| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/29/2004 | US6756255 CMOS process with an integrated, high performance, silicide agglomeration fuse |
| 06/29/2004 | US6756252 Multilayer laser trim interconnect method |
| 06/29/2004 | US6756251 Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture |
| 06/29/2004 | US6756246 Method for fabricating III-V group compound semiconductor |
| 06/29/2004 | US6756244 Interconnect structure |
| 06/29/2004 | US6756243 Method and apparatus for cascade control using integrated metrology |
| 06/29/2004 | US6756242 Method of modifying an integrated circuit |
| 06/29/2004 | US6756241 Method of manufacturing semiconductor device and system for manufacturing the same |
| 06/29/2004 | US6756240 Methods of increasing write selectivity in an MRAM |
| 06/29/2004 | US6756239 Method for constructing a magneto-resistive element |
| 06/29/2004 | US6756236 Method of producing a ferroelectric memory and a memory device |
| 06/29/2004 | US6756235 Metal oxide film formation method and apparatus |
| 06/29/2004 | US6756224 Device for receiving a chip shaped carrier and process for assembling a plurality of such devices |
| 06/29/2004 | US6756184 Depositing an under bump metallurgy over semiconductor device onto contact pad; depositing and patterning a photoresist layer; depositing electrically conductive materials; removing photoresist; applying flux agent; heating, electroless plating |
| 06/29/2004 | US6756179 A positive resist comprising: a resin capable of decomposing by the action of an acid to increase solubility in an alkali developer, and a compound capable of generating aromatic sulfonic acid substituted with a fluorine containing group |
| 06/29/2004 | US6756178 Novolak resin containing at least 20% by mole of a m-cresol repeating unit and having a 1- ethoxyethyl group substituting for part of hydrogen atoms of phenolic hydroxyl groups, (b) a quinonediazide ester of, and (c) 1,1-bis(4-hydroxyphenyl) |
| 06/29/2004 | US6756168 Determining exposure time of wafer photolithography process |
| 06/29/2004 | US6756162 Stencil mask for high- and ultrahigh-energy implantation |
| 06/29/2004 | US6756160 Tunable optics transmission; lithography wavelengths; attenuation phase shifting |
| 06/29/2004 | US6756159 Method of preparing exposure data and method of preparing aperture mask data |
| 06/29/2004 | US6756132 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials |
| 06/29/2004 | US6756086 Method for the fabrication of a diamond semiconductor |
| 06/29/2004 | US6756085 Ultraviolet curing processes for advanced low-k materials |
| 06/29/2004 | US6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| 06/29/2004 | US6755984 Micro-casted silicon carbide nano-imprinting stamp |
| 06/29/2004 | US6755957 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 06/29/2004 | US6755946 Clamshell apparatus with dynamic uniformity control |
| 06/29/2004 | US6755945 Sealing substrate within an enclosure; applying voltage; process control |
| 06/29/2004 | US6755944 Ion beam deposition targets having an interlocking interface and a replaceable insert |
| 06/29/2004 | US6755935 Plasma processing apparatus |
| 06/29/2004 | US6755934 Dry gas is jetted into a chamber provided with a lid for opening and closing the chamber, inner pressure of which is reduced, to blow up particles staying in the chamber and discharged through the duct while counting blown particles |
| 06/29/2004 | US6755932 Plasma processing system and apparatus and a sample processing method |
| 06/29/2004 | US6755909 Method of crystallizing amorphous silicon using a mask |
| 06/29/2004 | US6755734 Fan filter unit control system and clean room provided with same |
| 06/29/2004 | US6755718 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 06/29/2004 | US6755603 Apparatus for and method of transporting substrates to be processed |
| 06/29/2004 | US6755602 Wafer transport pod with linear door opening mechanism |
| 06/29/2004 | US6755579 Developer having substrate oscillating system and method of developing process |
| 06/29/2004 | US6755229 Method for preparing high performance ball grid array board and jig applicable to said method |
| 06/29/2004 | US6755221 Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same |
| 06/29/2004 | US6755092 Conveying device |
| 06/29/2004 | US6755069 Method and tooling for z-axis offset of lead frames |
| 06/29/2004 | US6754980 For cleaning semiconductor substrates |
| 06/29/2004 | US6754975 Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage |
| 06/29/2004 | US6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated |
| 06/29/2004 | US6754950 Electronic component and method of production thereof |
| 06/29/2004 | US6754949 Method and apparatus for manufacturing electronic parts |
| 06/29/2004 | CA2359048C A regionally time multiplexed emulation system |
| 06/29/2004 | CA2326093C Wafer holder for semiconductor manufacturing apparatus |
