| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/08/2004 | US20040129965 Trench capacitor process for preventing parasitic leakage |
| 07/08/2004 | US20040129964 Semiconductor memory device and manufacturing method thereof |
| 07/08/2004 | US20040129963 Semiconductor device and manufacturing method thereof |
| 07/08/2004 | US20040129962 Method for manufacturing non-volatile memory device and non-volatile memory device and semiconductor device |
| 07/08/2004 | US20040129961 ferroelectric film comprises ferroelectric layered superlattice comprising strontium bismuth tantalate or strontium bismuth tantalum niobate; large surface area; vapor depositing conformal top electrode layer |
| 07/08/2004 | US20040129960 Semiconductor device and manufacturing method thereof, delamination method, and transferring method |
| 07/08/2004 | US20040129959 electrode comprising a first portion on the gate insulator in the recess and a second reduced-width portion extending from the first portion; and source/drain region in substrate adjacent recess; T-shaped gate electrode |
| 07/08/2004 | US20040129956 Solid-state imaging device and method for producing the same |
| 07/08/2004 | US20040129952 Integrated circuit with programmable fuse array |
| 07/08/2004 | US20040129951 Semiconductor integrated circuit |
| 07/08/2004 | US20040129943 manufacturing method capable of decreasing the number of mask processes |
| 07/08/2004 | US20040129942 Inverted buried strap structure and method for vertical transistor DRAM |
| 07/08/2004 | US20040129941 Amorphous and polycrystalline silicon nanolaminate |
| 07/08/2004 | US20040129940 Semiconductor wafer and a methd for manufacturing a semiconductor wafer |
| 07/08/2004 | US20040129939 Stacked type semiconductor device |
| 07/08/2004 | US20040129938 Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor |
| 07/08/2004 | US20040129935 Semiconductor photodetector with internal reflector |
| 07/08/2004 | US20040129933 Pixel current driver for organic light emitting diode displays |
| 07/08/2004 | US20040129928 Method for modifying switching field characteristics of magnetic tunnel junctions |
| 07/08/2004 | US20040129900 Device inspection |
| 07/08/2004 | US20040129898 Electron beam writing equipment and electron beam writing method |
| 07/08/2004 | US20040129896 Method and device for generating extreme ultravilolet radiation in particular for lithography |
| 07/08/2004 | US20040129880 Sem inspection and analysis of patterned photoresist features |
| 07/08/2004 | US20040129856 Vertical guide unit and stage system with the same unit |
| 07/08/2004 | US20040129761 Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment |
| 07/08/2004 | US20040129760 Apparatus for transferring a wafer |
| 07/08/2004 | US20040129758 Die bonding apparatus |
| 07/08/2004 | US20040129754 High speed linear and rotary split-axis wire bonder |
| 07/08/2004 | US20040129679 Process and device for the wet-chemical treatment of silicon |
| 07/08/2004 | US20040129674 Method and system to enhance the removal of high-k dielectric materials |
| 07/08/2004 | US20040129673 High density plasma oxidation |
| 07/08/2004 | US20040129672 Electronic and photonic devices having ultra-micro structures fabricated with a focused ion beam |
| 07/08/2004 | US20040129671 Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials |
| 07/08/2004 | US20040129670 Method for fabricating ferroelectric random access memory device |
| 07/08/2004 | US20040129575 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
| 07/08/2004 | US20040129572 low-resistance; improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) |
| 07/08/2004 | US20040129558 Method of metal sputtering for integrated circuit metal routing |
| 07/08/2004 | US20040129452 Multi-strand substrate for ball-grid array assemblies and method |
| 07/08/2004 | US20040129451 Method of separating semiconductor dies from a wafer |
| 07/08/2004 | US20040129385 Pre-loaded plasma reactor apparatus and application thereof |
| 07/08/2004 | US20040129384 Chemical treatment apparatus and chemical treatment method |
