Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1998
08/25/1998US5798549 Conductive layer overlaid self-aligned MOS-gated semiconductor devices
08/25/1998US5798548 Semiconductor device having multiple control gates
08/25/1998US5798545 Semiconductor storage device
08/25/1998US5798544 Semiconductor memory device having trench isolation regions and bit lines formed thereover
08/25/1998US5798543 Semiconductor element structure with stepped portion for formation of element patterns
08/25/1998US5798540 Electronic devices with InAlAsSb/AlSb barrier
08/25/1998US5798538 IGBT with integrated control
08/25/1998US5798534 Manufacture of electronic devices comprising thin-film circuitry
08/25/1998US5798532 Apparatus for determining warp in semiconductor wafer cassettes
08/25/1998US5798530 Method and apparatus for aligning a mask and a set of substrates to be exposed
08/25/1998US5798469 Firing first material, cooling first and second material, removing second material which will not fuse to first
08/25/1998US5798323 Solvents, an alkanolamine, water and corrosion inhibitors
08/25/1998US5798303 Anisotropic etching; removing blocking material; isotropic etching
08/25/1998US5798302 Sputtering a graphite carbon layer over the substrate, covering with upper layer of the material having higher polishing rate, pressing against polishing pad in presence of a slurry containing abrasive alumina, moving the pad
08/25/1998US5798301 Method of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliability
08/25/1998US5798300 Method for forming conductors in integrated circuits
08/25/1998US5798299 Stacking, etching, opening via hole, forming via interconnect
08/25/1998US5798298 Method of automatically generating dummy metals for multilevel interconnection
08/25/1998US5798296 Method of fabricating a gate having a barrier of titanium silicide
08/25/1998US5798295 Method for forming a buried contact on a semiconductor substrate
08/25/1998US5798294 Semiconductor substrate having a serious effect of gettering heavy metal and method of manufacturing the same
08/25/1998US5798293 Wafer bonding technique: two amorphous layers are placed face to face and bonded by heating; piece is annealed at such a high temperature that the material of the amorphous layer is allowed to flow for relaxing a 3c-sic-layer; epitaxial growth
08/25/1998US5798292 Method of forming wafer alignment patterns
08/25/1998US5798291 Method of making a semiconductor device with recessed source and drain
08/25/1998US5798290 Forming lower electrode layer which has concave and convex surface by polycrystalline silicon, rounding the tips of above surfaces by doping arsenic or phosphorus, forming upper electrode and dielectric layer inbetween
08/25/1998US5798289 Method of manufacturing stacked capacitors in a DRAM with reduced isolation region between adjacent capacitors
08/25/1998US5798286 Connecting multiple microelectronic elements with lead deformation
08/25/1998US5798285 Method of making electronic module with multiple solder dams in soldermask window
08/25/1998US5798282 Semiconductor stack structures and fabrication sparing methods utilizing programmable spare circuit
08/25/1998US5798281 Method for stressing oxide in MOS devices during fabrication using first and second opposite potentials
08/25/1998US5798280 Exposing silicon to dopant material at relatively low temperature and elevated pressure
08/25/1998US5798279 Method of fabricating non-volatile memories with overlapping layers
08/25/1998US5798278 Method of forming raised source/drain regions in an integrated circuit
08/25/1998US5798277 Forming a base with an epitaxial growth method; concurrently performing a device isolation process, a collector-base self-alignment and a selective collector ion implantation process using a single mask
08/25/1998US5798203 Phase shift mask includes an attenuator; changing an exposed portion of positive resist layer to be resistant to developer
08/25/1998US5798196 Pattern transfer method utilizing distribution condition evaluation by charged particle beam
08/25/1998US5798141 Simultaneously supplying a reactive gas and an inert gas to a reaction tube and cotrolling the partial pressure of reactive gas constant by adjusting the flow rate of these gases; improved stability of film quality
08/25/1998US5798140 Applying coating liquid, oscillating and spinning surface until coating is evenly spread
08/25/1998US5798070 Encapsulation method
08/25/1998US5798050 Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
08/25/1998US5798016 Using protective coating selected from scandinium oxide, alumina or yttria, etchants used are fluorohydrocarbons
08/25/1998US5798014 Methods of making multi-tier laminate substrates for electronic device packaging
08/25/1998US5798005 Cold working at relatively low temperature to reduce formation of acicular particles