| 06/29/2004 | CA2252407C Flexible integrated circuit package |
| 06/29/2004 | CA2101293C Articulating endoscopic surgical apparatus |
| 06/24/2004 | WO2004054339A1 Method for supplying solder |
| 06/24/2004 | WO2004054006A1 Led and fabrication method thereof |
| 06/24/2004 | WO2004054005A1 Thin film transistor array panel for x-ray detector |
| 06/24/2004 | WO2004054004A1 End face sensor and method of producing the same |
| 06/24/2004 | WO2004054003A1 High efficiency, monolithic multijunction solar cells containing lattice-mismatched materials and methods of forming same |
| 06/24/2004 | WO2004054000A1 Trench mosfet having implanted drain-drift region and process for manufacturing the same |
| 06/24/2004 | WO2004053998A1 Insulated gate semiconductor device and method of making the same |
| 06/24/2004 | WO2004053997A1 Method for forming a dielectric stack |
| 06/24/2004 | WO2004053995A2 Solid-state circuit assembly |
| 06/24/2004 | WO2004053994A2 Buffer layer comprising quaternary and ternary alloys in semiconductor devices |
| 06/24/2004 | WO2004053993A1 Power integrated circuits |
| 06/24/2004 | WO2004053992A2 Shallow trench isolation in floating gate devices |
| 06/24/2004 | WO2004053991A1 Ferroelectric capacitor and its manufacturing method |
| 06/24/2004 | WO2004053986A1 High density package interconnect power and ground strap and method therefor |
| 06/24/2004 | WO2004053982A2 Semiconductor memory and fabrication method |
| 06/24/2004 | WO2004053981A1 Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 06/24/2004 | WO2004053980A1 Method for reducing contact defects in semiconductor cells |
| 06/24/2004 | WO2004053979A1 A method for depositing a metal layer on a semiconductor interconnect structure having a capping layer |
| 06/24/2004 | WO2004053978A1 Method for cleaning a metal surface by a dry-etching step |
| 06/24/2004 | WO2004053977A1 Method for the production of an integrated circuit arrangement comprising a metal nitride layer and integrated circuit arrangement |
| 06/24/2004 | WO2004053975A1 Chip-on-film and its methods of manufacturing by electro-forming |
| 06/24/2004 | WO2004053974A1 Spacer winding device in electronic parts packaging film carrier tape processing device, and spacer winding method in electronic parts packaging film carrier tape processing device |
| 06/24/2004 | WO2004053973A1 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 06/24/2004 | WO2004053972A1 Lead frame and the same manufacturing method using electroforming |
| 06/24/2004 | WO2004053971A1 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
| 06/24/2004 | WO2004053970A1 Stripping composition for removing a photoresist and method of manufacturing tft substrate for a liquid crystal display device using the same |
| 06/24/2004 | WO2004053969A1 Cluster type asher equipment used for manufacture of semiconductor device |
| 06/24/2004 | WO2004053968A1 Slurry composition for secondary polishing of silicon wafer |
| 06/24/2004 | WO2004053967A1 Semiconductor apparatus, wiring board forming method, and substrate treatment apparatus |
| 06/24/2004 | WO2004053966A1 Polishing method |
| 06/24/2004 | WO2004053965A1 Free standing substrates by laser-induced decoherency and regrowth |
| 06/24/2004 | WO2004053964A1 A method for making a semiconductor device having an ultra-thin high-k gate dielectric |
| 06/24/2004 | WO2004053963A1 Damascene gate process with sacrificial oxide in semiconductor devices |
| 06/24/2004 | WO2004053962A1 Process for producing crystalline thin film |
| 06/24/2004 | WO2004053961A1 Manufacturing process for a multilayer structure |
| 06/24/2004 | WO2004053960A1 Method of producing an n-type diamond with high electrical conductivity |
| 06/24/2004 | WO2004053958A1 Exposure apparatus and method for manufacturing device |
| 06/24/2004 | WO2004053949A1 Ferroelectric capacitor and process for its manufacture |
| 06/24/2004 | WO2004053948A2 Air gap dual damascene process and structure |
| 06/24/2004 | WO2004053947A2 Titanium silicon nitride (tisin) barrier layer for copper diffusion |
| 06/24/2004 | WO2004053946A2 System and method for suppression of wafer temperature drift in cold-wall cvd system |
| 06/24/2004 | WO2004053945A2 Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation |
| 06/24/2004 | WO2004053944A2 Fast localization of electrical failures on an integrated circuit system and method |
| 06/24/2004 | WO2004053939A2 Integrated circuit structure with improved ldmos design |
| 06/24/2004 | WO2004053937A2 Scalable nano-transistor and memory using back-side trapping |
| 06/24/2004 | WO2004053936A2 Multi-layer gate stack |
| 06/24/2004 | WO2004053929A2 Semiconductor nanocrystal heterostructures |
| 06/24/2004 | WO2004053928A2 Methods of measuring integrated circuit structure and preparation thereof |
| 06/24/2004 | WO2004053926A2 A method for depositing a metal layer on a semiconductor interconnect structure |