| 07/08/2004 | US20040129364 Bonding method |
| 07/08/2004 | US20040129344 Semiconductor device with solder bumps with fewer occurrences of voids and cracks |
| 07/08/2004 | US20040129324 Modular substrate gas panel having manifold connections in a common plane |
| 07/08/2004 | US20040129302 Single workpiece processing system |
| 07/08/2004 | US20040129300 Substrate processing apparatus and substrate transporting device mounted thereto |
| 07/08/2004 | US20040129297 For processing wafers that loads the first set of wafers into wafer holders within the submersion mechanism, such that every other wafer holder loads a wafer from the first set of wafers |
| 07/08/2004 | US20040129226 Method and apparatus for an improved focus ring in a plasma processing system |
| 07/08/2004 | US20040129225 Method of fabricating semiconductor wafer and susceptor used therefor |
| 07/08/2004 | US20040129224 Cooling mechanism with coolant, and treatment device with cooling mechanism |
| 07/08/2004 | US20040129219 Atomic layer deposition apparatus and method |
| 07/08/2004 | US20040129216 Molecular beam epitaxy equipment |
| 07/08/2004 | US20040129215 Method for depositing especially crystalline layers from the gas phase onto especially crystalline substrates |
| 07/08/2004 | US20040129212 Apparatus and method for delivery of reactive chemical precursors to the surface to be treated |
| 07/08/2004 | US20040129210 Gas nozzle for substrate processing chamber |
| 07/08/2004 | US20040129207 Dispenser for liquid crystal display panel and dispensing method using the same |
| 07/08/2004 | US20040129204 Chemical vapor deposition using organometallic precursors |
| 07/08/2004 | US20040129203 Silicon tube formed of bonded staves |
| 07/08/2004 | US20040128829 Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| 07/08/2004 | DE4444584B4 Halbleiterwafer zum Durchführen eines Burn-In-Tests Semiconductor wafers for performing a burn-in tests |
| 07/08/2004 | DE4417626B4 Einrichtung und Verfahren zum Herstellen eines Halbleiters Apparatus and method for manufacturing a semiconductor |
| 07/08/2004 | DE4312642B4 Verfahren und Vorrichtung zum Kontaktieren Method and apparatus for contacting |
| 07/08/2004 | DE202004003434U1 Mobiles, manuelles, elektrostatisches Handhabungsgerät Mobiles, manual, electrostatic handling equipment |
| 07/08/2004 | DE19962703B4 Verfahren und Vorrichtung zum Steuern des Beladens/Entladens von Halbleiterbauelementen Method and apparatus for controlling the loading / unloading of semiconductor devices |
| 07/08/2004 | DE19916923B4 Vorrichtung zum berührungslosen senkrechten Transportieren von Bauteilen A device for the contactless vertical transporting of components |
| 07/08/2004 | DE19712556B4 Verfahren und Vorrichtung zur Wärmebehandlung eines Halbleiterwafers Method and apparatus for heat treating a semiconductor wafer |
| 07/08/2004 | DE19502827B4 Projektions-Belichtungsgerät A projection exposure apparatus |
| 07/08/2004 | DE10361256A1 Silicon carbide semiconductor structure for e.g. metal oxide semiconductor field effect transistor, includes side surface intersecting main surface at specified acute angle |
| 07/08/2004 | DE10359707A1 Waferstützplatte Wafer support plate |
| 07/08/2004 | DE10358909A1 Plasma-CVD-Vorrichtung sowie Filmherstellverfahren und Verfahren zur Herstellung eines Halbleiterbauteils unter Verwendung derselben Plasma CVD apparatus and Filmherstellverfahren and method for producing a semiconductor device using the same |
| 07/08/2004 | DE10358697A1 Halbleiteranordnung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 07/08/2004 | DE10355273A1 Magnetic random access memory device for storing data, has elongated reference magnetic resistors extending along face nonparallel to main magnetic resistors and including resistance between maximum and minimum resistance |
| 07/08/2004 | DE10342359A1 MRAM mit zwei Schreibleitern MRAM with two write heads |
| 07/08/2004 | DE10338739A1 Integrierter Halbleiterbaustein und Verfahren zur Taktsignalverteilung dafür Integrated semiconductor device and method for clock signal distribution for |
