Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2004
07/15/2004US20040134768 Diffusion enhanced ion plating for copper fill
07/15/2004US20040134681 Circuit board and its manufacturing method
07/15/2004US20040134680 Use of perimeter stops to support solder interconnects between integrated circuit assembly components
07/15/2004US20040134618 Plasma processing apparatus and focus ring
07/15/2004US20040134617 Convex insert ring for etch chamber
07/15/2004US20040134616 High-frequency plasma processing apparatus
07/15/2004US20040134615 Device and method for anisotropic plasma etching of a substrate, particularly a silicon element
07/15/2004US20040134613 Device and method for plasma processing, and slow-wave plate
07/15/2004US20040134612 processed seed fiber suitable for other uses in papermaking or as a food additive for human consumption; corn, oats, soybeans; slurrying fiber in a dilute acid solution and washing; modifying agent step preferably includes an acid chlorite solution or a peroxide solution for improved brightness
07/15/2004US20040134610 Semiconductor device manufacturing system for etching a semiconductor by plasma discharge
07/15/2004US20040134609 Semiconductor device manufacturing system for etching a semiconductor by plasma discharge
07/15/2004US20040134608 Layered hard mask and dielectric materials and method therefor
07/15/2004US20040134522 Apparatus and method for the treatment of semiconductor wafers
07/15/2004US20040134515 providing a semiconductor wafer comprising patterns for electronic circuitry and contaminant particles on a surface of the wafer and forming a solid sacrificial film on the surface of the wafer then performing supercritical fluid cleaning
07/15/2004US20040134429 Film forming method and film forming apparatus
07/15/2004US20040134426 Observation window of plasma processing apparatus and plasma processing apparatus using the same
07/15/2004US20040134425 Coating film forming apparatus and coating unit
07/15/2004US20040134420 Apparatus and method for bubble-free application of a resin to a substrate
07/15/2004US20040134418 SiC substrate and method of manufacturing the same
07/15/2004US20040134417 Mask for crystallizing, method of crystallizing amorphous silicon and method of manufacturing array substrate using the same
07/15/2004US20040134376 Polishing composition
07/15/2004US20040134230 Dental glass powders
07/15/2004US20040134083 Apparatus for the measurement or machining of an object, provided with a displacement stage with wedge-shaped guides
07/15/2004DE60100754T2 System und verfahren zum testen von signalverbindungen unter verwendung einer eingebauten selbsttestfunktion System and method for testing signal interconnections using a built-in self-test function
07/15/2004DE4443968B4 Halbleiterspeicherzelle und Verfahren zum Herstellen derselben A semiconductor memory cell and method for manufacturing the same
07/15/2004DE202004006092U1 Transfer and loading station for mobile, electrostatic substrate holder (chuck) has mobile, electrostatic handling device or large area vacuum tweezers with which thin substrates are placed manually
07/15/2004DE202004000914U1 Thin-film cooling device for microprocessor, has solder paste applied via copper tube and two layers of copper gauze joined using heating plate
07/15/2004DE19953333B4 Anordnung zur Realisierung einer stark dotierten vergrabenen epitaktischen Schicht Arrangement for implementing a heavily doped buried epitaxial layer
07/15/2004DE19750918B4 Halbleitereinrichtung mit Bitleitung und Kondensatorelektrode und zugehöriges Herstellungsverfahren Semiconductor device having bit line and capacitor electrode and associated production method
07/15/2004DE19703969B4 Lufthaubensystem für eine Projektionslinse Air hood system for a projection lens
07/15/2004DE19581814B4 Halbleiter-Testchip mit waferintegrierter Schaltmatrix Semiconductor wafer test chip with integrated switching matrix
07/15/2004DE10356796A1 Herstellungsverfahren einer Halbleitervorrichtung Manufacturing method of a semiconductor device
07/15/2004DE10354717A1 TEOS-unterstütztes Oxid-CMP-Verfahren TEOS-supported oxide CMP process
07/15/2004DE10351875A1 Integriertes Schaltkreisbauelement und Halbleiterbauelement mit MIM-Kondensator Integrated circuit device and semiconductor device including the MIM capacitor
07/15/2004DE10349125A1 Halbleitervorrichtung mit Überspannungsschutzschaltung A semiconductor device with overvoltage protection circuit
07/15/2004DE10339070A1 Lateraler Phasenwechsel-Speicher und Herstellungsverfahren Lateral phase change memory and manufacturing processes
07/15/2004DE10338481A1 Halbleitereinrichtung Semiconductor device
