Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/15/2004US6749989 Resin of 2-alkyl-2-adamantyl (meth)acrylate, 2-oxooxapentyl (meth)acrylate, and 1-hydroxyadamantyl (meth)acrylate monomers, radiation-sensitive acid generator, and organic solvent
06/15/2004US6749983 Polymers and photoresist compositions
06/15/2004US6749971 Chrome region on the phase mask can improve mask generation by allowing the chrome on the mask to fully define the quartz etch
06/15/2004US6749957 Method for fabricating a III nitride film, substrate for epitaxial growth, III nitride film, epitaxial growth substrate for III nitride element and III nitride element
06/15/2004US6749944 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor
06/15/2004US6749770 Heating; plasma etching
06/15/2004US6749765 Aperture fill
06/15/2004US6749764 Plasma processing comprising three rotational motions of an article being processed
06/15/2004US6749763 Plasma processing method
06/15/2004US6749760 Etching a ball-limiting metallurgy stack in presence of lead, tin, and copper; integrated circuits
06/15/2004US6749730 Sputter device
06/15/2004US6749716 Apparatus for assessing a silicon dioxide content
06/15/2004US6749711 Apparatus and methods for coverlay removal and adhesive application
06/15/2004US6749690 Deposition of organic material through a mask onto a substrate; organic light emitting device (oled)
06/15/2004US6749688 Comprises spin chuck for attracting and holding semiconductor wafer in horizontal state by means of vacuum
06/15/2004US6749687 In situ growth of oxide and silicon layers
06/15/2004US6749686 Crystal growth method of an oxide and multi-layered structure of oxides
06/15/2004US6749486 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method
06/15/2004US6749484 Chemical mechanical polishing (CMP) apparatus with temperature control
06/15/2004US6749391 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
06/15/2004US6749390 Integrated tools with transfer devices for handling microelectronic workpieces
06/15/2004US6749351 Apparatus for developing substrate
06/15/2004US6749183 Production method of electronic parts and water treatment apparatus
06/15/2004US6749086 Pressurized liquid delivery module
06/15/2004US6749067 Wafer carrier door with form fitting mechanism cover
06/15/2004US6748972 Water tank, cooling tower including the same and method of manufacturing semiconductor device
06/15/2004US6748969 Poppet valve with heater
06/15/2004US6748961 Angular spin, rinse, and dry module and methods for making and implementing the same
06/15/2004US6748960 Apparatus for supercritical processing of multiple workpieces
06/15/2004US6748959 Carbon layer forming method
06/15/2004US6748865 Imprinting a physically embossed micro pattern or a magnetic micro pattern by tightly pressing a master plate to the substrate surface,
06/15/2004US6748800 Wind tunnel and collector configuration therefor
06/15/2004US6748672 Wafer dryers for Semiconductor cleaning apparatuses
06/15/2004US6748656 Folded-fin heatsink manufacturing method and apparatus
06/10/2004WO2004049762A1 Metal heater
06/10/2004WO2004049702A1 Image pickup device having a plurality of solid-state image pickup elements
06/10/2004WO2004049495A1 Planar filter, semiconductor device and radio unit
06/10/2004WO2004049454A1 Transistors having buried p-type layers beneath the source region and methods of fabricating the same
06/10/2004WO2004049453A1 Retrograde channel doping to improve short channel effect
06/10/2004WO2004049452A1 Transistor equipped with a low-impedance base terminal
06/10/2004WO2004049451A2 Boron phosphide-based compound semiconductor device, production method thereof and light-emitting diode
06/10/2004WO2004049449A1 Semiconductor device and power converter, driving inverter, general-purpose inverter and high-power high-frequency communication device using same
06/10/2004WO2004049446A1 Method of producing a laterally doped channel
06/10/2004WO2004049444A1 Structure to reduce signal cross-talk through semiconductor substrate for system on chip applications
06/10/2004WO2004049441A2 Low thermal budget fabrication of ferroelectric memory using rtp
06/10/2004WO2004049438A2 Method for producing a calibration wafer
06/10/2004WO2004049436A1 Semiconductor device having a bond pad and method for its fabrication
06/10/2004WO2004049435A1 Semiconductor device having clips for connecting to external elements
06/10/2004WO2004049432A2 Sealing porous structures
06/10/2004WO2004049431A1 Method for electrodepositing a metal, especially copper, use of said method and integrated circuit
06/10/2004WO2004049430A1 Cassette for storing multiple sheets of semiconductor wafers
