| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/17/2004 | US20040113170 Light emitting diode |
| 06/17/2004 | US20040113169 III group nitride compound semiconductor luminescent element |
| 06/17/2004 | US20040113161 Thin-film transistor structure, method for manufacturing the thin-film transistor structure, and display device using the thin-film transistor structure |
| 06/17/2004 | US20040113155 Light-emitting device with reduced lattice mismatch |
| 06/17/2004 | US20040113150 Semiconductor device, display device, and method of manufacturing the same |
| 06/17/2004 | US20040113149 Thin film transistor array panel and manufacturing method thereof |
| 06/17/2004 | US20040113145 Polythiophene polymer |
| 06/17/2004 | US20040113143 Semiconductor device having a lattice-mismatched semiconductor layer on a substrate |
| 06/17/2004 | US20040113142 Semiconductor device and method of manufacturing the same |
| 06/17/2004 | US20040113139 Sublithographic nanoscale memory architecture |
| 06/17/2004 | US20040113138 Stochastic assembly of sublithographic nanoscale interfaces |
| 06/17/2004 | US20040113101 Charged-particle-beam microlithography systems that detect and offset beam-perturbing displacements of optical-column components |
| 06/17/2004 | US20040113098 Structured organic materials and devices using low-energy particle beams |
| 06/17/2004 | US20040113080 Sampling zone, ifnrared light source, controller |
| 06/17/2004 | US20040113069 Method and device for separating ion mass, and ion doping device |
| 06/17/2004 | US20040112944 [solder ball fabricating process] |
| 06/17/2004 | US20040112890 Apparatus for and method of heat treatment by light irradiation |
| 06/17/2004 | US20040112885 Heating device, heat treatment apparatus having the heating device and method for controlling heat treatment |
| 06/17/2004 | US20040112882 Laser processing apparatus |
| 06/17/2004 | US20040112880 Laser machining method |
| 06/17/2004 | US20040112879 Identification-code laser marking method and apparatus |
| 06/17/2004 | US20040112870 Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same |
| 06/17/2004 | US20040112866 Method for recycling a substrate |
| 06/17/2004 | US20040112863 Method of enhancing surface reactions by local resonant heating |
| 06/17/2004 | US20040112860 Method for detecting the end point by using matrix |
| 06/17/2004 | US20040112857 Metal dry etch using electronic field |
| 06/17/2004 | US20040112791 Connector package with anti-adsorption members |
| 06/17/2004 | US20040112759 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 06/17/2004 | US20040112753 Using a perfluoro(sulfone or imidosulfone)compound |
| 06/17/2004 | US20040112742 Apparatus for analyzing a substrate employing a copper decoration |
| 06/17/2004 | US20040112738 Single workpiece processing system |
| 06/17/2004 | US20040112735 Pulsed magnetron for sputter deposition |
| 06/17/2004 | US20040112715 Conveyor system |
| 06/17/2004 | US20040112636 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/17/2004 | US20040112633 Electronic device module |
| 06/17/2004 | US20040112631 Underfilling material for semiconductor package |
| 06/17/2004 | US20040112544 Magnetic mirror for preventing wafer edge damage during dry etching |
| 06/17/2004 | US20040112543 Plasma reactor with high selectivity and reduced damage |
| 06/17/2004 | US20040112541 Plasma processor and plasma processing method |
| 06/17/2004 | US20040112540 Uniform etch system |
| 06/17/2004 | US20040112539 Uniform etch system |
| 06/17/2004 | US20040112538 Gas distribution system with tuning gas |
| 06/17/2004 | US20040112537 Plasma treatment apparatus and method for plasma treatment |
| 06/17/2004 | US20040112536 Plasma processing apparatus and method |
| 06/17/2004 | US20040112410 Substrate treating apparatus and substrate treating method |
| 06/17/2004 | US20040112409 Cleaning solution; controlling fluoride concentration; rsupercritical solution; emoval residues afteretching of semiconductor |
| 06/17/2004 | US20040112406 Solid CO2 cleaning |
| 06/17/2004 | US20040112405 Method and apparatus for cleaning a semiconductor substrate |
| 06/17/2004 | US20040112404 Cleaning tank; power sources; intake pipes; contactor membrane; changing concentration of nitrogen gas; semiconductor wafer smoothness aftertreatment |
| 06/17/2004 | US20040112402 Surface cleaning; heat exchanging; holding semiconductor; heating, cooling cycles |
