Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/24/2004US20040121577 Method for providing a dummy feature and structure thereof
06/24/2004US20040121576 Process for bonding solder bumps to a substrate
06/24/2004US20040121575 Method of manufacturing semiconductor device with buried conductive lines
06/24/2004US20040121574 Method for forming bit lines of semiconductor device
06/24/2004US20040121573 Method for forming enhanced areal density split gate field effect transistor device array
06/24/2004US20040121572 Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
06/24/2004US20040121571 Semiconductor device and a method of manufacturing the same
06/24/2004US20040121570 Methods of fabricating contacts for semiconductor devices utilizing a pre-flow process and devices made thereby
06/24/2004US20040121569 Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates
06/24/2004US20040121567 Doping method and semiconductor device fabricated using the method
06/24/2004US20040121566 Method to produce low leakage high K materials in thin film form
06/24/2004US20040121565 Method of manufacturing a field effect transistor
06/24/2004US20040121564 Method of forming semiconductor devices through epitaxy
06/24/2004US20040121563 Method for fabricating encapsulated semiconductor components having conductive vias
06/24/2004US20040121562 Method for manufacturing a semiconductor device having multiple laminated layers of different materials
06/24/2004US20040121561 Method of forming electronic dies wherein each die has a layer of solid diamond
06/24/2004US20040121560 Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
06/24/2004US20040121559 Method and apparatus for continuous formation and lift-off of porous silicon layers
06/24/2004US20040121558 Wafer and method of producing a substrate by transfer of a layer that includes foreign species
06/24/2004US20040121557 Method of smoothing the outline of a useful layer of material transferred onto a support substrate
06/24/2004US20040121556 Thinning techniques for wafer-to-wafer vertical stacks
06/24/2004US20040121555 Shallow trench isolation process
06/24/2004US20040121554 Fabrication method and device structure of shallow trench insulation for silicon wafer containing silicon-germanium
06/24/2004US20040121553 Semiconductor device using shallow trench isolation and method of fabricating the same
06/24/2004US20040121552 Method of forming trench in semiconductor device
06/24/2004US20040121551 Angled wafer rotating ion implantation
06/24/2004US20040121550 Method for creating barriers to metal contamination in silicon oxides
06/24/2004US20040121549 Self-aligned planar double-gate process by amorphization
06/24/2004US20040121548 Methods of fabricating multiple sets of field effect transistors
06/24/2004US20040121547 Structures of high voltage device and low voltage device, and method of manufacturing the same
06/24/2004US20040121546 Vertical transistor and method of manufacturing thereof
06/24/2004US20040121545 Method to fabricate a square word line poly spacer
06/24/2004US20040121544 High-k tunneling dielectric for read only memory device and fabrication method thereof
06/24/2004US20040121543 Method of manufacturing semiconductor device
06/24/2004US20040121542 SiN ROM AND METHOD OF FABRICATING THE SAME
06/24/2004US20040121541 Integrating n-type and p-type metal gate transistors
06/24/2004US20040121540 Stacked gate flash memory device and method of fabricating the same
06/24/2004US20040121539 Non-volatile semiconductor memory device and manufacturing method for the same
06/24/2004US20040121538 Flash memory device and a fabrication process thereof, method of forming a dielectric film
06/24/2004US20040121537 [mask rom structure and manufacturing method thereof]
06/24/2004US20040121536 [structure of flash memory device and fabrication method thereof]
06/24/2004US20040121533 Single polysilicon process for dram
06/24/2004US20040121532 Trench in semiconductor device and formation method thereof
06/24/2004US20040121531 Method of removing features using an improved removal process in the fabrication of a semiconductor device
06/24/2004US20040121530 Process for producing a photoelectric conversion device
06/24/2004US20040121529 Method of forming a buffer dielectric layer in a semiconductor device and a method of manufacturing a thin film transistor using the same
06/24/2004US20040121527 A Method Of Structuring Of A Substrate
06/24/2004US20040121526 Fabrication process of a semiconductor integrated circuit device
06/24/2004US20040121524 Apparatus and method for controlling diffusion
06/24/2004US20040121523 Matrix substrate, electronic apparatus, electro-optic apparatus, and electronic unit
06/24/2004US20040121522 Metal redistribution layer traces in an integrated circuit die.