06/10/2004WO2004049428A1 Method and device for joining
06/10/2004WO2004049427A1 Method and device for joining
06/10/2004WO2004049426A1 Film carrier tape for mounting of electronic part
06/10/2004WO2004049425A1 Gold alloy bonding wire for semiconductor device and process for producing the same
06/10/2004WO2004049424A2 Microelectronic packaging and components
06/10/2004WO2004049423A1 Method for manufacturing semiconductor device
06/10/2004WO2004049422A1 Insulating film material containing organic silane or organic siloxane compound, method for producing same, and semiconductor device
06/10/2004WO2004049421A1 Method for cleaning substrate processing chamber
06/10/2004WO2004049420A1 Plasma processing apparatus and method
06/10/2004WO2004049419A1 Plasma processing method and apparatus
06/10/2004WO2004049418A1 Plasma processing system and method and electrode plate of plasma processing system
06/10/2004WO2004049416A1 Method for manufacturing substrate for semiconductor device production, method for manufacturing semiconductor device, and method for cleaning apparatus for manufacturing semiconductor device
06/10/2004WO2004049415A1 Alloy material for semiconductor, semiconductor chip using such alloy material, and method for manufacturing same
06/10/2004WO2004049414A1 Electric heater for semiconductor processing apparatus
06/10/2004WO2004049413A1 Apparatus for depositing thin film on wafer
06/10/2004WO2004049412A2 Producing method for crystalline thin film
06/10/2004WO2004049411A1 Method for producing semiconductor substrate and method for fabricating field effect transistor and semiconductor substrate and field effect transistor
06/10/2004WO2004049410A1 Exposure apparatus and exposure method
06/10/2004WO2004049409A1 Production method for exposure system, light source unit, exp0srue system, exposure method and adjustment method for exposure system
06/10/2004WO2004049408A1 Wafer processing system, coating/developing apparatus, and wafer processing apparatus
06/10/2004WO2004049407A2 Plate through mask for generating alignment marks of mim capacitors
06/10/2004WO2004049406A1 Strained finfet cmos device structures
06/10/2004WO2004049405A1 Backside heating chamber for emissivity independent thermal processes
06/10/2004WO2004049403A2 Depositing nanowires on a substrate
06/10/2004WO2004049402A2 Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
06/10/2004WO2004049400A2 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition
06/10/2004WO2004049399A2 Laterally difussed mos transistor (ldmos) and method of making same
06/10/2004WO2004049398A2 Porogen material
06/10/2004WO2004049393A2 Annealing process of semiconductor wafer and device thereof
06/10/2004WO2004049356A1 Ceramic package and chip resistor, and method for manufacture thereof
06/10/2004WO2004049334A1 An exchange method and mechanism for a component of the magnetic head and the suspension or the head gimbal assembly of the hard disk driver during manufacture
06/10/2004WO2004049073A2 Drying process for low-k dielectric films
06/10/2004WO2004049072A2 Method and apparatus for overlay control using multiple targets
06/10/2004WO2004049067A1 Method of pattern formation using ultrahigh heat resistant positive photosensitive composition
06/10/2004WO2004049066A1 Applicability improver for photosensitive resin composition and photosensitive resin composition containing the same
06/10/2004WO2004049062A2 Gas-expanded liquids, methods of use thereof, and systems using gas-expanded liquids for cleaning integrated circuits
06/10/2004WO2004048950A1 Optical inspection system and radiation source for use therein
06/10/2004WO2004048923A2 Multibit metal nanocrystal memories and fabrication
06/10/2004WO2004048783A2 High-pressure device for closing a container
06/10/2004WO2004048637A1 Mocvd formation of cu2s
06/10/2004WO2004048491A1 B-stageable die attach adhesives
06/10/2004WO2004048292A1 Substrate and method for the formation of continuous magnesium diboride and doped magnesium diboride wires
06/10/2004WO2004048230A2 Vertical carousel with top and side access stations
06/10/2004WO2004048048A1 Delivery position-aligning method for transportation system
06/10/2004WO2004038808A3 Double and triple gate mosfet devices and methods for making same
06/10/2004WO2004038804A3 Semiconductor device having a u-shaped gate structure
06/10/2004WO2004038792A3 Barc shaping for improved fabrication of dual damascene integrated circuit features
06/10/2004WO2004038072A3 Plating uniformity control by contact ring shaping
06/10/2004WO2004034441A3 Apparatus and method for assembling arrays of functional elements to substrates