Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/17/2004WO2004051739A1 Creation of hermetically sealed, dielectrically isolating trenches
06/17/2004WO2004051738A2 Method for the manufacture of a display
06/17/2004WO2004051737A2 Split manufacturing method for semiconductor circuits
06/17/2004WO2004051736A1 Semiconductor producing device using mini-environment system
06/17/2004WO2004051735A1 Wafer separation apparatus
06/17/2004WO2004051732A1 Attachment of flip-chips to substrates
06/17/2004WO2004051730A1 Parts feeder
06/17/2004WO2004051729A2 Method and device for pre-treating surfaces of substrates to be bonded
06/17/2004WO2004051728A1 Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
06/17/2004WO2004051727A1 Semiconductor device with parallel plate trench capacitor
06/17/2004WO2004051726A1 Semiconductor device and its manufacturing method
06/17/2004WO2004051725A1 Epitaxial growing method and substrate for epitaxial growth
06/17/2004WO2004051724A1 Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig
06/17/2004WO2004051723A1 Removing silicon oxide from a substrate
06/17/2004WO2004051722A1 Method for drying substrates
06/17/2004WO2004051721A1 Method for cutting semiconductor substrate
06/17/2004WO2004051720A1 Method of plasma doping
06/17/2004WO2004051719A1 Mbe growth of p-type nitride semiconductor materials
06/17/2004WO2004051718A1 3-5 group compound semiconductor and method for preparation thereof
06/17/2004WO2004051715A1 Method for manufacturing soi wafer
06/17/2004WO2004051713A2 Integrated process condition sensing wafer and data analysis system
06/17/2004WO2004051712A2 Novel field effect transistor and method of fabrication
06/17/2004WO2004051711A2 Ferroelectric capacitor and process for its manufacture
06/17/2004WO2004051707A2 Gallium nitride-based devices and manufacturing process
06/17/2004WO2004051706A2 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
06/17/2004WO2004051704A2 System and method for expanding a pulse width
06/17/2004WO2004051703A2 Organic electroluminescence display panel and manufacturing method thereof
06/17/2004WO2004051701A2 A method for attaching chips to a transponder
06/17/2004WO2004051380A1 Method for forming resist pattern and resist pattern
06/17/2004WO2004051379A1 Rinse liquid for lithography and method for forming resist pattern using same
06/17/2004WO2004051378A1 Pattern transfer method and exposure system
06/17/2004WO2004051375A1 Positive resist composition
06/17/2004WO2004051372A2 Method of forming resist pattern, positive resist composition, and layered product
06/17/2004WO2004051370A1 Transfer mask blank, transfer mask, and transfer method using the transfer mask
06/17/2004WO2004051139A1 Raw solution feeding system for vaporizer and method of cleaning the raw solution feeding system
06/17/2004WO2004050948A1 Film-forming method and apparatus using plasma cvd
06/17/2004WO2004050779A1 Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices
06/17/2004WO2004050762A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern
06/17/2004WO2004050728A2 Method of producing (meth) acrylic acid derivative polymer for resist
06/17/2004WO2004050725A1 Polymer compound, resist composition and dissolution inhibitor agent containing the polymer compound
06/17/2004WO2004050261A1 Method and apparatus for control of layer thicknesses
06/17/2004WO2004050256A1 Nozzle arrangement
06/17/2004WO2004050218A1 Photocatalyst purifying system
06/17/2004WO2004044974A3 Method and apparatus employing integrated metrology for improved dielectric etch efficiency
06/17/2004WO2004032197A3 Low temperature texturing layer to enhance adhesion of subsequent layers
06/17/2004WO2004031859A3 Comprehensive integrated lithographic process control system based on product design and yield feedback system
06/17/2004WO2004028999B1 Thin films of oxidic materials having a high dielectric constant
06/17/2004WO2004025695A3 Semiconductor device with wire bond inductor and method
06/17/2004WO2004020689A3 Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides
06/17/2004WO2004019386A3 Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of rtp tool
06/17/2004WO2004017389A3 Method for performing real time arcing detection
06/17/2004WO2004016309B1 Catheter securement device
06/17/2004WO2004012232A3 Forming bilayer resist patterns
06/17/2004WO2004006633A3 Integrated circuit including field effect transistor and method of manufacture
