Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/17/2004US20040114652 Method of forming conductive pattern such as electrode, surface emitting semiconductor laser using this method and manufacturing method for the same
06/17/2004US20040114447 Semiconductor memory device
06/17/2004US20040114443 Magnetic memory device, write current drive circuit, and write current drive method
06/17/2004US20040114442 Semiconductor memory
06/17/2004US20040114438 Semiconductor memory device and erase method for memory array
06/17/2004US20040114436 Programmable interconnect cell for configuring a field programmable gate array
06/17/2004US20040114433 Programmable fuse and antifuse and method therefor
06/17/2004US20040114428 Nonvolatile memory cell and non-volatile semiconductor memory device
06/17/2004US20040114426 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
06/17/2004US20040114425 Magnetic memory device, method for writing on the same and method for reading from the same
06/17/2004US20040114422 SRAM cell and integrated memory circuit using the same
06/17/2004US20040114421 DRAM Circuit and its Operation Method
06/17/2004US20040114411 Content addressable memory capable of stably storing ternary data
06/17/2004US20040114310 Electrolytic capacitors and method for making them
06/17/2004US20040114294 [structure for preventing burnt fuse pad from further electrical connection]
06/17/2004US20040114275 Magnetoresistive effect element, magnetic memory device and method of fabricating the same
06/17/2004US20040114217 Objective with pupil obscuration
06/17/2004US20040114143 Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection apparatus
06/17/2004US20040114132 Test pattern, inspection method, and device manufacturing method
06/17/2004US20040114124 Chuck, lithographic apparatus and device manufacturing method
06/17/2004US20040114123 Lithographic apparatus and device manufacturing method
06/17/2004US20040114122 Lithographic apparatus and method to determine beam characteristics
06/17/2004US20040114120 Lithographic apparatus, device manufacturing method, and device manufactured thereby
06/17/2004US20040114119 Lithographic apparatus and a measurement system
06/17/2004US20040114117 Lithographic apparatus and device manufacturing method
06/17/2004US20040114116 Moving member mechanism and control method therefor
06/17/2004US20040114088 Electro-optical device
06/17/2004US20040114061 Method for manufacturing electro-optical device, and electro-optical device and electronic device manufactured with this manufacturing method
06/17/2004US20040114059 Thin film transistor array panel for liquid crystal display and method for manufacturing the same
06/17/2004US20040113752 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
06/17/2004US20040113660 Analog/digital mixed integrated circuit
06/17/2004US20040113657 Technique for mitigating gate leakage during a sleep state
06/17/2004US20040113646 Heater-equipped pusher, electronic component handling apparatus, and temperature control method for electronic component
06/17/2004US20040113643 Probe device
06/17/2004US20040113638 Adjustable clamping device; support frame, circuit card, heat exchanger
06/17/2004US20040113444 End effector assembly
06/17/2004US20040113289 Carburetor, various types of devices using the carburetor, and method of vaporization
06/17/2004US20040113287 Anode, cathode of electrolytic cells; thickness distribution in grained pattern ; heat resistance, electroconductivity
06/17/2004US20040113283 Method for fabricating encapsulated semiconductor components by etching
06/17/2004US20040113281 Multi-chip module and method of forming
06/17/2004US20040113279 Integrated circuits; interconnecting layer between substrate and conductive features
06/17/2004US20040113278 Structure and method for reducing thermo-mechanical stress in stacked vias
06/17/2004US20040113277 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
06/17/2004US20040113274 Multilayer;covering surfaces
06/17/2004US20040113273 Under-bump-metallurgy layer for improving adhesion
06/17/2004US20040113272 [bump and fabricating process thereof]
06/17/2004US20040113269 Semiconductor device and method for manufacturing the same
06/17/2004US20040113264 High performance vias for vertical IC packaging
06/17/2004US20040113262 Miniature moldlocks for heatsink or flag for an overmolded plastic package
