| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/24/2004 | US20040118814 Etching solution for multiple layer of copper and molybdenum and etching method using the same |
| 06/24/2004 | US20040118810 Treatment to eliminate polysilicon defects induced by metallic contaminants |
| 06/24/2004 | US20040118806 Etch thinning techniques for wafer-to-wafer vertical stacks |
| 06/24/2004 | US20040118805 Pre-etch implantation damage for the removal of thin film layers |
| 06/24/2004 | US20040118699 Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| 06/24/2004 | US20040118697 Metal deposition process with pre-cleaning before electrochemical deposition |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118694 Multi-chemistry electrochemical processing system |
| 06/24/2004 | US20040118693 rotation of parallel wafers with laminar motion at constant speed; eliminates photolithographic definition steps |
| 06/24/2004 | US20040118692 Plating-rinse-plating process for fabricating copper interconnects |
| 06/24/2004 | US20040118690 successive conditioning, Pd activation, electroless copper plating, and electrolytic copper plating treatments; irradiation with ultraviolet light in the presence of treatment solution; resin is activated to improve copper adhesion |
| 06/24/2004 | US20040118676 Plating apparatus and plating method |
| 06/24/2004 | US20040118659 Method and system for operating a semiconductor factory |
| 06/24/2004 | US20040118599 Attaching flip chips to printed circuits; applying underfill to one zone; electrically heating |
| 06/24/2004 | US20040118586 Low temperature microelectronic die to substrate interconnects |
| 06/24/2004 | US20040118521 Coil and coil support for generating a plasma |
| 06/24/2004 | US20040118520 better resistance to water penetration; formed by the lamination of a plurality of rubber layers and reinforcing layer of yarns, which is used in automobiles and the like |
| 06/24/2004 | US20040118518 Plasma processing system and apparatus and a sample processing method |
| 06/24/2004 | US20040118517 Plasma processing system and apparatus and a sample processing method |
| 06/24/2004 | US20040118515 Separation method for object and glue membrane |
| 06/24/2004 | US20040118512 Systems for assembling components on submounts and methods therefor |
| 06/24/2004 | US20040118501 Heat transfer composite with anisotropic heat flow structure |
| 06/24/2004 | US20040118500 [heat sink for chip package and bonding method thereof] |
| 06/24/2004 | US20040118430 Pressure processing apparatus with improved heating and closure system |
| 06/24/2004 | US20040118429 Apparatus and method for cleaning a glass substrate before photoresist coating |
| 06/24/2004 | US20040118346 Deposited-film formation apparatus, and deposited-film formation process |
| 06/24/2004 | US20040118345 Flexibly suspended gas distribution manifold for plasma chamber |
| 06/24/2004 | US20040118344 System and method for controlling plasma with an adjustable coupling to ground circuit |
| 06/24/2004 | US20040118343 Vacuum chamber load lock purging method and apparatus |
| 06/24/2004 | US20040118338 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 06/24/2004 | US20040118337 Method for growing silicon film, method for manufacturing solar cell, semiconductor substrate, and solar cell |
| 06/24/2004 | US20040118336 Liquid-phase growth process and liquid-phase growth apparatus |
| 06/24/2004 | US20040118184 Liquid flow proximity sensor for use in immersion lithography |
| 06/24/2004 | US20040118183 High-resolution gas gauge proximity sensor |
| 06/24/2004 | US20040118130 Apparatus and method for controlling wafer temperature |
| 06/24/2004 | US20040118051 Polishing pad |
| 06/24/2004 | US20040118005 Vacuum processing apparatus and semiconductor manufacturing line using the same |
| 06/24/2004 | US20040117977 Ceramic substrate for semiconductor manufacturing and inspecting devices, and method of manufacturing the ceramic substrate |
| 06/24/2004 | US20040117968 Very low moisture o-ring and method for preparing the same |
| 06/24/2004 | DE10356958A1 Verfahren zur Flächenvergrößerung bei Kondensatorplatten A method for surface enlargement in capacitor plates |
| 06/24/2004 | DE10356420A1 Reference voltage generating unit for use in semiconductor memory device, has distributing unit generating reference voltage, clamping control unit clamping voltage level at constant level, control unit increasing voltage level |
| 06/24/2004 | DE10353326A1 Substrate processing apparatus used in manufacture of e.g. semiconductor wafer, has gas circulating tube extended outside substrate transfer chamber and connected to corresponding portions of substrate transfer chamber |
| 06/24/2004 | DE10335622A1 Harzversiegelte Halbleiterbaugruppe The resin-sealed semiconductor device |
| 06/24/2004 | DE10334432A1 Halbleiterspeichervorrichtung, die mit integriertem zwischen RAM und ROM geschaltetem Speicher herstellbar ist A semiconductor memory device which can be manufactured with an integrated switched between RAM and ROM memory |
| 06/24/2004 | DE10300139A1 Halbleiterherstellungsanordnung Semiconductor manufacturing apparatus |
| 06/24/2004 | DE10258718A1 Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives Projection objective, in particular for microlithography, and processes for the tuning of a projection lens |
| 06/24/2004 | DE10257098A1 Creating hermetically sealed, dielectrically isolating trenches for mechanical-electrical sensor structures involves sealing hollows formed when filling by low-pressure deposition from widened regions |
