| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/08/1998 | US5804506 Forming conductor having nitride encapsulating layer, depositing geranium doped glass nonconducting layer over conductor, etching so that germanium doped glass layer is removed faster than nitride encapsulating layer |
| 09/08/1998 | US5804505 Method of producing semiconductor device having buried contact structure |
| 09/08/1998 | US5804504 Method for forming wiring of semiconductor device |
| 09/08/1998 | US5804503 Method and structure for reducing microelectronic short circuits using spin-on glass as part of the interlayer dielectric |
| 09/08/1998 | US5804502 Tungsten plugs for integrated circuits and methods for making same |
| 09/08/1998 | US5804501 Fomring dielectric layer over semiconductor substrate and a contact hole on dielectric layer by photo etching, covering with barrier metal layer, chemical vapor depositing first wiring layer and sputtering second wiring layer |
| 09/08/1998 | US5804500 Forming conductive electrode over dielectric layer; dielectric layer over upper surface of electrode; forming aperture, plugging; chemical mechanical polishing of raised outer edge, make upper electrode. |
| 09/08/1998 | US5804499 Forming in vacuum tungsten silicide doped polysilicon interconnect structure, depositing amorphous silicon layer, forming native oxide |
| 09/08/1998 | US5804498 Method of making an underlayer to reduce pattern sensitivity of ozone-TEOS |
| 09/08/1998 | US5804497 Doping n-channel region of silicon substrate with first boron and the second boron imuprities, doping p-channel region with first and second phosphorus impurities, forming gate dielectric then conductive layer, patterning conductive layer |
| 09/08/1998 | US5804496 Semiconductor device having reduced overlap capacitance and method of manufacture thereof |
| 09/08/1998 | US5804495 Method of making SOI structure |
| 09/08/1998 | US5804494 Method of fabricating bonded wafer |
| 09/08/1998 | US5804493 Method for preventing substrate damage during semiconductor fabrication |
| 09/08/1998 | US5804492 Forming pad layer on the wafer, forming silicon nitride layer, patterning, etching, forming silicon oxide layer, etching, forming isolation regions |
| 09/08/1998 | US5804491 Combined field/trench isolation region fabrication methods |
| 09/08/1998 | US5804490 Method of filling shallow trenches |
| 09/08/1998 | US5804489 A dry etching, forming by-product at top surface and inner sidewall used as a mask |
| 09/08/1998 | US5804488 Method of forming a tungsten silicide capacitor having a high breakdown voltage |
| 09/08/1998 | US5804487 Depositing epitaxial layers on substrate, depositing photoresist, patterning, developing, depositing metal to form ohmic contact, lifting off metal |
| 09/08/1998 | US5804486 Process for manufacturing a high-frequency bipolar transistor structure |
| 09/08/1998 | US5804485 High density metal gate MOS fabrication process |
| 09/08/1998 | US5804484 Method of fabricating multi-stage read-only memory semiconductor structural configuration |
| 09/08/1998 | US5804483 Heating to diffuse p-type dopants into silicon carbide layer which is doped with n-type dopants |
| 09/08/1998 | US5804482 Diffusing dopant to the surface of silicon carbide layer, highly doping surface layer of silicon carbide prior first diffusion to control the diffusion of dopant under surface layer portion |
| 09/08/1998 | US5804481 Creating saw-toothed topography for top surface of polysilicon storage node electrode |
| 09/08/1998 | US5804480 method for forming a DRAM capacitor using HSG-Si technique and oxygen implant |
| 09/08/1998 | US5804479 Method for forming semiconductor integrated circuit device having a capacitor |
| 09/08/1998 | US5804478 Method of forming a trench-type semiconductor memory device |
| 09/08/1998 | US5804477 Method of making a 6-transistor compact static ram cell |
| 09/08/1998 | US5804476 Method of forming BiCMOS devices having mosfet and bipolar sections therein |
| 09/08/1998 | US5804474 Method for forming a V-shaped gate electrode in a semiconductor device, and the structure of the electrode |
| 09/08/1998 | US5804473 Introducing a metallic element into amorphous silicon film to form intermetallic compound and atleast one nonmetallic element of group 6a and 7a or nitrogen is also doped, thermal annealing to crystallize amorphous film |
| 09/08/1998 | US5804472 Method of making spacer-type thin-film polysilicon transistor for low-power memory devices |
| 09/08/1998 | US5804471 Method of fabricating thin film transistor |
| 09/08/1998 | US5804470 Method of making a selective epitaxial growth circuit load element |
| 09/08/1998 | US5804467 Semiconductor device and method of producing the same |
| 09/08/1998 | US5804464 Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore |
| 09/08/1998 | US5804461 Modifying electrical, optical and mechanical properties of lattice structure, thus reducing propagation of dark-line defects |
| 09/08/1998 | US5804460 Forming raised topographical feature, removing portion of feature, exposing cross-section, measuring critical dimension of cross-section, measuring with second type of instrument, correlating measurements |
| 09/08/1998 | US5804459 Method for charge enhanced defect breakdown to improve yield and reliability |
| 09/08/1998 | US5804456 Electroless deposition of metal by placing the wafer in a filler block, moving filler block in process vessel for improving the mixing of metal salt |
| 09/08/1998 | US5804455 Reduced primary crystalline defect damage in NMOSFETS with an optimized LDD structure |
