Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2004
07/15/2004WO2003077313A3 Multilayered ceramic substrate for integrated power components and method for the production of said substrate
07/15/2004WO2003075323A3 Device and method for anisotropically plasma etching a substrate
07/15/2004WO2003073448A3 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device
07/15/2004WO2003062739A3 Method and apparatus for compensation of time-varying optical properties of gas in interferometry
07/15/2004WO2003060979A3 Organic compositions for low dielectric constant materials
07/15/2004WO2003046953A3 Retaining device and method for supplying heat to or discharging heat from a substrate
07/15/2004WO2003043810A3 Nanocrystal structures
07/15/2004WO2003043038A3 Mems device having contact and standoff bumps and related methods
07/15/2004WO2001086698A3 Method and system for detecting metal contamination on a semiconductor wafer
07/15/2004US20040139419 Minimization of microelectronic interconnect thickness variations
07/15/2004US20040139418 Automatic optical proximity correction (OPC) rule generation
07/15/2004US20040139414 Integrated circuit pattern designing method, exposure mask manufacturing method, exposure mask, and integrated circuit device manufacturing method
07/15/2004US20040139412 Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device of generating pattern used for semiconductor device
07/15/2004US20040139409 Automatic circuit design apparatus and computer-implemented automatic circuit design method
07/15/2004US20040139407 Semiconductor device layout inspection method
07/15/2004US20040139405 Optimizing designing apparatus of integrated circuit, optimizing designing method of integrated circuit, and storing medium in which program for carrying out optimizing designing method of integrated circuit is stored
07/15/2004US20040138856 Method for analyzing final test parameters
07/15/2004US20040138842 Method for determining rotational error portion of total misalignment error in a stepper
07/15/2004US20040138841 Method and apparatus for detecting an unused state in a semiconductor circuit
07/15/2004US20040138766 Ultra-precision positioning system
07/15/2004US20040138489 Composition and method for low temperature deposition of silicon-containing films
07/15/2004US20040137832 Polishing head and chemical mechanical polishing apparatus
07/15/2004US20040137829 Polishing apparatus and related polishing methods
07/15/2004US20040137823 Polishing apparatus
07/15/2004US20040137762 Annealing process and device of semiconductor wafer
07/15/2004US20040137761 Method for fabricating semiconductor device
07/15/2004US20040137760 Thin film processing method and system
07/15/2004US20040137759 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
07/15/2004US20040137758 Method for curing low dielectric constant film using direct current bias
07/15/2004US20040137757 Method and apparatus to improve cracking thresholds and mechanical properties of low-k dielectric material
07/15/2004US20040137756 Method of improving stability in low k barrier layers
07/15/2004US20040137755 System and method for hydrogen-rich selective oxidation
07/15/2004US20040137754 Method and apparatus for the production of process gases
07/15/2004US20040137753 Method for low temperature liquid-phase deposition and method for cleaning liquid-deposition apparatus
07/15/2004US20040137752 Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus
07/15/2004US20040137751 Method and apparatus for control of layer thicknesses
07/15/2004US20040137750 Method and apparatus for removing material from chamber and wafer surfaces by high temperature hydrogen-containing plasma
07/15/2004US20040137749 Method for removing conductive residue
07/15/2004US20040137748 Selective etching of low-k dielectrics
07/15/2004US20040137747 Plasma etching method
07/15/2004US20040137746 Semiconductor device manufacturing system for etching a semiconductor by plasma discharge
07/15/2004US20040137745 Method and apparatus for removing backside edge polymer
07/15/2004US20040137743 Semiconductor device including bit line formed using damascene technique and method of fabricating the same
07/15/2004US20040137742 Shallow trench isolation for strained silicon processes
07/15/2004US20040137741 Methods for reducing contamination of semiconductor substrates
07/15/2004US20040137740 Method to reduce dishing, erosion and low-k dielectric peeling for copper in low-k dielectric CMP process
07/15/2004US20040137737 Method of manufacturing a semiconductor device