| 06/24/2004 | DE10256973A1 Integrated semiconductor memory has selection transistor for each memory cell provided in semiconductor material strut applied to insulation layer |
| 06/24/2004 | DE10256821A1 Verfahren und Einrichtung zum photoelektrochemischen Ätzen einer Halbleiterprobe, insbesondere aus Galliumnitrid Method and apparatus for photo-electrochemical etching of a semiconductor sample, in particular of gallium nitride |
| 06/24/2004 | DE10256696A1 Verfahren zum Trocknen von Substraten The method for drying substrates |
| 06/24/2004 | DE10256693A1 Process for pre-treating surfaces or bonding surfaces of substrates to be joined used in semiconductor technology comprises applying an atmospheric plasma before the bonding process is carried out |
| 06/24/2004 | DE10255884A1 Düsenanordnung Nozzle assembly |
| 06/24/2004 | DE10252605A1 Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses A method, apparatus, computer readable memory and computer program element for the computer-supported monitoring and controlling a manufacturing process |
| 06/24/2004 | DE10247007B3 Semiconductor device used as a MOSFET comprises a substrate, an insulating layer arranged on the substrate, and a first transistor and a second transistor |
| 06/24/2004 | DE10239642B3 Complementary metal oxide semiconductor/bipolar complementary metal oxide semiconductor - integrated circuit for camera chip has single individual layer as last layer of passivation system sealing off integrated circuit |
| 06/24/2004 | DE10164149B4 Verfahren zum Programmieren einer nicht flüchtigen Halbleiterspeichervorrichtung A method for programming a nonvolatile semiconductor memory device |
| 06/23/2004 | EP1432293A1 Printed wiring board and production method for printed wiring board |
| 06/23/2004 | EP1432050A2 Large organic devices and methods of fabricating large organic devices |
| 06/23/2004 | EP1432042A2 Thin film transistor with LDD/offset structure |
| 06/23/2004 | EP1432040A2 Semiconductor memory device and its production process |
| 06/23/2004 | EP1432039A2 Programmable memory transistor |
| 06/23/2004 | EP1432038A2 Integrated circuit |
| 06/23/2004 | EP1432037A2 Integrated device with Schottky diode and with MOS transistor and related manufacturing process |
| 06/23/2004 | EP1432034A1 Semiconductor device and semiconductor device manufacturing method |
| 06/23/2004 | EP1432033A1 Multi-chip module and method of forming |
| 06/23/2004 | EP1432032A2 Semiconductor chip stack and method for manufacturing the same |
| 06/23/2004 | EP1432030A2 Semiconductor device |
| 06/23/2004 | EP1432029A2 Package for housing a semiconductor chip having a metal-diamond composite in the substrate, and fabrication method thereof |
| 06/23/2004 | EP1432028A1 Production method for semiconductor device |
| 06/23/2004 | EP1432026A1 Method of forming a metal interconnect in a trench |
| 06/23/2004 | EP1432025A2 Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
| 06/23/2004 | EP1432024A2 Method of forming a penetration electrode and substrate having a penetration electrode |
| 06/23/2004 | EP1432023A1 Semiconductor device and production method therefor |
| 06/23/2004 | EP1432022A2 Method for manufacturing and transferring a semiconductor film |
| 06/23/2004 | EP1432021A2 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/23/2004 | EP1432020A1 Apparatus for aligning and dispensing solder columns in an array |
| 06/23/2004 | EP1432019A1 Method for producing a nanowire filament using electromigration |
| 06/23/2004 | EP1432018A1 Single source mixtures of metal siloxides |
| 06/23/2004 | EP1432017A1 Polishing head and semiconductor wafer end face polishing machine |
| 06/23/2004 | EP1432016A2 A plating-rinse-plating process for fabricating copper interconnects |
| 06/23/2004 | EP1432015A2 Semiconductor and semiconductor substrate, method of manufacturing the same, and semiconductor device |
| 06/23/2004 | EP1432014A2 vacuum chamber purging method and apparatus |
| 06/23/2004 | EP1432013A1 Semiconductor-mounting apparatus for dispensing an adhesive on a substrat |
| 06/23/2004 | EP1432009A2 Electron beam exposure equipment and electron beam exposure method |
| 06/23/2004 | EP1431988A1 THIN FILM CAPACITY ELEMENT−USE COMPOSITION, HIGH−PERMITTIVITY INSULATION FILM, THIN FILM CAPACITY ELEMENT AND THIN FILM MULTILAYER CAPACITOR |
| 06/23/2004 | EP1431982A1 Method of fabricating 1T1R resistive memory array |
| 06/23/2004 | EP1431826A2 Projection lens, in particular for microlithography, and me thod for adjusting a projection lens |
| 06/23/2004 | EP1431825A1 Lithographic apparatus, device manufacturing method, and substrate holder |
| 06/23/2004 | EP1431824A1 Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| 06/23/2004 | EP1431823A2 Electronic device manufacture |
| 06/23/2004 | EP1431752A2 Method and device for surface inspection |
| 06/23/2004 | EP1431710A2 Liquid flow proximity sensor for use in immersion lithography |
| 06/23/2004 | EP1431709A2 High-resolution gas gauge proximity sensor |
| 06/23/2004 | EP1431426A2 Substrate for epitaxial growth |
| 06/23/2004 | EP1431424A2 Plating apparatus and plating method |
| 06/23/2004 | EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same |
| 06/23/2004 | EP1430833A1 Fingerprint sensor |
| 06/23/2004 | EP1430552A1 Molecular memory and method for making same |
| 06/23/2004 | EP1430548A2 Manufacturing of non-volatile resistance variable devices and programmable memory cells |
| 06/23/2004 | EP1430540A1 Flash memory cell with entrenched floating gate and method for operating said flash memory cell |