| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/24/2004 | WO2004053905A2 Dye sensitized solar cells having foil electrodes |
| 06/24/2004 | WO2004053822A2 Display pixel, display apparatus having an image pixel and method of manufacturing display device |
| 06/24/2004 | WO2004053816A1 Light-emitting device and its fabricating method |
| 06/24/2004 | WO2004053595A1 Positive type photoresist composition for lcd production and method of forming resist pattern |
| 06/24/2004 | WO2004053585A1 Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus |
| 06/24/2004 | WO2004053508A1 Inspection method and inspection equipment |
| 06/24/2004 | WO2004053456A2 Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials |
| 06/24/2004 | WO2004053210A1 A substrate for epitaxy and a method of preparing the same |
| 06/24/2004 | WO2004053209A1 A template type substrate and a method of preparing the same |
| 06/24/2004 | WO2004053191A1 Copper activator solution and method for semiconductor seed layer enhancement |
| 06/24/2004 | WO2004053189A1 Support system for a treatment apparatus |
| 06/24/2004 | WO2004053188A1 Susceptor system |
| 06/24/2004 | WO2004053187A1 Susceptor system________________________ |
| 06/24/2004 | WO2004053045A1 Cleaning agent composition, cleaning and production methods for semiconductor wafer, and semiconductor wafer |
| 06/24/2004 | WO2004053008A2 Passivative chemical mechanical polishing composition for copper film planarization |
| 06/24/2004 | WO2004052785A2 High purity nickel/vanadium sputtering components; and methods of making sputtering components |
| 06/24/2004 | WO2004052642A1 CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER |
| 06/24/2004 | WO2004052586A1 Device and method for laser processing |
| 06/24/2004 | WO2004052547A2 Coated and magnetic particles and applications thereof |
| 06/24/2004 | WO2004052411A1 Workpiece processing system |
| 06/24/2004 | WO2004047150A3 RELAXED SiGe LAYERS ON Si OR SILICON-ON-INSULATOR SUBSTRATES BY ION IMPLANTATION AND THERMAL ANNEALING |
| 06/24/2004 | WO2004040476A9 Manufacturing process of detachable substrates |
| 06/24/2004 | WO2004038809A3 Formation of contacts on semiconductor substrates |
| 06/24/2004 | WO2004037878A3 Co-curable compositions |
| 06/24/2004 | WO2004036611A3 Neutral particle beam processing apparatus with enhanced conversion performance from plasma ions to neutral particles |
| 06/24/2004 | WO2004032160A3 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 06/24/2004 | WO2004030084A3 Method for quantifying uniformity patterns and inclusion of expert knowledge for tool development and control |
| 06/24/2004 | WO2004026757A3 Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| 06/24/2004 | WO2004017373A9 Complementary analog bipolar transistors with trench-constrained isolation diffusion |
| 06/24/2004 | WO2004012235A3 Atmospheric pressure plasma processing reactor |
| 06/24/2004 | WO2004012220A3 Methods and apparatus for monitoring plasma parameters in plasma doping systems |
| 06/24/2004 | WO2004010464B1 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 06/24/2004 | WO2004006297A3 Low dielectric materials and methods of producing same |
| 06/24/2004 | WO2004003938A3 Low dielectric constant films derived by sol-gel processing of a hyperbranched polycarbosilane |
| 06/24/2004 | WO2003104929A3 Use of overlay diagnostics for enhanced automatic process control |
| 06/24/2004 | WO2003098664A3 Method for co-fabricating strained and relaxed crystalline and poly-crystalline structures |
| 06/24/2004 | WO2003096352A3 Ferroelectric memory |
| 06/24/2004 | WO2003058680A3 Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 06/24/2004 | WO2003048981A3 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid |
| 06/24/2004 | WO2003036729A8 Delta doped silicon carbide metal-semiconductor field effect transistors and methods of fabricating them |
| 06/24/2004 | WO2003008940A9 Confocal 3d inspection system and process |
| 06/24/2004 | WO2002073122A9 Cyclic error reduction in average interferometric position measurements |
| 06/24/2004 | WO1999064780A9 Chemical delivery system having purge system utilizing multiple purge techniques |
| 06/24/2004 | US20040123267 Computer data analyzing method, based on a computer program, with setting values of light exposure and focus positions, forming pattern on substrate to be exposed to light, measure pattern dimensions, calculation |
| 06/24/2004 | US20040123262 Automatic placement and routing system |
| 06/24/2004 | US20040123182 Parallel fault detection |
| 06/24/2004 | US20040122859 System to identify a wafer manufacturing problem and method therefor |
| 06/24/2004 | US20040122624 Semiconductor wafer inspecting method |
| 06/24/2004 | US20040122605 User interface for semiconductor evaluator |
| 06/24/2004 | US20040122601 Processing tester information by trellising in integrated circuit technology development |