06/24/2004US20040121521 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies
06/24/2004US20040121519 Method of balanced coefficient of thermal expansion for flip chip ball grid array
06/24/2004US20040121518 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
06/24/2004US20040121517 Placement tool for wafer scale caps
06/24/2004US20040121516 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
06/24/2004US20040121515 Programmable multi-chip module
06/24/2004US20040121514 Protective tape removing apparatus and method of assembling semiconductor package using the same
06/24/2004US20040121513 Die bonding apparatus and method of die bonding with the apparatus
06/24/2004US20040121512 Surface treatment for microelectronic device substrate
06/24/2004US20040121511 Packaging of a microchip device-I
06/24/2004US20040121509 Nanowire filament
06/24/2004US20040121508 Large organic devices and methods of fabricating large organic devices
06/24/2004US20040121507 Semiconductor devices with reduced active region deffects and unique contacting schemes
06/24/2004US20040121502 Electrophoretic processes for the selective deposition of materials on a semiconducting device
06/24/2004US20040121501 Low dielectric constant interconnect insulator having fullerene additive
06/24/2004US20040121500 Optical device and method of manufacture thereof
06/24/2004US20040121495 Dynamic adaptive sampling rate for model prediction
06/24/2004US20040121494 Infrared thermopile detector system for semiconductor process monitoring and control
06/24/2004US20040121493 Chip scale marker and method of calibrating marking position
06/24/2004US20040121492 Ferroelectric thin film and method for forming the same
06/24/2004US20040121267 Method of fabricating lead-free solder bumps
06/24/2004US20040121265 a low-density oxide layer is formed on the low-k dielectric layer, for example by converting an upper portion thereof into an oxide so that prior to and during the formation of the cap layer, out-gassing of volatile materials is enhanced
06/24/2004US20040121260 copolymer of optionally substituted anthracen-9-ylalkyl (meth)acrylate and optionally substituted benzophenone-, diphenylsulfone or diphenyl sulfoxide (meth)acrylate; superior film formation characteristics, while maintaining good light absorption
06/24/2004US20040121259 a resin; a crosslinking agent; and a nitrogen-containing compound; manufacturing a semiconductor
06/24/2004US20040121247 Projection lithography photomasks and method of making
06/24/2004US20040121245 Exposure method, exposure mask, and exposure apparatus
06/24/2004US20040121166 Semiconductor device and manufacturing method thereof
06/24/2004US20040121139 Composition for preparing porous dielectric thin film containing saccharides porogen
06/24/2004US20040121086 Shortening the time required for depositing thin films by flowing gas inside the chamber to heat the substrate through heat exchange with the gas, then evacuating the chamber; for plasma enhanced chemical vapor deposition
06/24/2004US20040121085 Method and apparatus for forming a high quality low temperature silicon nitride film
06/24/2004US20040121074 Method for metal oxide thin film deposition via MOCVD
06/24/2004US20040121069 lithography; accurately matching up the defect location; focused ion beam systems
06/24/2004US20040120797 Method and system for eliminating wafer protrusion
06/24/2004US20040120458 Method of fabricating an optical element, lithographic apparatus and device manufacturing method
06/24/2004US20040120212 Data transfer system capable of transferring data at high transfer speed
06/24/2004US20040120209 Semiconductor memory device supporting two data ports
06/24/2004US20040120201 Semiconductor apparatus
06/24/2004US20040120198 Method for providing bitline contacts in a memory cell array and a memory cell array having bitline contacts
06/24/2004US20040120188 Novel two-transistor flash cell for large endurance application
06/24/2004US20040120181 Semiconductor device
06/24/2004US20040120179 Semiconductor memory device and semiconductor device
06/24/2004US20040120127 Compact circuit module having high mounting accuracy and method of manufacturing the same
06/24/2004US20040120097 Methods of forming metal-insulator-metal capacitors
06/24/2004US20040120095 Electrostatic chuck support mechanism, support stand device and plasma processing equipment
06/24/2004US20040120090 Half-bridge high voltage gate driver providing protectin of a transistor
06/24/2004US20040120087 Semiconductor device including a plurality of power domains
06/24/2004US20040120085 Semiconductor device with surge protection circuit
06/24/2004US20040120044 Optical reduction system with control of illumination polarization
06/24/2004US20040119985 Method for measuring height of sphere or hemisphere