| 06/17/2004 | US20040112294 Magnetic mirror for protection of consumable parts during plasma processing |
| 06/17/2004 | US20040112293 Semiconductor device production apparatus, and semiconductor device production method employing the same |
| 06/17/2004 | US20040112292 Plasma apparatus and production method thereof |
| 06/17/2004 | US20040112290 Apparatus for forming film in semiconductor process and method for feeding gas into the same apparatus |
| 06/17/2004 | US20040112289 Thin-film deposition apparatus and method for rapidly switching supply of source gases |
| 06/17/2004 | US20040112279 Framework assisted crystal growth |
| 06/17/2004 | US20040112164 Alignment apparatus, exposure apparatus, and device manufacturing method |
| 06/17/2004 | US20040112153 Method and system for determining characteristics of substrates employing fluid geometries |
| 06/17/2004 | US20040112142 Test kit for semiconductor package and method for testing semiconductor package using the same |
| 06/17/2004 | US20040111882 Process for producing a printed wiring board-forming sheet and multi-layered printed wiring board |
| 06/17/2004 | US20040111875 Method and placement system for populating a substrate with electronic components |
| 06/17/2004 | DE202004004487U1 Transfer device for handling/processing centers for substrates in clean room systems comprises transfer chambers forming one construction unit having a slide with separating floors forming the axial boundary of the transfer chambers |
| 06/17/2004 | DE19821338B4 Transportsystem und Verfahren zum Transportieren von Gegenständen in einen Arbeitsraum hinein oder aus einem Arbeitsraum heraus Transport system and method for transporting goods from one work area or out of a working space out |
| 06/17/2004 | DE19713090B4 Verfahren und Apparatur zum Ätzen von Silicium-Materialien Method and apparatus for etching silicon materials |
| 06/17/2004 | DE19654791B4 Verfahren und Vorrichtung zum Trennen einer Halbleiterschicht von einem Substrat Method and apparatus for separating a semiconductor layer from a substrate |
| 06/17/2004 | DE19608683B4 Verfahren zum Herstellen eines Substrates A method for manufacturing a substrate |
| 06/17/2004 | DE19509203B4 Halbleitervorrichtung mit einer mehrschichtigen Zwischenverbindungsstruktur und Verfahren zu ihrer Herstellung A semiconductor device having a multilayer interconnection structure and methods for their preparation |
| 06/17/2004 | DE10356097A1 Seitenwandsperrschichtstruktur und Herstellungsverfahren Sidewall barrier structure and manufacturing method |
| 06/17/2004 | DE10355068A1 Integriertes Schaltkreispackage mit vergrößerter Chip-Klebefläche Integrated circuit package with increased chip bonding surface |
| 06/17/2004 | DE10355065A1 Verfahren zum Vergießen mit Harz, Verwendung des genannten Verfahrens zum Herstellen eines Halbleiterbauteils sowie Harzmaterial für das Verfahren A method for encapsulating with resin, the use of said method for producing a semiconductor device as well as resin material for the process |
| 06/17/2004 | DE10354937A1 Prozess zur Abscheidung von Aluminium in drei Schichten für einen Kontakt mit einem grossen Aspektverhältnis Process for the deposition of aluminum in three layers for contact with a large aspect ratio |
| 06/17/2004 | DE10353771A1 Halbleiterbauelement mit Tiefgrabenisolierung und Verfahren zu seiner Herstellung A semiconductor device with low grave isolation and process for its preparation |
| 06/17/2004 | DE10351924A1 Durchkontaktierungssubstrat und ein Verfahren zur Herstellung eines Durchkontaktierungssubstrats Durchkontaktierungssubstrat and a method for producing a Durchkontaktierungssubstrats |
| 06/17/2004 | DE10349692A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 06/17/2004 | DE10338984A1 Betriebsverfahren für ein Flash-Speicherbauelement mit SONOS-Zellen A method of operating a flash memory device with SONOS cells |
| 06/17/2004 | DE10335391A1 Herstellungsverfahren für ein Flash-Speicherbauteil Manufacturing method for a flash memory device |
| 06/17/2004 | DE10335118A1 Halbleitervorrichtung Semiconductor device |
| 06/17/2004 | DE10327618A1 Verfahren zur Ausbildung von Aluminiummetallverdrahtungen Process for the formation of aluminum metal wirings |
| 06/17/2004 | DE10259376A1 Halbleiterherstellungsvorrichtung A semiconductor manufacturing apparatus |
| 06/17/2004 | DE10258732A1 Optical system for microlithographic projection units for wafers has compensating plate angled to optical path to equalize two linearly polarized components |