08/25/1998US5797999 Solar cell and method for fabricating the same
08/25/1998US5797789 Polishing system
08/25/1998US5797560 Method and device for continuously feeding film
08/25/1998US5797388 Wire-bonding apparatus and method using a covered wire
08/25/1998US5797317 Universal chuck for holding plates of various sizes
08/25/1998US5797195 Nitrogen trifluoride thermal cleaning apparatus and process
08/25/1998CA2128590C Direct mombe and movpe growth of ii-vi materials on silicon
08/25/1998CA2121712C Multi-layer wiring board and a manufacturing method thereof
08/25/1998CA2081642C X-ray exposure apparatus and semiconductor-device manufacturing method
08/25/1998CA2050120C An apparatus and a method for positioning coarse movement of a probe
08/25/1998CA2010482C Process for the fabrication of devices; utilizing electrochemically generated gases
08/20/1998WO1998036460A1 II-VI SEMICONDUCTOR DEVICE WITH BeTe BUFFER LAYER
08/20/1998WO1998036457A1 Bipolar transistor with reduced vertical collector resistance
08/20/1998WO1998036452A1 Semiconductor device and process for producing the same
08/20/1998WO1998036451A1 Method and apparatus for placing and attaching solder balls to substrates
08/20/1998WO1998036450A1 Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device
08/20/1998WO1998036449A1 Etching gas and cleaning gas
08/20/1998WO1998036448A1 Method for making a structured metallization for a semiconductor wafer
08/20/1998WO1998036447A1 Method for forming a structured metallization on a semiconductor wafer
08/20/1998WO1998036445A1 Method for one-shot removal of resist member and sidewall protection layer
08/20/1998WO1998036444A1 Device for processing semiconductor wafers
08/20/1998WO1998036443A1 Process and device for treating substrates in a fluid container
08/20/1998WO1998036442A2 Integrated pad and belt for chemical mechanical polishing
08/20/1998WO1998036405A1 Current-driven emissive display device, method for driving the same, and method for manufacturing the same
08/20/1998WO1998036106A1 OPTIMIZATION OF SiO2, FILM CONFORMALITY IN ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION
08/20/1998WO1998036045A1 Post clean treatment
08/20/1998WO1998035786A1 Intergrated pad and belt for chemical mechanical polishing
08/20/1998WO1998035785A1 Integrated pad and belt for chemical mechanical polishing
08/20/1998WO1998035765A1 Multiple stage wet processing chamber
08/20/1998DE19806564A1 IC testing device applying test signals with automatic IC handling
08/20/1998DE19806555A1 Semiconductor device including Zener diode
08/20/1998DE19806334A1 Semiconductor device production
08/20/1998DE19801488A1 Semiconductor component with heat transfer material
08/20/1998DE19746955A1 Semiconductor element testing system for burn-in test of semiconductor components
08/20/1998DE19745386A1 Automated semiconductor wafer manufacturing method
08/20/1998DE19736981A1 Semiconductor component of low loss and high breakdown voltage
08/20/1998DE19732028A1 Apparatus for production of three-dimensional stacked electronic components
08/20/1998DE19731956A1 Semiconductor device with numerous transistors, loads, or capacitive elements
08/20/1998DE19706282A1 Transistor having zones of different dopant concentration
08/20/1998DE19705745A1 Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer A method of forming a structured metallization on a semiconductor wafer
08/20/1998DE19705728A1 Schottky diode with semiconductor substrate of first doping type esp. for signal processing
08/20/1998DE19705519A1 Silicon carbide product for vertical electronic device structure
08/20/1998DE19705516A1 Silicon carbide product for microelectronic device
08/20/1998DE19705198A1 Substrate with network of conductive paths
08/20/1998CA2214192A1 Articles for semiconductor industry
08/19/1998EP0859444A2 Circuit for electrostatic discharge (ESD) protection
08/19/1998EP0859414A1 Semiconductor power device
08/19/1998EP0859411A2 Semiconducor device of surface-mount type, circuit board having such a semiconductor device mounted thereon, and a method of producing such a semiconductor device
08/19/1998EP0859410A2 Composite material for heat sinks for semiconductor devices and method for producing the same
08/19/1998EP0859409A2 Method of manufacturing diamond heat sink
08/19/1998EP0859407A2 Method of fabrication of a copper containing structure in a semiconductor device
08/19/1998EP0859406A2 Permanently mounted reference sample for a substrate measurement tool
08/19/1998EP0859405A2 Method of manufacturing a raised capacitor electrode
08/19/1998EP0859404A2 Washing solution of semiconductor substrate and washing method using the same
08/19/1998EP0859403A1 Pressure sensitive adhesive composition for the polishing of the back of a wafer
08/19/1998EP0859402A2 Method of manufacturing a MOS electrode
08/19/1998EP0859401A2 Semiconductor device with a self-aligned structure