| 09/08/1998 | US5804454 Heating and evaporating silicon raw materials, reacting evaporated materials and oxygen in vapor phase, generating silicon dioxide, adhering silicon dioxide to substrate, forming second film |
| 09/08/1998 | US5804422 Process for producing a semiconductor package |
| 09/08/1998 | US5804339 Exposing a photoresist with an activating agent utilizing a predetermined exposure pattern with a first exposure dosage followed by exposure using a correction exposure pattern |
| 09/08/1998 | US5804338 Irradiating a microelectronic wafer |
| 09/08/1998 | US5804314 Silicon microstructures and process for their fabrication |
| 09/08/1998 | US5804259 Method and apparatus for depositing a multilayered low dielectric constant film |
| 09/08/1998 | US5804256 Method and device for coating printed-circuit boards |
| 09/08/1998 | US5804251 Depositing wetting layer on sides and bottom of opening in substrate, multistep filling with aluminum or alloy |
| 09/08/1998 | US5804249 Blanket depositing a first bulk layer of tungsten on dielectric layer and partially filling via; blanket depositing amorphous layer of tungsten followed by a second bulk layer of tungsten |
| 09/08/1998 | US5804091 Method of preventing defects and particles produced after tungsten etch back |
| 09/08/1998 | US5804090 Process for etching semiconductors using a hydrazine and metal hydroxide-containing etching solution |
| 09/08/1998 | US5804089 Plasma processing apparatus and method |
| 09/08/1998 | US5804088 Intermediate layer lithography |
| 09/08/1998 | US5804086 Structure having cavities and process for producing such a structure |
| 09/08/1998 | US5804084 Use of chemical mechanical polishing in micromachining |
| 09/08/1998 | US5804083 Method of forming a microstructure |
| 09/08/1998 | US5804054 Preparation of copper indium gallium diselenide films for solar cells |
| 09/08/1998 | US5804052 Method and device for continuous uniform electrolytic metallizing or etching |
| 09/08/1998 | US5804046 Collimator comprising slitted particle getter metal sheets in lattice pattern |
| 09/08/1998 | US5804042 Reduces or eliminates secondary plasma around backplane |
| 09/08/1998 | US5804034 Method for manufacturing semiconductor device |
| 09/08/1998 | US5804033 Generation, guiding, extraction and interaction |
| 09/08/1998 | US5804004 Stacked devices for multichip modules |
| 09/08/1998 | US5803980 De-ionized water/ozone rinse post-hydrofluoric processing for the prevention of silicic acid residue |
| 09/08/1998 | US5803979 Transport apparatus for semiconductor wafers |
| 09/08/1998 | US5803977 Apparatus for full wafer deposition |
| 09/08/1998 | US5803974 Chemical vapor deposition apparatus |
| 09/08/1998 | US5803973 Apparatus for coating a substrate by chemical vapor deposition |
| 09/08/1998 | US5803972 Semiconductor fabrication apparatus |
| 09/08/1998 | US5803967 Repeatedly cycling between first and second growth parameters; etching at intermediate stages to remove defects |
| 09/08/1998 | US5803965 Method and system for manufacturing semiconductor device |
| 09/08/1998 | US5803961 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same |
| 09/08/1998 | US5803956 Hydrofluoric acid and a hydrocarbon nonionic surfactant;etching, cleaning semiconductors |
| 09/08/1998 | US5803938 Liquid vaporizing apparatus |
| 09/08/1998 | US5803932 Resist processing apparatus having an interface section including two stacked substrate waiting tables |
| 09/08/1998 | US5803797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
| 09/08/1998 | US5803697 Charger assembly for a wafer carrying apparatus |
| 09/08/1998 | US5803696 Safety interlock device for a standard manufacturing interface arm and equipment |
| 09/08/1998 | US5803599 Apparatus and method for mixing chemicals to be used in chemical-mechanical polishing procedures |
| 09/08/1998 | US5803343 Solder process for enhancing reliability of multilayer hybrid circuits |
| 09/08/1998 | US5803341 Apparatus and method for mounting tape carrier package onto liquid crystal display |
| 09/08/1998 | US5803340 Formulation has chip mount reflow temperature that is higher than the corresponding bumping reflow temperature; suitable for high temperature applications yet can be deposited using dry film photoresist masking methods |
| 09/08/1998 | US5803339 For electrical connection to an integrated circuit |
| 09/08/1998 | US5803246 Surface package type semiconductor package and method of producing semiconductor memory |
| 09/08/1998 | US5803107 Method and apparatus for pressure control in vacuum processors |
| 09/08/1998 | US5802856 Multizone bake/chill thermal cycling module |
| 09/08/1998 | US5802702 Method of making a device including a metallized magnetic substrate |
| 09/08/1998 | US5802699 Methods of assembling microelectronic assembly with socket for engaging bump leads |
| 09/05/1998 | CA2231206A1 Field effect transistor |
| 09/03/1998 | WO1998038837A1 Plasma etching using polycarbonate etch mask |
| 09/03/1998 | WO1998038701A1 Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive, and method for manufacturing the adhesive |
| 09/03/1998 | WO1998038677A1 Method for manufacturing semiconductor device |
| 09/03/1998 | WO1998038676A1 Method and arrangement for attaching a component |
| 09/03/1998 | WO1998038675A1 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor |
| 09/03/1998 | WO1998038674A1 Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby |
| 09/03/1998 | WO1998038673A1 Substrate temperature measuring instrument, method of measuring substrate temperature, substrate heating method and heat treatment device |
| 09/03/1998 | WO1998038672A1 System for loading, processing and unloading substrates arranged on a carrier |