| 07/08/2004 | DE10338047A1 Semiconducting memory device has memory cells in rows/columns, two word lines between adjacent bit line contacts in column direction; each bit line contact separates two adjacent cells in column direction |
| 07/08/2004 | DE10316531A1 Self-adjusted dual polysilicon bipolar transistor has collector region, sub-collector region, base region, emitter region and carbon doped region on first side next to collector region |
| 07/08/2004 | DE10313521A1 Arrangement for removing burrs from components in lead frames has image processing system with camera(s) for detecting component orientation/position, controlling laser beam along edge to be deburred |
| 07/08/2004 | DE10302321A1 Formation of trench capacitor for dynamic random access memory, includes stage of selective modification enabling removal of material from only lower regions |
| 07/08/2004 | DE10296911T5 Leistungs-MOSFET mit verbesserter Durchbruchspannung Power MOSFET with improved breakdown voltage |
| 07/08/2004 | DE10260937A1 Strahlungssemittierender Halbleiterkörper und Verfahren zu dessen Herstellung Strahlungssemittierender semiconductor body and method of producing the |
| 07/08/2004 | DE10258713A1 Determining characteristic layer parameters during a coating process in semiconductor manufacture, by separately guiding pyrometer radiation path and beam path of spectral-optical system |
| 07/08/2004 | DE10258509A1 Production of a break-proof semiconductor wafer comprises preparing a plate-like object having a saw frame, forming trenches in the region of the frame, filling the trenches with a material, and thinning the object |
| 07/08/2004 | DE10258420A1 Semiconductor memory production method for producing semiconductor memories with charge-trapping memory cells applies a memory layer sequence of dielectric material to a substrate |
| 07/08/2004 | DE10258368A1 Wafer holder used in the production of chips in the semiconductor industry comprises a holding device structured so that the wafer is held in position by the device only on its outer edge |
| 07/08/2004 | DE10258094A1 Wafer structure method for creating three-dimensional structures on wafers in the form of bumps spread on each wafer, with each bump linked electrically to a bond pad via a reroute layer |
| 07/08/2004 | DE10258081A1 Production of a solder stop arrangement for forming three-dimensional structures on wafers comprises depositing a seed layer on a wafer having a coating made from an organic material which leaves open the tip of the structure |
| 07/08/2004 | DE10257682A1 Halbleiterschaltungsanordnung Semiconductor circuitry |
| 07/08/2004 | DE10257681A1 Verfahren zum Herstellen einer integrierten Schaltungsanordnung, die eine Metallnitridschicht enthält, und integrierte Schaltungsanordnung A method of fabricating an integrated circuit arrangement that contains a metal nitride layer, and integrated circuit arrangement |
| 07/08/2004 | DE10253919A1 Verfahren zur Justage eines Substrates in einem Gerät zur Durchführung einer Belichtung A method for adjusting a substrate in an apparatus for performing an exposure |
| 07/08/2004 | DE10222964B4 Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile A method for encasing for electronic components and so hermetically encapsulated electronic components |
| 07/08/2004 | DE10147634B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 07/07/2004 | EP1435665A2 MIM capacitors and methods for fabricating same |
| 07/07/2004 | EP1435664A1 Semiconductor device |
| 07/07/2004 | EP1435663A2 PMOS transistor and method for forming the same |
| 07/07/2004 | EP1435661A2 Thin film transistor with protective cap over flexible substrate, electronic device using the same, and manufacturing method thereof |
| 07/07/2004 | EP1435657A1 Non-volatile memory cell and manufacturing process |
| 07/07/2004 | EP1435656A2 Method of manufacturing a dual damascene interconnect |
| 07/07/2004 | EP1435655A2 Electrostatic chuck |
| 07/07/2004 | EP1435654A2 Electrostatic chuck |
| 07/07/2004 | EP1435653A2 Semiconductor device manufactured by a transferring method |