06/17/2004WO2003107396A3 Substrate processing apparatus and related systems and methods
06/17/2004WO2003106919A3 Interferometry systems involving a dynamic beam-steering assembly
06/17/2004WO2003100858A3 Surface mounted decoupling capacitor system and process of making the same
06/17/2004WO2003092070A3 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
06/17/2004WO2003088370A3 Hermetic encapsulation of organic electro-optical elements
06/17/2004WO2003083906A3 An integrated circuit-integrated flexible shear-stress sensor skin
06/17/2004WO2003077030A3 Detection of position and estimation of surface shape
06/17/2004WO2003058199A3 Arrays of microparticles and methods of preparation thereof
06/17/2004WO2003043751A8 An apparatus and method for cleaning glass substrates using a cool hydrogen flame
06/17/2004WO2003030009A3 Programmable gate array having interconnecting logic to support embedded fixed logic circuitry
06/17/2004WO2003005396A9 Method and apparatus for scanned instrument calibration
06/17/2004WO2002099531A3 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
06/17/2004US20040117757 Method for creating charged-particle-beam exposure data, method for manufacturing semiconductor device, and program
06/17/2004US20040117744 Automated selection and placement of memory during design of an integrated circuit
06/17/2004US20040117059 Cluster tool and method for controlling transport
06/17/2004US20040117056 Information processing apparatus, information processing method, and exposure apparatus
06/17/2004US20040117055 Configuration and method for detecting defects on a substrate in a processing tool
06/17/2004US20040117054 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
06/17/2004US20040116315 Liquid composition for cleaning hydrophobic substrate and cleaning method therewith
06/17/2004US20040116313 Slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication
06/17/2004US20040116312 Method for the removal of an imaging layer from a semiconductor substrate stack
06/17/2004US20040116054 Abrasive pad and process for the wet-chemical grinding of a substrate surface
06/17/2004US20040116052 Methods for reducing delamination during chemical mechanical polishing
06/17/2004US20040116047 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
06/17/2004US20040116034 Method of manufacturing an electronic device containing a carbon nanotube
06/17/2004US20040115981 Connector packaging tray with supporting standoffs
06/17/2004US20040115960 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography
06/17/2004US20040115959 Conduit for preventing oxidation of a electronic device
06/17/2004US20040115958 Wafer boat for consolidation of porous thin layer
06/17/2004US20040115957 Apparatus and method for enhancing wet stripping of photoresist
06/17/2004US20040115956 Substrate treating device and substrate treating method
06/17/2004US20040115955 Method of forming thick silica-based film
06/17/2004US20040115954 Cvd of porous dielectric materials
06/17/2004US20040115953 Electro-optical device and driving method for the same
06/17/2004US20040115952 Cleaning solution and method for selectively removing layer in a silicidation process
06/17/2004US20040115951 Cleaning method for substrate treatment device and substrate treatment device
06/17/2004US20040115950 Pattern forming method and electric device fabricating method using the same
06/17/2004US20040115949 Method and apparatus for improving a temperature controlled solution delivery process
06/17/2004US20040115948 Method for fabricating on stack structures in a semiconductor device
06/17/2004US20040115947 Thermally zoned substrate holder assembly
06/17/2004US20040115946 Use of a sulfuric acid clean to remove titanium fluoride nodules
06/17/2004US20040115945 Using an electron beam to write phase change memory devices
06/17/2004US20040115944 Providing a wafer having a trench, a STI layer formed in the trench, the HfO2-containing gate dielectric covering the wafer and the STI layer, a gate electrode, performing a nitrogen ion bombardment to convert the exposed HfO2-containing gate dielectric to an Hf3N4 layer; utilizing phophoric acid
06/17/2004US20040115943 Method of reducing visible light induced arcing in a semiconductor wafer manufacturing process
06/17/2004US20040115942 Bonding pad of a semiconductor device and formation method thereof
06/17/2004US20040115941 Epitaxially coated semiconductor wafer and process for producing it