| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/27/2004 | US6767377 High activity material for chemical mechanical polishing; reproducibly adjustable particle size |
| 07/27/2004 | US6767274 Method to reduce defect/slurry residue for copper CMP |
| 07/27/2004 | US6767219 Contactor, method for manufacturing such contactor, and testing method using such contactor |
| 07/27/2004 | US6767176 Lift pin actuating mechanism for semiconductor processing chamber |
| 07/27/2004 | US6767170 Wafer handling system and wafer handling method |
| 07/27/2004 | US6767124 Slurry mixing feeder and slurry mixing and feeding method |
| 07/27/2004 | US6767086 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer |
| 07/27/2004 | US6767085 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer |
| 07/27/2004 | US6766998 Molds for wafer scale molding of protective caps |
| 07/27/2004 | US6766960 Smart card having memory using a breakdown phenomena in an ultra-thin dielectric |
| 07/27/2004 | US6766938 Apparatus and method of placing solder balls onto a substrate |
| 07/27/2004 | US6766895 Work conveying system and traveling path sealing structure in the work conveying system |
| 07/27/2004 | US6766851 Heat sink fin assembly |
| 07/27/2004 | US6766813 Apparatus and method for cleaning a wafer |
| 07/27/2004 | US6766811 Method of removing smear from via holes |
| 07/22/2004 | WO2004061991A1 Thin film transistor substrate and method for forming metal wire thereof |
| 07/22/2004 | WO2004061981A1 Boron phosphide-based semiconductor light-emitting device and production method thereof |
| 07/22/2004 | WO2004061980A1 Method for roughening a surface of a body, and optoelectronic component |
| 07/22/2004 | WO2004061978A1 Field-effect transistor |
| 07/22/2004 | WO2004061977A1 Semiconductor storage and mobile electronic device |
| 07/22/2004 | WO2004061975A1 Trench mis device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same |
| 07/22/2004 | WO2004061974A2 Silicon carbide power mos field effect transistors and manufacturing methods |
| 07/22/2004 | WO2004061973A1 Group iii nitride based flip-chip integrated circuit and method for fabricating |
| 07/22/2004 | WO2004061972A1 Dense dual-plane devices |
| 07/22/2004 | WO2004061971A1 P-type nitride semiconductor structure and bipolar transistor |
| 07/22/2004 | WO2004061970A1 Indium phosphide heterojunction bipolar transistor layer structure and method of making the same |
| 07/22/2004 | WO2004061969A1 Growth of planar, non-polar a-plane gallium nitride by hydride vapor phase epitaxy |
| 07/22/2004 | WO2004061967A2 Well regions of semiconductor devices |
| 07/22/2004 | WO2004061964A1 Multilayer capacitor with multiple plates per layer |
| 07/22/2004 | WO2004061962A2 Multi-layer integrated semiconductor structure |
| 07/22/2004 | WO2004061961A1 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 07/22/2004 | WO2004061960A2 Semiconductor device power interconnect striping |
| 07/22/2004 | WO2004061959A1 Packaged ic using insulated wire |
| 07/22/2004 | WO2004061955A1 Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| 07/22/2004 | WO2004061953A2 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 07/22/2004 | WO2004061952A2 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 07/22/2004 | WO2004061950A1 Method of forming protruding metal portions by differential planarization |
| 07/22/2004 | WO2004061949A1 Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric |
| 07/22/2004 | WO2004061948A2 Method for forming a semiconductor device and structure thereof |
| 07/22/2004 | WO2004061947A1 Semiconductor device, dram integrated circuit device, and its manufacturing method |
| 07/22/2004 | WO2004061946A1 Locos isolation for fully-depleted soi devices |
| 07/22/2004 | WO2004061945A1 Trench isolation structure for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same |
| 07/22/2004 | WO2004061944A1 Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer |
| 07/22/2004 | WO2004061943A1 Recycling by mechanical means of a wafer comprising a taking-off structure after taking-off a thin layer thereof |
| 07/22/2004 | WO2004061942A1 Semiconductor processing-purpose substrate detecting method and device, and substrate transfer system |
| 07/22/2004 | WO2004061941A1 Electrostatic chuck |
| 07/22/2004 | WO2004061940A1 Cassette for substrates |
| 07/22/2004 | WO2004061939A1 Parallel fault detection |
| 07/22/2004 | WO2004061938A1 Dynamic adaptive sampling rate for model prediction |
| 07/22/2004 | WO2004061937A1 Processing tester information by trellising in integrated circuit technology development |
| 07/22/2004 | WO2004061936A1 Low stress semiconductor die attach |
| 07/22/2004 | WO2004061935A1 Method for forming bump, semiconductor devcie and its manufacturing method, substrate treatment device, and semiconductor manufacturing apparatus |