06/17/2004US20040113261 wiring pattern; connecting terminals via apertures : flip chips
06/17/2004US20040113260 Electronic parts packaging structure and method of manufacturing the same
06/17/2004US20040113259 Method for making a semiconductor package and semiconductor package with integrated circuit chips
06/17/2004US20040113248 Semiconductor device and manufacturing the same
06/17/2004US20040113247 Flip-chip packaging
06/17/2004US20040113244 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
06/17/2004US20040113239 High-speed signaling interface with broadside dynamic wave coupling
06/17/2004US20040113238 Semiconductor device
06/17/2004US20040113236 Semiconductor wafer and method for producing the same
06/17/2004US20040113235 Multilayer dielectric films; vapor deposition; forming capacitor
06/17/2004US20040113231 High voltage semiconductor device
06/17/2004US20040113230 Self-aligned STI for narrow trenches
06/17/2004US20040113229 Dual gate dielectric construction
06/17/2004US20040113228 Convex polycrystalline silicon thin films; separation layer with convex, concave zones
06/17/2004US20040113227 Dielectric film, its formation method, semiconductor device using the dielectric film and its production method
06/17/2004US20040113226 Semiconductor integrated circuit device
06/17/2004US20040113224 Semiconductor integrated circuit
06/17/2004US20040113223 Elongation shape; isolation zones; gettering impurities
06/17/2004US20040113219 Photosensitive chips with transparent overcoating; bonding pads on edges; receive optical signals
06/17/2004US20040113217 Stress inducing spacers
06/17/2004US20040113215 Surface acoustic wave device and method for manufacturing same
06/17/2004US20040113214 Semiconductor device, electro-optical device, electronic apparatus, and method for manufacturing semiconductor device
06/17/2004US20040113213 Semiconductor device and method for manufacturing same
06/17/2004US20040113212 Multilayer; semiconductor substrate , barrier electrode, intake and drain zones on substrate
06/17/2004US20040113211 Gate electrode with depletion suppression and tunable workfunction
06/17/2004US20040113210 Novel field effect transistor and method of fabrication
06/17/2004US20040113209 MOSFET formed by using salicide process and method of manufacturing the same
06/17/2004US20040113208 Method of manufacturing insulated gate semiconductor device
06/17/2004US20040113207 Vertical MOSFET SRAM cell
06/17/2004US20040113206 Use of hafnium silicon oxynitride as the cap layer of the sidewall spacer
06/17/2004US20040113203 Trench MOSFET device with improved on-resistance
06/17/2004US20040113201 Structures of and methods of fabricating trench-gated MIS devices
06/17/2004US20040113199 Nonvolatile semiconductor memory device
06/17/2004US20040113198 Doped semiconductor substrate with wells; overcoated with dielectric; electrodes
06/17/2004US20040113197 Semiconductor device of non-volatile memory
06/17/2004US20040113196 Method and structure for an oxide layer overlying an oxidation-resistant layer
06/17/2004US20040113195 Precursor for hafnium oxide layer and method for forming halnium oxide film using the precursor
06/17/2004US20040113194 Thin film capacitor having multi-layer dielectric film including silicon dioxide and tantalum pentoxide
06/17/2004US20040113193 Integrated circuit and method for making the same
06/17/2004US20040113191 Memory circuitry and mehtod of forming memory circuitry
06/17/2004US20040113190 Integrated circuit devices including a MIM capacitor
06/17/2004US20040113189 Semiconductor device and manufacturing method of a semiconductor device
06/17/2004US20040113188 Semiconductor element having a semi-magnetic contact
06/17/2004US20040113187 NAND-type magnetoresistive RAM
06/17/2004US20040113186 Method of making layered superlattice material with ultra-thin top layer
06/17/2004US20040113182 Nitrogen implementation to minimize device variation
06/17/2004US20040113181 Lateral phase change memory and method therefor
06/17/2004US20040113175 Magnetic memory device and manufacturing method thereof
06/17/2004US20040113174 Isolation structures for imposing stress patterns
06/17/2004US20040113172 Semiconductor device
06/17/2004US20040113171 Method of fabricating a mosfet device with metal containing gate structures