Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2004
07/06/2004US6759894 Method and circuit for controlling fuse blow
07/06/2004US6759871 Line segmentation in programmable logic devices having redundancy circuitry
07/06/2004US6759863 Wireless radio frequency technique design and method for testing of integrated circuits and wafers
07/06/2004US6759857 Rf power is directed at the surface of a wafer, the reflected rf energy is captured and analyzed for intensity and frequency content
07/06/2004US6759751 Constructions comprising solder bumps
07/06/2004US6759750 Method for integrating low-K materials in semiconductor fabrication
07/06/2004US6759748 Wiring structure of semiconductor device
07/06/2004US6759747 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections
07/06/2004US6759746 Die attachment and method
07/06/2004US6759745 Further miniaturize the semiconductor package by limiting the amount of the fillet spread out around the semiconductor chip
07/06/2004US6759743 Thick film millimeter wave transceiver module
07/06/2004US6759741 Matched set of integrated circuit chips selected from a multi wafer-interposer
07/06/2004US6759738 Systems interconnected by bumps of joining material
07/06/2004US6759731 Bipolar junction transistor and fabricating method
07/06/2004US6759730 Bipolar junction transistor compatible with vertical replacement gate transistor
07/06/2004US6759729 Temperature insensitive resistor in an IC chip
07/06/2004US6759727 Inductor and fabricating method thereof
07/06/2004US6759726 Formation of an isolating wall
07/06/2004US6759723 Light emitting semiconductor package
07/06/2004US6759722 Semiconductor device and method of manufacturing the same
07/06/2004US6759721 Integrated semiconductor DRAM-type memory device and corresponding fabrication process
07/06/2004US6759720 Semiconductor device with transfer gate having gate insulating film and gate electrode layer
07/06/2004US6759719 Edge termination for silicon power devices
07/06/2004US6759717 CMOS integrated circuit device with LDD n-channel transistor and non-LDD p-channel transistor
07/06/2004US6759716 Input/output protection device for a semiconductor integrated circuit
07/06/2004US6759715 Epitaxial base substrate and epitaxial substrate
07/06/2004US6759714 Semiconductor device having heat release structure using SOI substrate and fabrication method thereof
07/06/2004US6759712 Semiconductor-on-insulator thin film transistor constructions
07/06/2004US6759711 Method of manufacturing a transistor
07/06/2004US6759710 Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
07/06/2004US6759709 Low source line resistance and good scalability
07/06/2004US6759708 Stacked gate region of a nonvolatile memory cell for a computer
07/06/2004US6759707 2F2 memory device system
07/06/2004US6759706 Nonvolatile semiconductor memory device with improved gate oxide film arrangements
07/06/2004US6759705 Platinum-rhodium stack as an oxygen barrier in an integrated circuit capacitor
07/06/2004US6759704 Method for fabricating semiconductor device, and semiconductor device, having storage node contact plugs
07/06/2004US6759703 Capacitor and a manufacturing process therefor
07/06/2004US6759702 Memory cell with vertical transistor and trench capacitor with reduced burried strap
07/06/2004US6759701 Transistor circuit
07/06/2004US6759699 Storage element and SRAM cell structures using vertical FETS controlled by adjacent junction bias through shallow trench isolation
07/06/2004US6759698 Semiconductor integrated circuit
07/06/2004US6759696 Bipolar transistor, semiconductor device and method of manufacturing same
07/06/2004US6759695 Integrated circuit metal oxide semiconductor transistor
07/06/2004US6759690 II-VI semiconductor device with BeTe buffer layer
07/06/2004US6759686 Microcavities in the insulating layer act as tiny gas discharge lamps
07/06/2004US6759684 SiC semiconductor device
07/06/2004US6759683 Formulation and fabrication of an improved Ni based composite Ohmic contact to n-SiC for high temperature and high power device applications
07/06/2004US6759679 Poly-silicon layer of a thin film transistor and display device having the same
07/06/2004US6759678 Semiconductor device
07/06/2004US6759677 Semiconductor device and method for manufacturing same
07/06/2004US6759674 Band gap compensated HBT
07/06/2004US6759670 Method for dynamic manipulation of a position of a module in an optical system
