Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/24/2004US20040119978 Measuring a property of a layer in multilayered structure
06/24/2004US20040119973 Exposure apparatus inspection method and exposure apparatus
06/24/2004US20040119971 Method and device for surface inspection
06/24/2004US20040119970 Test pattern, inspection method, and device manufacturing method
06/24/2004US20040119963 Exposure apparatus
06/24/2004US20040119962 Projection optical system, exposure apparatus incorporating this projection optical system, and manufacturing method for micro devices using the exposure apparatus
06/24/2004US20040119961 Illumination system with variable adjustment of the illumination
06/24/2004US20040119960 Scanning exposure apparatus and method
06/24/2004US20040119958 Lithographic apparatus, computer program, device manufacturing method, and device manufactured thereby
06/24/2004US20040119956 Distortion measurement method and exposure apparatus
06/24/2004US20040119954 Exposure apparatus and method
06/24/2004US20040119899 Wiring structure, method for manufacturing the same, electro-optical device, and electronic device
06/24/2004US20040119898 Vertical alignment mode liquid crystal display
06/24/2004US20040119897 Liquid crystal display device and method of fabricating the same
06/24/2004US20040119865 Solid image capturing element for power saving at output section and manufacturing method for the same
06/24/2004US20040119749 User interface for wafer data analysis and visualization
06/24/2004US20040119592 Container for wafer-like objects
06/24/2004US20040119490 Parallel, individually addressable probes for nanolithography
06/24/2004US20040119487 Test board for testing IC package and tester calibration method using the same
06/24/2004US20040119468 Method and apparatus for metrological process control implementing complimentary sensors
06/24/2004US20040119399 Organic electroluminescence display and method of fabricating the same
06/24/2004US20040119240 Sealing mechanism for sealing a vacuum chamber
06/24/2004US20040119173 Packages for semiconductor die
06/24/2004US20040119172 integrated circuits(IC), comprising dies conected to electroconductive cores having dielectric coatings applied by plasma enhanced/chemical vapor deposition
06/24/2004US20040119171 [flip-chip substrate and flip-chip bonding process thereof]
06/24/2004US20040119170 reduced chance of a short occurring between the conductive layers and the self-aligned contact
06/24/2004US20040119167 Semiconductor device having an active region whose width varies
06/24/2004US20040119166 Semiconductor device and method of manufacturing the same
06/24/2004US20040119164 Semiconductor device and its manufacturing method
06/24/2004US20040119163 Method of making semiconductor devices using carbon nitride, a low-dielectric-constant hard mask and/or etch stop
06/24/2004US20040119161 Package for housing semiconductor chip, fabrication method thereof and semiconductor device
06/24/2004US20040119160 Programmable multi-chip module
06/24/2004US20040119159 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge
06/24/2004US20040119156 Electronic circuit assembly having high contrast fiducial
06/24/2004US20040119154 Flip chip fet device
06/24/2004US20040119151 Pre-applied underfill
06/24/2004US20040119149 Grounded embedded flip chip RF integrated circuit
06/24/2004US20040119146 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
06/24/2004US20040119145 Method for depositing a very high phosphorus doped silicon oxide film
06/24/2004US20040119142 Process for manufacturing integrated resistive elements with silicidation protection
06/24/2004US20040119139 Semiconductor device having a redundancy function
06/24/2004US20040119137 Resistive structure integrated in a semiconductor substrate
06/24/2004US20040119136 Bipolar transistor having a majority-carrier accumulation layer as subcollector
06/24/2004US20040119135 Trench isolation structure for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same
06/24/2004US20040119134 Method for forming a passivation layer for air gap formation and structure thereof
06/24/2004US20040119133 Semiconductor device
06/24/2004US20040119132 Dielectric separation type semiconductor device and method of manufacturing the same
06/24/2004US20040119131 Physical vapor deposition on targets comprising Ti and Zr; and methods of use
06/24/2004US20040119128 Integration system via metal oxide conversion
06/24/2004US20040119125 Semiconductor structure and method of manufacture
