and device for carrying out this method |
| 08/14/1997 | WO1997028886A1 Liquid cooled trap patent application |
| 08/14/1997 | WO1997028724A1 Substrate support apparatus for a substrate housing |
| 08/14/1997 | WO1997022140A3 Method for purging a multi-layer sacrificial etched silicon substrate |
| 08/14/1997 | WO1997017725A3 Method of etching a polysilicon pattern |
| 08/14/1997 | DE3890368C2 Appts. for growing extended length tubular crystalline bodies |
| 08/14/1997 | DE19704289A1 Integrated semiconductor circuit, e.g. ECL-TTL level converter |
| 08/14/1997 | DE19648753A1 Semiconductor device mfr. |
| 08/14/1997 | DE19634617A1 Solar cell manufacture, preventing recombination of electrons at cell surface |
| 08/14/1997 | DE19616373A1 Forming galvanically deposited contact bumps for integrated circuits |
| 08/14/1997 | DE19605038A1 Verfahren zum Bonden von Isolierdraht und Vorrichtung zur Durchführung des Verfahrens A process for bonding insulated wire and device for carrying out the method |
| 08/14/1997 | DE19604776A1 Auftrennbare Verbindungsbrücke (Fuse) und verbindbare Leitungsunterbrechung (Anti-Fuse), sowie Verfahren zur Herstellung und Aktivierung einer Fuse und einer Anti-Fuse Disconnectable connecting bridge (FUSE) and connectable to line interruption (anti-fuse), and processes for preparation and activation of a fuse and an antifuse |
| 08/14/1997 | DE19604287A1 Fluid applicator for end of wire in wire bonding apparatus |
| 08/14/1997 | DE19604044A1 Field effect semiconductor device |
| 08/14/1997 | DE19602318C1 Method of joining micromechanical wafers e.g. for manufacture of micro-sensors, micro-valves and micro-pumps |