| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/01/2004 | US20040125313 Liquid crystal display device and method of fabricating the same |
| 07/01/2004 | US20040125310 Manufacturing method of display device |
| 07/01/2004 | US20040125280 Method for fabricating array substrate having color filter on thin film transistor structure for liquid crystal display device |
| 07/01/2004 | US20040125277 Liquid crystal display device and method for fabricating the same |
| 07/01/2004 | US20040125265 Black matrix; absorber of exterior light; catalyst; patterning; heat treatment |
| 07/01/2004 | US20040125262 Array substrate and liquid crystal display device including the same |
| 07/01/2004 | US20040125261 Array substrate for LCD and method of fabricating the same |
| 07/01/2004 | US20040125254 Liquid crystal display device and method of fabricating the same |
| 07/01/2004 | US20040125252 Method of manufacturing array substrate for liquid crystal display device |
| 07/01/2004 | US20040125191 Method for adjusting processing parameters of at least one plate-shaped object in a processing tool |
| 07/01/2004 | US20040125005 Digital to analogue converter and analogue to digital converter using the same |
| 07/01/2004 | US20040124960 Integrated circuit inductors using driven shields |
| 07/01/2004 | US20040124942 Transmission line and semiconductor integrated circuit device |
| 07/01/2004 | US20040124902 Resistance calibration circuit in semiconductor device |
| 07/01/2004 | US20040124869 Multiple testing bars for testing liquid crystal display and method thereof |
| 07/01/2004 | US20040124862 Probe card |
| 07/01/2004 | US20040124846 Apparatus for handling electronic components and method for controlling temperature of electronic components |
| 07/01/2004 | US20040124845 Device for compensating for heat deviation in a modular IC test handler |
| 07/01/2004 | US20040124793 Electromagnetic induced accelerator |
| 07/01/2004 | US20040124595 Electrostatic chuck and production method therefor |
| 07/01/2004 | US20040124594 Stage apparatus, exposure apparatus, and semiconductor device manufacturing method |
| 07/01/2004 | US20040124563 Multipass multiphoton absorption method and apparatus |
| 07/01/2004 | US20040124547 Semiconductor device and method of manufacturing the same |
| 07/01/2004 | US20040124545 High density integrated circuits and the method of packaging the same |
| 07/01/2004 | US20040124544 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
| 07/01/2004 | US20040124543 Low stress semiconductor die attach |
| 07/01/2004 | US20040124542 Semiconductor device and method for manufacturing the same |
| 07/01/2004 | US20040124538 Multi-layer integrated semiconductor structure |
| 07/01/2004 | US20040124537 Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
| 07/01/2004 | US20040124536 Semiconductor device |
| 07/01/2004 | US20040124535 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 07/01/2004 | US20040124534 Multi-layer interconnect |
| 07/01/2004 | US20040124533 Method of semi-additive plating of imprinted layers and resulting product |
| 07/01/2004 | US20040124532 Semiconductor device and method and apparatus for fabricating the same |
| 07/01/2004 | US20040124531 Copper diffusion barriers |
| 07/01/2004 | US20040124530 Semiconductor structure with substantially etched oxynitride defects protruding therefrom |
| 07/01/2004 | US20040124528 Metal line structures in semiconductor devices and methods of forming the same |
| 07/01/2004 | US20040124520 Stacked electronic structures including offset substrates |
| 07/01/2004 | US20040124516 Circuit device, circuit module, and method for manufacturing circuit device |
| 07/01/2004 | US20040124514 Surface mount chip package |
| 07/01/2004 | US20040124509 Method and structure for vertically-stacked device contact |
| 07/01/2004 | US20040124506 Semiconductor device and a method of manufacturing the same |
| 07/01/2004 | US20040124502 Semiconductor wafer having identification indication |
| 07/01/2004 | US20040124501 Bonding metallic substrates; reducing thickness |
| 07/01/2004 | US20040124499 Etching apertures; multilayer pattern; vertical adjustment |
| 07/01/2004 | US20040124498 Driver for driving a load using a charge pump circuit |
| 07/01/2004 | US20040124496 MIM capacitors and methods for fabricating same |
| 07/01/2004 | US20040124495 Bismaleimide (BMI) polymer as a sacrificial material for an integrated circuit air gap dielectric |
| 07/01/2004 | US20040124494 Process for forming trenches with oblique profile and rounded top corners |
| 07/01/2004 | US20040124492 Semiconductor device and method of manufacturing the same |
| 07/01/2004 | US20040124491 Semiconductor device having high impurity concentration region and low impurity concentration region in side surface of active region |
| 07/01/2004 | US20040124490 Locos isolation for fully-depleted SOI devices |