07/15/2004US20040137736 Based on a transparent epoxy casting resin with an admixed luminous pigment being a mixed oxide of aluminum or gallium, a group IIIB metal and a rare earth metal; electroluminescent devices emitting ultraviolet, blue or green light
07/15/2004US20040137735 Method for fabricating a SiGe film, substrate for epitaxial growth and multilayered structure
07/15/2004US20040137734 Compositions and processes for nanoimprinting
07/15/2004US20040137733 GCIB processing of integrated circuit interconnect structures
07/15/2004US20040137732 Process for producing an epitaxial layer of gallium nitride
07/15/2004US20040137731 Selectable area laser assisted processing of substrates
07/15/2004US20040137730 Method of making packets of nanostructures
07/15/2004US20040137728 Air gap formation
07/15/2004US20040137726 Underlayer film-forming material for copper, method for a forming underlayer film for copper, an underlayer film for copper, and a semiconductor device
07/15/2004US20040137725 Copper interconnects
07/15/2004US20040137724 Semiconductor die including conductive columns
07/15/2004US20040137723 Manufacturing method of semiconductor device
07/15/2004US20040137722 Structure and method for eliminating metal contact to P-well or N-well shorts or high leakage paths using polysilicon liner
07/15/2004US20040137721 Replacement of silicon nitride copper barrier with a self-aligning metal barrier
07/15/2004US20040137720 Semiconductor device and manufacturing method for the same
07/15/2004US20040137719 Method for forming metal line of semiconductor device
07/15/2004US20040137718 Anti-reflective coatings and methods for forming and using same
07/15/2004US20040137717 Methods of preventing oxidation of barrier metal of semiconductor devices
07/15/2004US20040137716 Methods of forming metal lines in semiconductor devices
07/15/2004US20040137715 Methods of manufacturing semiconductor devices
07/15/2004US20040137714 Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics
07/15/2004US20040137713 Semiconductor structure having an improved pre-metal dielectric stack and method for forming the same
07/15/2004US20040137712 Interlayer connections for layered electronic devices
07/15/2004US20040137711 Forming silicon nitride as hard mask for wiring by dual damascene process; multilayer; etching patterns
07/15/2004US20040137710 Method for producing a structure using nanoparticles
07/15/2004US20040137709 Metal barrier cap fabrication by polymer lift-off
07/15/2004US20040137708 Method for manufacturing semiconductor device
07/15/2004US20040137707 Flat-top bumping structure and preparation method
07/15/2004US20040137706 Method of manufacturing semiconductor device
07/15/2004US20040137705 Method of manufacturing semiconductor device
07/15/2004US20040137704 Method of manufacturing memory with nano dots
07/15/2004US20040137703 MOSFET threshold voltage tuning with metal gate stack control
07/15/2004US20040137702 Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same
07/15/2004US20040137701 Semiconductor device and manufacturing method thereof
07/15/2004US20040137700 Method for dividing semiconductor wafer
07/15/2004US20040137699 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer
07/15/2004US20040137698 Fabrication system and method for monocrystaline semiconductor on a substrate
07/15/2004US20040137697 Method and apparatus for separating composite substrate
07/15/2004US20040137696 Methods of forming semiconductor devices having field oxides in trenches and devices formed thereby
07/15/2004US20040137695 Substrate-embedded capacitor, production method thereof, and circuit board
07/15/2004US20040137694 Integrated circuit capacitor structure
07/15/2004US20040137693 Method for forming an MIM capacitor
07/15/2004US20040137692 Methods for forming capacitors and contact holes of semiconductor devices simultaneously
07/15/2004US20040137691 Method of manufacturing capacitor in semiconductor devices
07/15/2004US20040137689 Low-GIDL MOSFET structure and method for fabrication
07/15/2004US20040137688 Semiconductor device with tapered gate and process for fabricating the device
07/15/2004US20040137687 Semiconductor device having improved doping profiles and a method of improving the doping profiles of a semiconductor device
07/15/2004US20040137686 Method of forming an embedded memory including forming three silicon or polysilicon layers
07/15/2004US20040137685 Gate material for semiconductor device fabrication
07/15/2004US20040137684 Semiconductor device processing
07/15/2004US20040137683 [method of fabricating multi-bit flash memory]
07/15/2004US20040137682 Methods for fabricating a semiconductor device
07/15/2004US20040137681 Magnetic memory device and its production method