Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/29/2004US6756255 CMOS process with an integrated, high performance, silicide agglomeration fuse
06/29/2004US6756252 Multilayer laser trim interconnect method
06/29/2004US6756251 Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture
06/29/2004US6756246 Method for fabricating III-V group compound semiconductor
06/29/2004US6756244 Interconnect structure
06/29/2004US6756243 Method and apparatus for cascade control using integrated metrology
06/29/2004US6756242 Method of modifying an integrated circuit
06/29/2004US6756241 Method of manufacturing semiconductor device and system for manufacturing the same
06/29/2004US6756240 Methods of increasing write selectivity in an MRAM
06/29/2004US6756239 Method for constructing a magneto-resistive element
06/29/2004US6756236 Method of producing a ferroelectric memory and a memory device
06/29/2004US6756235 Metal oxide film formation method and apparatus
06/29/2004US6756224 Device for receiving a chip shaped carrier and process for assembling a plurality of such devices
06/29/2004US6756184 Depositing an under bump metallurgy over semiconductor device onto contact pad; depositing and patterning a photoresist layer; depositing electrically conductive materials; removing photoresist; applying flux agent; heating, electroless plating
06/29/2004US6756179 A positive resist comprising: a resin capable of decomposing by the action of an acid to increase solubility in an alkali developer, and a compound capable of generating aromatic sulfonic acid substituted with a fluorine containing group
06/29/2004US6756178 Novolak resin containing at least 20% by mole of a m-cresol repeating unit and having a 1- ethoxyethyl group substituting for part of hydrogen atoms of phenolic hydroxyl groups, (b) a quinonediazide ester of, and (c) 1,1-bis(4-hydroxyphenyl)
06/29/2004US6756168 Determining exposure time of wafer photolithography process
06/29/2004US6756162 Stencil mask for high- and ultrahigh-energy implantation
06/29/2004US6756160 Tunable optics transmission; lithography wavelengths; attenuation phase shifting
06/29/2004US6756159 Method of preparing exposure data and method of preparing aperture mask data
06/29/2004US6756132 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
06/29/2004US6756086 Method for the fabrication of a diamond semiconductor
06/29/2004US6756085 Ultraviolet curing processes for advanced low-k materials
06/29/2004US6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
06/29/2004US6755984 Micro-casted silicon carbide nano-imprinting stamp
06/29/2004US6755957 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization
06/29/2004US6755946 Clamshell apparatus with dynamic uniformity control
06/29/2004US6755945 Sealing substrate within an enclosure; applying voltage; process control
06/29/2004US6755944 Ion beam deposition targets having an interlocking interface and a replaceable insert
06/29/2004US6755935 Plasma processing apparatus
06/29/2004US6755934 Dry gas is jetted into a chamber provided with a lid for opening and closing the chamber, inner pressure of which is reduced, to blow up particles staying in the chamber and discharged through the duct while counting blown particles
06/29/2004US6755932 Plasma processing system and apparatus and a sample processing method
06/29/2004US6755909 Method of crystallizing amorphous silicon using a mask
06/29/2004US6755734 Fan filter unit control system and clean room provided with same
06/29/2004US6755718 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
06/29/2004US6755603 Apparatus for and method of transporting substrates to be processed
06/29/2004US6755602 Wafer transport pod with linear door opening mechanism
06/29/2004US6755579 Developer having substrate oscillating system and method of developing process
06/29/2004US6755229 Method for preparing high performance ball grid array board and jig applicable to said method
06/29/2004US6755221 Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
06/29/2004US6755092 Conveying device
06/29/2004US6755069 Method and tooling for z-axis offset of lead frames
06/29/2004US6754980 For cleaning semiconductor substrates
06/29/2004US6754975 Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage
06/29/2004US6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
06/29/2004US6754950 Electronic component and method of production thereof
06/29/2004US6754949 Method and apparatus for manufacturing electronic parts
06/29/2004CA2359048C A regionally time multiplexed emulation system
06/29/2004CA2326093C Wafer holder for semiconductor manufacturing apparatus