| 07/01/2004 | US20040124489 Shallow trench power MOSFET and IGBT |
| 07/01/2004 | US20040124488 Semiconductor device |
| 07/01/2004 | US20040124486 Image sensor adapted for reduced component chip scale packaging |
| 07/01/2004 | US20040124485 Method of improving surface planarity prior to MRAM bit material deposition |
| 07/01/2004 | US20040124480 Thin film transistor with LDD/offset structure |
| 07/01/2004 | US20040124479 Semiconductor device and process for manufacturing the same |
| 07/01/2004 | US20040124478 Semiconductor device |
| 07/01/2004 | US20040124477 Capacitors; lower electrode over isolation zones; dielectric film then upper electrode |
| 07/01/2004 | US20040124476 Semiconductor device and method of manufacturing the same |
| 07/01/2004 | US20040124475 Diagonal deep well region for routing body-bias voltage for mosfets in surface well regions |
| 07/01/2004 | US20040124471 Semiconductor device |
| 07/01/2004 | US20040124470 Wafer Bonding Method Of Forming Silicon-On-Insulator Comprising Integrated Circuitry |
| 07/01/2004 | US20040124469 Semiconductor device and method for manufacturing the same |
| 07/01/2004 | US20040124468 Process for forming portions of a compound material inside a cavity and an electronic circuit manufactured therefrom |
| 07/01/2004 | US20040124467 Method and structure to decrease area capacitance within a buried insulator device |
| 07/01/2004 | US20040124466 Method for fabricating programmable memory array structures incorporating series-connected transistor strings |
| 07/01/2004 | US20040124465 Super-junction semiconductor device and method of manufacturing the same |
| 07/01/2004 | US20040124464 Power semiconductor device having semiconductor-layer-forming position controlled by ion implantation without using photoresist pattern, and method of manufacturing such power semiconductor device |
| 07/01/2004 | US20040124463 Semiconductor integrated circuit device |
| 07/01/2004 | US20040124462 Multiple conductive plug structure including at least one conductive plug region and at least one between-conductive-plug region for lateral rf mos devices |
| 07/01/2004 | US20040124461 Trench-gate semiconductor devices, and their manufacture |
| 07/01/2004 | US20040124460 Stack gate electrode suppressed with interface-reaction and method for fabricating semiconductor device having the same |
| 07/01/2004 | US20040124459 Prevent reduction in coupling ratio; floating barriers |
| 07/01/2004 | US20040124457 Semiconductor device having a capacitor with increased capacitance |
| 07/01/2004 | US20040124456 Method to isolate device layer edges through mechanical spacing |
| 07/01/2004 | US20040124455 Ferroelectric memory devices with expanded plate line and methods of fabricating the same |
| 07/01/2004 | US20040124454 Ferroelectric memory device with merged-top-plate structure and method for fabricating the same |
| 07/01/2004 | US20040124453 Capacitor and method for fabricating ferroelectric memory device with the same |
| 07/01/2004 | US20040124452 Reducing stress in integrated circuits |
| 07/01/2004 | US20040124451 Thin film transistor array substrate and method for manufacturing the same |
| 07/01/2004 | US20040124450 Integrated circuit device and method therefor |
| 07/01/2004 | US20040124449 Metal oxide semiconductor field effect transistors (MOSFETS) used in ink-jet head chips and method for making the same |
| 07/01/2004 | US20040124446 PECVD air gap integration |
| 07/01/2004 | US20040124445 Semiconductor substrate and method of manufacture thereof |
| 07/01/2004 | US20040124444 Self-aligned bipolar transistor having recessed spacers and method for fabricating same |
| 07/01/2004 | US20040124443 Semiconductor device and manufacturing method thereof |
| 07/01/2004 | US20040124442 Display device |
| 07/01/2004 | US20040124441 Semiconductor wafer assemblies comprising photoresist over silicon nitride materials |
| 07/01/2004 | US20040124440 Semiconductor device |
| 07/01/2004 | US20040124439 Semiconductor device having a hollow region and method of manufacturing the same |
| 07/01/2004 | US20040124438 Planarizers for spin etch planarization of electronic components and methods of use thereof |
| 07/01/2004 | US20040124436 Indium phosphide heterojunction bipolar transistor layer structure and method of making the same |
| 07/01/2004 | US20040124435 Semiconductor on single crystal substrate; reducing dislociation density |
| 07/01/2004 | US20040124431 Method for dense pixel fabrication and product thereof |
| 07/01/2004 | US20040124427 Apparatus with improved layers of group III-nitride semiconductor |
| 07/01/2004 | US20040124424 Monolithic multiple-wavelength laser device and method of fabricating the same |
| 07/01/2004 | US20040124423 Substrate divided into zones of different light emission zones; forming pixel structures; integrated circuits packages |
| 07/01/2004 | US20040124422 Light-emitting diode |