06/24/2004US20040119124 Semiconductor device and manufacturing method for silicon oxynitride film
06/24/2004US20040119123 Gas insulated gate field effect transistor
06/24/2004US20040119122 Semiconductor device with localized charge storage dielectric and method of making same
06/24/2004US20040119121 Semiconductor device and method of manufacturing the same
06/24/2004US20040119120 MOSFET for an open-drain circuit and semiconductor integrated circuit device employing it
06/24/2004US20040119119 Substrate-biased silicon diode for electrostatic discharge protection and fabrication method
06/24/2004US20040119117 Buried-gate-type semiconductor device
06/24/2004US20040119116 Array of pull-up transistors for high voltage output circuit
06/24/2004US20040119115 Nitride-encapsulated FET (NNCFET)
06/24/2004US20040119113 Programmable memory transistor
06/24/2004US20040119112 Multi-level memory cell with lateral floating spacers
06/24/2004US20040119111 Non-volatile semiconductor memory device and manufacturing method for the same
06/24/2004US20040119110 Non-volatile memory cells having floating gate and method of forming the same
06/24/2004US20040119109 Non-volatile memory device having improved programming and erasing characteristics and method of fabricating the same
06/24/2004US20040119108 Silicon nitride read-only-mrmory and fabricating method thereof
06/24/2004US20040119107 Fabrication method and structure of semiconductor non-volatile memory device
06/24/2004US20040119106 Structure with programming injector in split gate flash
06/24/2004US20040119105 Ferroelectric memory
06/24/2004US20040119102 Self-aligned isolation double-gate FET
06/24/2004US20040119101 Contact layout for MOSFETs under tensile strain
06/24/2004US20040119100 Dense dual-plane devices
06/24/2004US20040119098 Method for fabrication of semiconductor device
06/24/2004US20040119097 Integrated chip package structure using organic substrate and method of manufacturing the same
06/24/2004US20040119096 Method and apparatus for reducing fixed charge in semiconductor device layers
06/24/2004US20040119095 Magnetic shield for integrated circuit packaging
06/24/2004US20040119094 Semiconductor circuit regulator
06/24/2004US20040119092 Semiconductor device
06/24/2004US20040119091 Semiconductor device and method of manufacturing the same
06/24/2004US20040119090 GaAs semiconductor device
06/24/2004US20040119088 surface roughness of the substrate is defined as a ratio between a substantial area and a projected area; polishing and wet-etching a backside surface of the substrate mechanically with using predetermined abrasive grains
06/24/2004US20040119082 Nitride based semiconductor light-emitting device and method of manufacturing the same
06/24/2004US20040119081 Semiconductor Laser device
06/24/2004US20040119076 Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors and methods of fabricating vertical JFET limited silicon carbide metal- oxide semiconductor field effect transistors
06/24/2004US20040119074 Thin film transistor liquid crystal display and fabrication method thereof
06/24/2004US20040119072 Method of forming a thin film transistor
06/24/2004US20040119067 Gallium nitride materials and methods
06/24/2004US20040119065 Semiconductor device and semiconductor device data write method
06/24/2004US20040119063 Gallium nitride-based devices and manufacturing process
06/24/2004US20040119062 Self-organized nanometer interface structure and its applications in electronic and opto-electronic devices
06/24/2004US20040119055 useful as phase shifters, matching networks, oscillators, filters, resonators, and antennas containing interdigital and trilayer capacitors, coplanar waveguides and microstrips.
06/24/2004US20040119036 System and method for lithography process monitoring and control
06/24/2004US20040119029 Exposure apparatus and exposure method
06/24/2004US20040119026 Electron beam exposure equipment and electron beam exposure method
06/24/2004US20040119025 Boron ion delivery system
06/24/2004US20040119023 Electron beam apparatus and a device manufacturing method by using said electron beam apparatus
06/24/2004US20040119006 Neutral particle beam processing apparatus
06/24/2004US20040118980 Safety system for overhead transport vehicle
06/24/2004US20040118834 Microwave plasma process device, plasma ignition method, plasma forming method, and plasma process method
06/24/2004US20040118825 Laser separated die with tapered sidewalls for improved light extraction
06/24/2004US20040118821 Chip scale marker and marking method