| 06/17/2004 | DE10257873B3 Compact memory cell array, includes capacitors in trench with access transistors above them, interconnected by surface- and embedded semiconductor data lines |
| 06/17/2004 | DE10257032A1 Production process for sensor chips in standard plastic housings, involves packing chip with sensor element into the housing and exposing sensor element using a laser |
| 06/17/2004 | DE10256945A1 Elektronisches Bauelement mit mehreren Chips und Verfahren zur Herstellung An electronic component having a plurality of chips and processes for making |
| 06/17/2004 | DE10256428A1 Structuring surface of electrically conducting semiconductor material comprises applying metal mask on surface of semiconductor material, anodically oxidizing regions not protected, and further processing |
| 06/17/2004 | DE10255936A1 Verbesserte Technik zur Herstellung eines Oxid/Nitrid-Schicht-Stapels durch Steuern der Stickstoffionenkonzentration in einem Nitrierungsplasma Improved technique for producing an oxide / nitride layer stack by controlling the nitrogen ions in a concentration Nitrierungsplasma |
| 06/17/2004 | DE10255889A1 Manufacture of an electrostatic holding body containing a pedestal, carrying a film system useful in the semiconductor industry |
| 06/17/2004 | DE10255870A1 A process for preparation of layers from a layer material on organic semiconductor layers useful in the production of organic field effect transistors with top-contact architecture from conductive polymers |
| 06/17/2004 | DE10255866A1 An etching process for increasing the structural size of main structures in a semiconductor substrate useful in semiconductor wafer production for increasing their structural density (thickness, sic) and storage capacity |
| 06/17/2004 | DE10255865A1 A process for structuring dielectric layers on a semiconductor substrate and for etching of small diameter contact holes and drains with high precision |
| 06/17/2004 | DE10255850A1 Signalschicht zur Generierung charakteristischer optischer Plasmaemissionen Signal layer for generating plasma optical emission characteristic |
| 06/17/2004 | DE10255849A1 Verbesserte Drain/Source-Erweiterungsstruktur eines Feldeffekttransistors mit dotierten Seitenwandabstandselementen mit großem ε Improved drain / source extension structure of a field-effect transistor with doped sidewall spacers with large ε |
| 06/17/2004 | DE10255841A1 Process for structuring ruthenium or ruthenium (IV) oxide layers used for a trench capacitor comprises depositing ruthenium or ruthenium (IV) oxide on sections of a substrate, depositing a covering layer, and further processing |
| 06/17/2004 | DE10255835A1 Microelectronic component e.g. FET for high density memory, has low ohmic tungsten nitride barrier layer |
| 06/17/2004 | DE10255830A1 Method for mfr of semiconductor component controllable by field effects, e.g. various types of field effect transistors, such as N-channel MOSFETs, double diffused MOSFETs (DMOSFETS) etc., contg. semiconductor body with channel zone |
| 06/17/2004 | DE10255652A1 Grinding pad for wet-chemical grinding of a substrate surface comprises a polymer matrix consisting of polymers with repetition units and incorporating embedded abrasive particles |
| 06/17/2004 | DE10255626A1 Verfahren und Vorrichtung zum Anordnen von Kontaktierungselementen von Bauelementen eines integrierten Schaltkreises, Computerlesbares Speichermedium und Programm-Element Method and apparatus for disposing of contacting of components of an integrated circuit, computer readable storage medium and program element |
| 06/17/2004 | DE10255520A1 Production of conductor strips for electronic components comprises forming a liquid film with a liquid having electrically conducting particles on the upper surfaces of a circuit carrier or electronic component, and further processing |
| 06/17/2004 | DE10255458A1 Heating assembly for monocrystalline substrate, e.g. sapphire substrate with resistance heater, using secondary heater at partial oxygen |
| 06/17/2004 | DE10254155A1 Mask programmable rom for digital information storage and production process with two memory cell transistors and two row select potential adjusters between them |
| 06/17/2004 | DE10253250A1 Automatic precision alignment method for a semiconductor wafer cutting device in which the wafer is aligned with a virtual line through its center, determined using a key pattern, parallel to the wafer cutting direction |