| 06/24/2004 | US20040122599 Real time analysis of periodic structures on semiconductors |
| 06/24/2004 | US20040122548 Storage, measurement, calibration; using computers |
| 06/24/2004 | US20040122545 Substrate processing apparatus, operation method thereof and program |
| 06/24/2004 | US20040122536 Precision positioning device and processing machine using the same |
| 06/24/2004 | US20040122141 Composite media for ion processing and a method for making the composite media |
| 06/24/2004 | US20040121937 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith |
| 06/24/2004 | US20040121714 Polishing cloth and method of producing same |
| 06/24/2004 | US20040121709 Deformable pad for chemical mechanical polishing |
| 06/24/2004 | US20040121708 Pad assembly for electrochemical mechanical processing |
| 06/24/2004 | US20040121704 Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
| 06/24/2004 | US20040121621 Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric |
| 06/24/2004 | US20040121620 Surface preparation prior to deposition |
| 06/24/2004 | US20040121618 Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
| 06/24/2004 | US20040121617 Method of processing a substrate, heating apparatus, and method of forming a pattern |
| 06/24/2004 | US20040121616 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| 06/24/2004 | US20040121615 Method of forming fine patterns |
| 06/24/2004 | US20040121614 Method for forming pattern using printing process |
| 06/24/2004 | US20040121613 Estimation of remaining film thickness distribution, correction of patterning and insulation film removing masks with remaining film thickness distribution, and production of semiconductor device with corrected patterning and insulation film removing masks |
| 06/24/2004 | US20040121612 Methods of forming semiconductor devices using an etch stop layer |
| 06/24/2004 | US20040121611 Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 06/24/2004 | US20040121609 Method for forming silicon epitaxial layer |
| 06/24/2004 | US20040121608 Sidewall coverage for copper damascene filling |
| 06/24/2004 | US20040121607 Method of producing a semiconductor integrated circuit device and the semiconductor integrated circuit device |
| 06/24/2004 | US20040121606 Flip-chip structure and method for high quality inductors and transformers |
| 06/24/2004 | US20040121605 Method and apparatus to improve thickness uniformity of surfaces for integrated device manufacturing |
| 06/24/2004 | US20040121604 Method of etching a low-k dielectric layer |
| 06/24/2004 | US20040121603 Advanced control for plasma process |
| 06/24/2004 | US20040121600 Method of wet etching a silicon and nitrogen containing material |
| 06/24/2004 | US20040121599 Simultaneous formation of device and backside contacts on wafers having a buried insulator layer |
| 06/24/2004 | US20040121598 Method and apparatus for planarization of a material by growing a sacrificial film with customized thickness profile |
| 06/24/2004 | US20040121597 Patterning method for fabricating integrated circuit |
| 06/24/2004 | US20040121596 Source alternating MOCVD processes to deposit tungsten nitride thin films as barrier layers for MOCVD copper interconnects |
| 06/24/2004 | US20040121595 Method of forming a metal film, semiconductor device and wiring board |
| 06/24/2004 | US20040121594 Process for forming a pattern |
| 06/24/2004 | US20040121593 Method for manufacturing semiconductor device through use of mask material |
| 06/24/2004 | US20040121592 Method for fabricating metal silicide |
| 06/24/2004 | US20040121591 Fabrication method of semiconductor integrated circuit device |
| 06/24/2004 | US20040121590 Method of forming a contact hole of a semiconductor device |
| 06/24/2004 | US20040121589 Process for contact opening definition for active element electrical connections |
| 06/24/2004 | US20040121588 Method of forming dual damascene pattern in semiconductor device |
| 06/24/2004 | US20040121587 Semiconductor device and method of fabricating the same |
| 06/24/2004 | US20040121586 Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment |
| 06/24/2004 | US20040121585 Integrated circuit with simultaneous fabrication of dual damascene via and trench |
| 06/24/2004 | US20040121584 Method of manufacturing a semiconductor device |
| 06/24/2004 | US20040121583 Method for forming capping barrier layer over copper feature |
| 06/24/2004 | US20040121582 Method of manufacturing a semiconductor device |
| 06/24/2004 | US20040121581 Method of forming dual-damascene structure |
| 06/24/2004 | US20040121580 Method for fabricating metal line of semiconductor device |
| 06/24/2004 | US20040121579 Mask layer and dual damascene interconnect structure in a semiconductor device |
| 06/24/2004 | US20040121578 Method of forming a dual damascene pattern in a semiconductor device |