07/15/2004DE10338480A1 Halbleitervorrichtung mit dielektrischer Trennung und Verfahren zur Herstellung derselben A semiconductor device with dielectric isolation, and methods of manufacturing the same
07/15/2004DE10338259A1 Halbleitereinrichtung Semiconductor device
07/15/2004DE10337061A1 Halbleiterbaugruppe und Herstellungsverfahren dafür A semiconductor package and fabrication method thereof
07/15/2004DE10335070A1 Halbleiterspeichervorrichtung mit einer Speicherzelle mit geringem Zellverhältnis A semiconductor memory device having a memory cell with a small cell ratio
07/15/2004DE10332653A1 Verfahren zur Stressentlastung während Halbleiterbauelementherstellung A method for stress relief during semiconductor device fabrication
07/15/2004DE10332123A1 Halbleiterspeichervorrichtung und Halbleitervorrichtung A semiconductor memory device and semiconductor device
07/15/2004DE10329332A1 Polycrystalline silicon layer forming method for polycrystalline silicon thin-film transistor used in LCD, involves irradiating laser beam again on amorphous silicon layer after substrate and mask are moved relatively
07/15/2004DE10261885A1 Nanopartikel und nanoskopische Strukturen und Verfahren zu deren Herstellung Nanoparticles and nanoscopic structures and processes for their preparation
07/15/2004DE10260818A1 Process and circuit to adjust a resistance in an integrated circuit for fuses and antifuses passes a programming current suitable for the desired adjustment
07/15/2004DE10260770A1 DRAM memory cell production process and cell arrangement has vertical select transistor and channel partly enclosing the trench hole and surrounded by word line
07/15/2004DE10260769A1 Dram semiconductor memory cell production process and cell arrangement has vertical select transistor with upper channel region enclosed by the word line
07/15/2004DE10260672A1 Verfahren und Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten Method and apparatus for thermal treatment of disk-shaped substrates
07/15/2004DE10260619A1 Verfahren zur Herstellung einer Deckschicht mit antireflektierenden Eigenschaften auf einem Dielektrikum mit kleinem ε A process for producing a coating having anti-reflective properties to a dielectric with small ε
07/15/2004DE10260615A1 Technik zum Verringern der Lackvergiftung bei der Herstellung einer Metallisierungsschicht mit einem Dielektrikum mit kleinem ε Technique for reducing the poisoning lacquer in the manufacture of a metallization layer with a dielectric with small ε
07/15/2004DE10260613A1 Verfahren zum Herstellen eines Feldeffekttransistors A method of manufacturing a field effect transistor
07/15/2004DE10260334A1 Fin-Feldeffektransitor-Speicherzelle, Fin-Feldeffekttransistor-Speicherzellen-Anordnung und Verfahren zum Herstellen einer Fin-Feldeffektransistor-Speicherzelle Fin-Feldeffektransitor memory cell, fin field effect transistor memory cell arrangement and method of fabricating a fin field effect transistor memory cell
07/15/2004DE10260234A1 Verfahren zur Herstellung einer sublithographischen Gatestruktur für Feldeffekttransistoren, eines zugehörigen Feldeffekttransistors, eines zugehörigen Inverters sowie zugehörige Inverterstruktur A process for preparing a sublithographic gate structure for field effect transistors, of an associated field effect transistor, an associated inverter and associated inverter structure
07/15/2004DE10260185A1 Semiconductor memory with vertical charge trapping cells, e.g. read only memory (ROM) cells with transistors on trough walls for extended miniaturizing, with spaced troughs on surface of semiconductor substrate, with insulating troughs
07/15/2004DE10259836A1 Greifer und Betriebsverfahren Gripper and operating procedures
07/15/2004DE10259835A1 Vorrichtung und Verfahren zum Transport einer Komponente Device and method for transport of a component
07/15/2004DE10259783A1 Method for improving process step sequence in forming semiconductor memories with charge trapping memory cells, used same masks as used for forming doped troughs outside memory cell field for removing HV gate dielectric
07/15/2004DE10259754A1 Method for transporting and cooling substrates, in particular, compact disks, digital versatile disks and the like involves use of a cooling gas stream directed to the substrate top surface
07/15/2004DE10259728A1 Grabeinisolationsstruktur für ein Halbleiterbauteil mit einem unterschiedlichen Grad an Eckenrundung und ein Verfahren zur Herstellung derselben Grabeinisolationsstruktur for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same
07/15/2004DE10259634A1 Verfahren zur Herstellung von Kontakten auf einem Wafer A process for the production of contacts on a wafer