07/06/2004US6759666 Method and apparatus for charged particle beam exposure
07/06/2004US6759665 Method and system for ion beam containment in an ion beam guide
07/06/2004US6759660 Adhesive filler; bonding multilayer sheets
07/06/2004US6759633 Heat treating device
07/06/2004US6759632 Device for fast and uniform heating substrate with infrared radiation
07/06/2004US6759628 Laser annealing apparatus
07/06/2004US6759599 Having thick-film fine wiring patterns, and a miniature high-performance high-output module
07/06/2004US6759597 Wire bonding to dual metal covered pad surfaces
07/06/2004US6759351 Method for eliminating development related defects in photoresist masks
07/06/2004US6759350 Method for improving contact hole patterning
07/06/2004US6759349 Stabilization of Si photoanodes in aqueous electrolytes through surface alkylation
07/06/2004US6759348 Pattern and its forming method of liquid crystal display device
07/06/2004US6759347 Method of forming in-situ SRO HDP-CVD barrier film
07/06/2004US6759346 Method of forming dielectric layers
07/06/2004US6759345 Method of manufacturing a semiconductor device including etching of a peripheral area before chemical-mechanical polishing
07/06/2004US6759344 Method for forming low dielectric constant interlayer insulation film
07/06/2004US6759343 Method and composition for selectively etching against cobalt silicide
07/06/2004US6759342 Method of avoiding dielectric arcing
07/06/2004US6759341 Wafering method comprising a plasma etch with a gas emitting wafer holder
07/06/2004US6759340 Method of etching a trench in a silicon-on-insulator (SOI) structure
07/06/2004US6759339 Method for plasma etching a microelectronic topography using a pulse bias power
07/06/2004US6759338 Plasma processing apparatus and method
07/06/2004US6759337 Process for etching a controllable thickness of oxide on an integrated circuit structure on a semiconductor substrate using nitrogen plasma and plasma and an rf bias applied to the substrate
07/06/2004US6759336 Methods for reducing contamination of semiconductor substrates
07/06/2004US6759335 Buried strap formation method for sub-150 nm best DRAM devices
07/06/2004US6759334 Semiconductor manufacturing apparatus and method
07/06/2004US6759333 Semiconductor device and method of manufacturing the same
07/06/2004US6759332 Method for producing dual damascene interconnections and structure produced thereby
07/06/2004US6759331 Method for reducing surface zener drift
07/06/2004US6759330 Method of providing a structure using self-aligned features
07/06/2004US6759329 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same
07/06/2004US6759328 Masks and method for contact hole exposure
07/06/2004US6759327 Method of depositing low k barrier layers
07/06/2004US6759325 Sealing porous structures
07/06/2004US6759324 Method of forming a low resistance contact to underlying aluminum interconnect by depositing titanium in a via opening and reacting the titanium with the aluminum
07/06/2004US6759323 Method for filling depressions in a surface of a semiconductor structure, and a semiconductor structure filled in this way
07/06/2004US6759322 Method for forming wiring structure
07/06/2004US6759321 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation
07/06/2004US6759320 Method of reducing overetch during the formation of a semiconductor device
07/06/2004US6759319 Overcoating semiconductor substrate with contact pads; then passivation layer; forming solder bumps
07/06/2004US6759318 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process
07/06/2004US6759317 Method of manufacturing semiconductor device having passivation film and buffer coating film
07/06/2004US6759316 Method of manufacturing a semiconductor chip
07/06/2004US6759315 Method for selective trimming of gate structures and apparatus formed thereby
07/06/2004US6759314 Method for manufacturing semiconductor devices using thermal nitride films as gate insulating films
07/06/2004US6759313 Crystallizing the amorphous semiconductor film by controlling a light source to irradiate with a pulsed light to the amorphous semiconductor film to form a crystalline semiconductor film.
07/06/2004US6759312 Co-implantation of group VI elements and N for formation of non-alloyed ohmic contacts for n-type semiconductors
07/06/2004US6759311 Fan out of interconnect elements attached to semiconductor wafer