Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/10/2013US8530251 Manufacturing method of high-efficiency LED
09/10/2013US8530250 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
09/10/2013US8530249 Middle layer of die structure that comprises a cavity that holds an alkali metal
09/10/2013US8530248 Method for placing a component onto a target platform by an apparatus using a probe
09/10/2013US8530247 Control of implant pattern critical dimensions using STI step height offset
09/10/2013US8530246 Method for controlling threshold voltage of semiconductor element
09/10/2013US8530145 Method for manufacturing a semiconductor device
09/10/2013US8530144 Photomask and method for fabricating source/drain electrode of thin film transistor
09/10/2013US8530006 Localized plasma processing
09/10/2013US8530003 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device
09/10/2013US8529996 High-temperature attachment of organic molecules to substrates
09/10/2013US8529802 Solution composition and method of forming thin film and method of manufacturing thin film transistor using the solution composition
09/10/2013US8529783 Method for backside polymer reduction in dry-etch process
09/10/2013US8529781 Method for producing a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, and component
09/10/2013US8529779 Methods for forming surface features using self-assembling masks
09/10/2013US8529748 Functional solution supply system
09/10/2013US8529739 Indium oxide-cerium oxide based sputtering target, transparent electroconductive film, and process for producing a transparent electroconductive film
09/10/2013US8529730 Plasma processing apparatus
09/10/2013US8529728 System and method for critical dimension reduction and pitch reduction
09/10/2013US8529701 Substrate processing apparatus
09/10/2013US8528886 Material sheet handling system and processing methods
09/10/2013US8528498 Integrated steerability array arrangement for minimizing non-uniformity
09/10/2013US8528497 Drop discharge apparatus, method for forming pattern and method for manufacturing semiconductor device
09/06/2013WO2013131031A1 Integrated circuit with electromagnetic energy anomaly detection and processing
09/06/2013WO2013130918A1 Transient liquid phase, pressureless joining of aluminum nitride components
09/06/2013WO2013130737A1 Sequential cascading of reaction volumes as a chemical reuse strategy
09/06/2013WO2013130435A1 Atomic layer deposition methods for metal gate electrodes
09/06/2013WO2013130425A1 Structure and method for strain-relieved tsv
09/06/2013WO2013130366A1 Feedback control using detection of clearance and adjustment for uniform topography
09/06/2013WO2013130298A1 Gate-all around semiconductor nanowire fet's on bulk semiconductor wafers
09/06/2013WO2013130210A1 Multiplexed heater array using ac drive for semiconductor processing
09/06/2013WO2013130204A1 Gates strain induced work function engineering
09/06/2013WO2013130191A1 Abatement and strip process chamber in a load lock configuration
09/06/2013WO2013130064A1 Memristor with channel region in thermal equilibrium with containing region
09/06/2013WO2013129705A1 Manufacturing method of semiconductor device
09/06/2013WO2013129704A1 Manufacturing method of semiconductor device
09/06/2013WO2013129679A1 Liquid ejection apparatus, nanoimprint system, and liquid ejection method
09/06/2013WO2013128888A1 Imprint apparatus and imprint method, and article manufacturing method
09/06/2013WO2013128480A1 Vertical semiconductor device and manufacturing process of the same
09/06/2013WO2013128361A1 Hybrid plasma processing systems
09/06/2013WO2013128181A1 Methods and apparatus for depositing and/or etching material on a substrate
09/06/2013WO2013127589A1 Electrostatic clamp
09/06/2013WO2013068853A3 Aligned networks on substrates
09/06/2013WO2012101488A9 Led package comprising encapsulation
09/05/2013US20130231032 Polishing pad with two-section window having recess
09/05/2013US20130230990 Plasma processing apparatus and plasma processing method
09/05/2013US20130230989 Method for fabricating semiconductor device
09/05/2013US20130230988 Method for manufacturing semiconductor device
09/05/2013US20130230987 Flowable oxide film with tunable wet etch rate
09/05/2013US20130230986 Adhesion improvement for low k dielectrics to conductive materials
09/05/2013US20130230985 Three-Dimensional System-in-Package Architecture
09/05/2013US20130230984 Method to alter silicide properties using gcib treatment
09/05/2013US20130230983 Hybrid interconnect structure for performance improvement and reliability enhancement
09/05/2013US20130230982 Method for manufacturing semiconductor device
09/05/2013US20130230981 Pattern forming method
09/05/2013US20130230980 Photoresist structures having resistance to peeling
09/05/2013US20130230979 Method of forming a pattern in a semiconductor device and method of forming a gate using the same
09/05/2013US20130230978 Self-aligned contacts
09/05/2013US20130230977 Thin capped channel layers of semiconductor devices and methods of forming the same
09/05/2013US20130230976 Flat panel display device comprising polysilicon thin film transistor and method of manufacturing the same
09/05/2013US20130230975 Method of forming a germanium thin film
09/05/2013US20130230974 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230973 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230972 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230971 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230970 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230969 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230968 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
09/05/2013US20130230967 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate
09/05/2013US20130230966 Processing method for bump-included device wafer
09/05/2013US20130230965 Manufacturing method of semiconductor device
09/05/2013US20130230964 Manufacturing method for semiconductor integrated circuit device
09/05/2013US20130230959 Method of Forming a Field Effect Transistor Having Source/Drain Material Over Insulative Material
09/05/2013US20130230955 Method for fabricating a vertical transistor
09/05/2013US20130230953 Method for manufacturing semiconductor device
09/05/2013US20130230952 Integrated circuit device and method of manufacturing same
09/05/2013US20130230948 Multiple step implant process for forming source/drain regions on semiconductor devices
09/05/2013US20130230947 Fabrication method of package structure having embedded semiconductor component
09/05/2013US20130230946 Backside mold process for ultra thin substrate and package on package assembly
09/05/2013US20130230939 High aspect ratio mems devices and methods for forming the same
09/05/2013US20130230936 Semiconductor light emitting device, its manufacturing method, semiconductor device and its manufacturing method
09/05/2013US20130230932 Through-substrate via (tsv) testing
09/05/2013US20130230377 Pick and place apparatus for electronic device inspection equipment, picking apparatus thereof, and method for loading electronic devices onto loading element
09/05/2013US20130230371 Processing apparatus and device manufacturing method
09/05/2013US20130230370 Linear vacuum robot with z motion and articulated arm
09/05/2013US20130230369 Substrate processing apparatus
09/05/2013US20130230273 Systems and methods for passive alignment of opto-electronic components
09/05/2013US20130229860 Semiconductor integrated circuit device with reduced leakage current
09/05/2013US20130229846 Memories with Cylindrical Read/Write Stacks
09/05/2013US20130229746 Electrostatic chuck
09/05/2013US20130229210 On-chip power-combining for high-power schottky diode based frequency multipliers
09/05/2013US20130228933 BEOL Interconnect With Carbon Nanotubes
09/05/2013US20130228932 Package on Package Structure
09/05/2013US20130228930 Method of manufacturing semiconductor device and semiconductor device
09/05/2013US20130228929 Protection Layers for Conductive Pads and Methods of Formation Thereof
09/05/2013US20130228928 Semiconductor device and method for manufacturing same
09/05/2013US20130228927 Interconnect structures
09/05/2013US20130228924 Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor
09/05/2013US20130228923 Methods and layers for metallization
09/05/2013US20130228921 Substrate structure and fabrication method thereof