07/15/2004DE10259252A1 Transfer unit for microsystems has transfer surfaces inclined in relation to one another in roof shape fashion and commonly movable along rotational axis into respective transfer position to stations
07/15/2004DE10258194A1 Halbleiterspeicher mit Charge-trapping-Speicherzellen und Herstellungsverfahren Semiconductor memory having charge trapping memory cells and manufacturing processes
07/15/2004DE10258128A1 Semiconductor wafer polishing method, by pressing semiconductor wafer against polishing disc with two respective pressures, and two respective concentrations of polishing agent
07/15/2004DE10257870A1 Halbleiterstruktur mit einer integrierten Abschirmung Semiconductor structure with an integrated shield
07/15/2004DE10255847B3 Production of a trench capacitor for a semiconductor memory cell comprises using an auxiliary agent consisting of an insulating side wall spacer and a further conducting filler during filling of an upper trench region and mask opening
07/15/2004DE10255845B3 Production of a trench capacitor for a semiconductor memory cell comprises forming a trench in a substrate using a hard mask, forming a capacitor dielectric, insulating collar and conducting filler in trench regions, and further processing
07/15/2004DE10255844B3 Integrated circuit manufacturing method of chip scale package, involves attaching solder balls in area that is uncovered by resist element, of patterned rewriting element, in patterned form
07/15/2004DE10255686B3 Method of manufacturing semiconductor e.g. memory involves reducing overlap region between strip sections formed on semiconductor substrate, and filling trench structure dividing strip sections, with material containing silicon oxide
07/15/2004DE10228555B4 Vorrichtung zum Abholen von IC's von einem Wafer Apparatus for retrieving IC's from a wafer
07/15/2004DE10216786B4 Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden Method and device for conditioning semiconductor wafers and / or hybrids
07/15/2004DE10214262B4 Reinraumsystem für Teileträger, insbesondere von Microsystemen Cleanroom System for parts support, particularly from Micro Systems
07/15/2004DE10101073B4 Bildaufbereitungsvorrichtung mit niedrigeren Speicherkapazitätsanforderungen und Verfahren dafür Imaging device with lower memory requirements and procedures for
07/15/2004CA2550522A1 Photoresist removal
07/15/2004CA2508810A1 Multi-level memory cell with lateral floating spacers
07/15/2004CA2504099A1 Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices
07/15/2004CA2504098A1 Methods of forming semiconductor devices having self aligned semiconductor mesas and contact layers and related devices
07/15/2004CA2503854A1 Electronic devices including semiconductor mesa structures and conductivity junctions and methods of forming said devices
07/15/2004CA2500647A1 Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices
07/14/2004EP1437917A1 Ceramic heater
07/14/2004EP1437776A1 Light emitting device and method for manufacture thereof
07/14/2004EP1437775A2 Method of manufacturing a semiconductor memory with nano dots
07/14/2004EP1437774A2 Transistor storing multiple bits and method of manufacturing semiconductor memory including the same
07/14/2004EP1437772A1 Bi-directional fowler-nordheim tunneling flash memory
07/14/2004EP1437769A1 Indium-containing wafer and method for production thereof
07/14/2004EP1437768A1 Plasma cleaning gas and plasma cleaning method
07/14/2004EP1437766A2 MOS transistor and its method of fabrication
07/14/2004EP1437765A1 Production method for semiconductor substrate and production method for field effect transistor and semiconductor substrate and field effect transistor
07/14/2004EP1437764A1 A compliant substrate for a heteroepitaxy, a heteroepitaxial structure and a method for fabricating a compliant substrate
07/14/2004EP1437763A1 Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
07/14/2004EP1437762A1 Notched compound semiconductor wafer
07/14/2004EP1437754A2 Electronic device
07/14/2004EP1437747A1 Magnetoresistive random access memory with high selectivity
07/14/2004EP1437743A2 Adaptive algorithm for electrical fuse programming
07/14/2004EP1437424A2 Method and apparatus for smoothing surfaces on an atomic scale
07/14/2004EP1437394A1 Adhesives composition, adhesive film, and semiconductor apparatus using the same
07/14/2004EP1437300A1 System for embossing carrier tape and method for producing carrier tape
07/14/2004EP1437209A1 Wire sawing device
07/14/2004EP1437197A1 Apparatus and method for chemical-mechanical polishing (CMP) using a head having a direct pneumatic wafer polishing pressure system
07/14/2004EP1437035A1 Antenna structure for inductively coupled plasma generator