06/29/2004CA2252407C Flexible integrated circuit package
06/29/2004CA2101293C Articulating endoscopic surgical apparatus
06/24/2004WO2004054339A1 Method for supplying solder
06/24/2004WO2004054006A1 Led and fabrication method thereof
06/24/2004WO2004054005A1 Thin film transistor array panel for x-ray detector
06/24/2004WO2004054004A1 End face sensor and method of producing the same
06/24/2004WO2004054003A1 High efficiency, monolithic multijunction solar cells containing lattice-mismatched materials and methods of forming same
06/24/2004WO2004054000A1 Trench mosfet having implanted drain-drift region and process for manufacturing the same
06/24/2004WO2004053998A1 Insulated gate semiconductor device and method of making the same
06/24/2004WO2004053997A1 Method for forming a dielectric stack
06/24/2004WO2004053995A2 Solid-state circuit assembly
06/24/2004WO2004053994A2 Buffer layer comprising quaternary and ternary alloys in semiconductor devices
06/24/2004WO2004053993A1 Power integrated circuits
06/24/2004WO2004053992A2 Shallow trench isolation in floating gate devices
06/24/2004WO2004053991A1 Ferroelectric capacitor and its manufacturing method
06/24/2004WO2004053986A1 High density package interconnect power and ground strap and method therefor
06/24/2004WO2004053982A2 Semiconductor memory and fabrication method
06/24/2004WO2004053981A1 Method of cutting semiconductor wafer and protective sheet used in the cutting method
06/24/2004WO2004053980A1 Method for reducing contact defects in semiconductor cells
06/24/2004WO2004053979A1 A method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
06/24/2004WO2004053978A1 Method for cleaning a metal surface by a dry-etching step
06/24/2004WO2004053977A1 Method for the production of an integrated circuit arrangement comprising a metal nitride layer and integrated circuit arrangement
06/24/2004WO2004053975A1 Chip-on-film and its methods of manufacturing by electro-forming
06/24/2004WO2004053974A1 Spacer winding device in electronic parts packaging film carrier tape processing device, and spacer winding method in electronic parts packaging film carrier tape processing device
06/24/2004WO2004053973A1 Method of packaging integrated circuits, and integrated circuit packages produced by the method
06/24/2004WO2004053972A1 Lead frame and the same manufacturing method using electroforming
06/24/2004WO2004053971A1 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device
06/24/2004WO2004053970A1 Stripping composition for removing a photoresist and method of manufacturing tft substrate for a liquid crystal display device using the same
06/24/2004WO2004053969A1 Cluster type asher equipment used for manufacture of semiconductor device
06/24/2004WO2004053968A1 Slurry composition for secondary polishing of silicon wafer
06/24/2004WO2004053967A1 Semiconductor apparatus, wiring board forming method, and substrate treatment apparatus
06/24/2004WO2004053966A1 Polishing method
06/24/2004WO2004053965A1 Free standing substrates by laser-induced decoherency and regrowth
06/24/2004WO2004053964A1 A method for making a semiconductor device having an ultra-thin high-k gate dielectric
06/24/2004WO2004053963A1 Damascene gate process with sacrificial oxide in semiconductor devices
06/24/2004WO2004053962A1 Process for producing crystalline thin film
06/24/2004WO2004053961A1 Manufacturing process for a multilayer structure
06/24/2004WO2004053960A1 Method of producing an n-type diamond with high electrical conductivity
06/24/2004WO2004053958A1 Exposure apparatus and method for manufacturing device
06/24/2004WO2004053949A1 Ferroelectric capacitor and process for its manufacture
06/24/2004WO2004053948A2 Air gap dual damascene process and structure
06/24/2004WO2004053947A2 Titanium silicon nitride (tisin) barrier layer for copper diffusion
06/24/2004WO2004053946A2 System and method for suppression of wafer temperature drift in cold-wall cvd system
06/24/2004WO2004053945A2 Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation
06/24/2004WO2004053944A2 Fast localization of electrical failures on an integrated circuit system and method
06/24/2004WO2004053939A2 Integrated circuit structure with improved ldmos design
06/24/2004WO2004053937A2 Scalable nano-transistor and memory using back-side trapping
06/24/2004WO2004053936A2 Multi-layer gate stack
06/24/2004WO2004053929A2 Semiconductor nanocrystal heterostructures
06/24/2004WO2004053928A2 Methods of measuring integrated circuit structure and preparation thereof
06/24/2004WO2004053926A2 A method for depositing a metal layer on a semiconductor interconnect structure