| 07/22/2004 | WO2004061934A1 Selective underfill for flip chips and flip-chip assemblies |
| 07/22/2004 | WO2004061933A1 Diffusion barrier and method therefor |
| 07/22/2004 | WO2004061932A1 Method and apparatus for planarization of a material by growing a sacrificial film with customized thickness profile |
| 07/22/2004 | WO2004061931A1 Semiconductor device having multilevel wiring structure and method for fabricating the same |
| 07/22/2004 | WO2004061930A1 Sulfide encapsulation passivation technique |
| 07/22/2004 | WO2004061928A1 Method and device for plasma-etching organic material film |
| 07/22/2004 | WO2004061927A1 Method and apparatus for monitoring a material processing system |
| 07/22/2004 | WO2004061926A1 Method and equipment for manufacturing semiconductor device |
| 07/22/2004 | WO2004061925A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition |
| 07/22/2004 | WO2004061924A1 Method of producing thin films of compound i-iii-vi, promoting the incorporation of iii elements in the film |
| 07/22/2004 | WO2004061923A1 Gallium nitride crystal, homoepitaxial gallium-nitride-based devices and method for producing same |
| 07/22/2004 | WO2004061922A1 Method of fabrication of a support structure for a semiconductor device |
| 07/22/2004 | WO2004061921A2 Strained silicon-on-insulator (ssoi) and method to form the same |
| 07/22/2004 | WO2004061920A2 Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer |
| 07/22/2004 | WO2004061919A1 Method and apparatus for bilayer photoresist dry development |
| 07/22/2004 | WO2004061918A1 Pattern forming method, electronic device manufacturing method, electronic device, and photomask |
| 07/22/2004 | WO2004061917A1 Encapsulation of ferroelectric capacitors |
| 07/22/2004 | WO2004061916A2 Method of forming a low-k dual damascene interconnect structure |
| 07/22/2004 | WO2004061915A2 Integrating n-type and p-type metal gate transistors |
| 07/22/2004 | WO2004061914A2 Chamber for uniform substrate heating |
| 07/22/2004 | WO2004061912A1 Systems for assembling components on submounts and methods therefor |
| 07/22/2004 | WO2004061911A2 Semiconductor devices with reduced active region defects and unique contacting schemes |
| 07/22/2004 | WO2004061910A2 Pre-etch implantation damage for the removal of thin film layers |
| 07/22/2004 | WO2004061909A1 Growth of reduced dislocation density non-polar gallium nitride by hydride vapor phase epitaxy |
| 07/22/2004 | WO2004061903A2 Method for fabrication of semiconductor device |
| 07/22/2004 | WO2004061902A2 Method and apparatus for monitoring a material processing system |
| 07/22/2004 | WO2004061897A2 Very low moisture o-ring and method for preparing the same |
| 07/22/2004 | WO2004061881A1 Thin film capacitor and method for manufacturing same |
| 07/22/2004 | WO2004061863A2 Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same |
| 07/22/2004 | WO2004061859A2 Stochastic assembly of sublithographic nanoscale interfaces |
| 07/22/2004 | WO2004061857A1 A method for fabricating a flux concentrating system for use in a magnetoelectronics device |
| 07/22/2004 | WO2004061851A2 An improved method for making high-density nonvolatile memory |
| 07/22/2004 | WO2004061693A1 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection |
| 07/22/2004 | WO2004061526A1 Alkali-soluble gap filling material forming composition for lithography |
| 07/22/2004 | WO2004061521A1 Method for manufacturing electronic device and electronic device |
| 07/22/2004 | WO2004061167A1 LOW-RESISTANCE n TYPE SEMICONDUCTOR DIAMOND AND PROCESS FOR PRODUCING THE SAME |
| 07/22/2004 | WO2004061154A1 Method for forming tungsten nitride film |
| 07/22/2004 | WO2004061152A1 Pulsed magnetron target for sputter deposition |
| 07/22/2004 | WO2004061028A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 07/22/2004 | WO2004061027A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 07/22/2004 | WO2004060988A2 Carbon nanotubes |
| 07/22/2004 | WO2004060793A1 Multilayer structure and method for manufacturing same, functional structure and method for manufacturing same, and mask for electron beam exposure and method for manufacturing same |
| 07/22/2004 | WO2004060792A2 Method of forming semiconductor devices through epitaxy |
| 07/22/2004 | WO2004060610A2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
| 07/22/2004 | WO2004060609A1 Modular method for chemical mechanical planarization |
| 07/22/2004 | WO2004060593A1 Centrifugal sintering system |
| 07/22/2004 | WO2004045739A3 Substrate processing apparatus for processing substrates using dense phase gas and sonic waves |
| 07/22/2004 | WO2004044994A9 Monolithically integrated vertical pin photodiode used in bicmos technology |