| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/15/2004 | US20040135262 Semiconductor device and a method of manufacturing the same |
| 07/15/2004 | US20040135261 Interconnections having double capping layer and method for forming the same |
| 07/15/2004 | US20040135260 Semiconductor devices and methods of fabricating the same |
| 07/15/2004 | US20040135259 Semiconductor device and method for fabricating the same |
| 07/15/2004 | US20040135256 Nonvolatile semiconductor memory device |
| 07/15/2004 | US20040135255 Semiconductor device and its manufacturing method |
| 07/15/2004 | US20040135254 Porous multilayer dielectric overcoating substrate |
| 07/15/2004 | US20040135252 Arrangement for the protection of three-dimensional structures on wafers |
| 07/15/2004 | US20040135251 Composite metal column for mounting semiconductor device |
| 07/15/2004 | US20040135247 Heat dissipation substrates; copper, tungsten alloy; mixture of metal powder with binders; heating; molding; sintering; controlling particle size |
| 07/15/2004 | US20040135246 Method for fabricating semiconductor package and semiconductor package |
| 07/15/2004 | US20040135242 Stacked structure of chips |
| 07/15/2004 | US20040135237 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135236 Thin film transistor, its manufacture method and display device |
| 07/15/2004 | US20040135235 Discrete component comprising HF diodes in series with a common cathode |
| 07/15/2004 | US20040135234 Semiconductor device with MOS transistors with an etch-stop layer having an improved residual stress level and method for fabricating such a semiconductor device |
| 07/15/2004 | US20040135233 Wafer integrated rigid support ring |
| 07/15/2004 | US20040135230 Integrated circuit structure; corrosion and oxidation resistance; adhesion; low temperature annealing |
| 07/15/2004 | US20040135229 Semiconductor device and method of setting input pin capacity |
| 07/15/2004 | US20040135227 Method and apparatus for a deposited fill layer |
| 07/15/2004 | US20040135226 Isolation trenches; support subatrates; dielectrics; adjustment grooves; patterning |
| 07/15/2004 | US20040135221 Method for producing semi-conducting devices and devices obtained with this method |
| 07/15/2004 | US20040135219 Fabrication of silicon micro mechanical structures |
| 07/15/2004 | US20040135218 MOS transistor with high k gate dielectric |
| 07/15/2004 | US20040135217 Semiconductor device and method for manufacturing same |
| 07/15/2004 | US20040135216 Semiconductor device and method for manufacturing same |
| 07/15/2004 | US20040135215 Multilayer; integrated circuit substrate; active material zones |
| 07/15/2004 | US20040135214 Structure and method for formation of a blocked silicide resistor |
| 07/15/2004 | US20040135212 Damascene method for improved mos transistor |
| 07/15/2004 | US20040135211 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135210 Field effect transistor and fabrication thereof, semiconductor device and fabrication thereof, logic circuit including the semiconductor device, and semiconductor substrate |
| 07/15/2004 | US20040135208 Flat wafer; silicon substrate overcoated with boron dopes silicon layer; mirror polished surfaces |
| 07/15/2004 | US20040135207 CMOS pixel with dual gate PMOS |
| 07/15/2004 | US20040135206 Semiconductor circuit having an input protection circuit |
| 07/15/2004 | US20040135205 Liquid crystal display device having drive circuit and fabricating method thereof |
| 07/15/2004 | US20040135204 Fully-depleted (FD) (SOI) MOSFET access transistor and method of fabrication |
| 07/15/2004 | US20040135203 Semiconductor device |
| 07/15/2004 | US20040135202 Semiconductor device |
| 07/15/2004 | US20040135200 Semiconductor device |
| 07/15/2004 | US20040135199 Semiconductor devices and methods of forming a trench in a semiconductor device |
| 07/15/2004 | US20040135198 Semiconductor device and method of fabricating the same, nonvolatile semiconductor memory and method of fabricating the same, and electronic apparatus including nonvolatile semiconductor memory |
| 07/15/2004 | US20040135197 Semiconductor structure with integrated shield |
| 07/15/2004 | US20040135196 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135195 Flash memory cell and method of manufacturing the same, and programming/erasing/reading method in the flash memory cell |
| 07/15/2004 | US20040135194 Non-volatile memory devices with charge storage insulators and methods of fabricating such devices |
| 07/15/2004 | US20040135193 Cell structure of EPROM device and method for fabricating the same |
| 07/15/2004 | US20040135192 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135191 Cell structure of non-volatile memory device and method for fabricating the same |
| 07/15/2004 | US20040135190 Semiconductor memory having an arrangement of memory cells |
| 07/15/2004 | US20040135189 Semiconductor device |
| 07/15/2004 | US20040135188 Trench capacitor vertical structure |
| 07/15/2004 | US20040135187 Dynamic memory cell and method of manufacturing same |
| 07/15/2004 | US20040135186 Semiconductor device and method for manufacturing same |
| 07/15/2004 | US20040135185 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135184 Nonvolatile magnetic memory device and manufacturing method thereof |
| 07/15/2004 | US20040135183 Ferroelectric capacitor, process for production thereof and semiconductor device using the same |
| 07/15/2004 | US20040135182 Ferroelectric capacitors including a seed conductive film and methods for manufacturing the same |
| 07/15/2004 | US20040135180 Semiconductor device and method for manufacturing the same |
| 07/15/2004 | US20040135179 Method for fabricating a self-aligned bipolar transistor having increased manufacturability and related structure |
| 07/15/2004 | US20040135178 Semiconductor device |
| 07/15/2004 | US20040135177 Semiconductor integrated circuit having a scan test |
| 07/15/2004 | US20040135176 Mosfet having recessed channel and method o fabricating the same |
| 07/15/2004 | US20040135175 Semiconductor device and display device |
| 07/15/2004 | US20040135174 Thin film circuit |
| 07/15/2004 | US20040135173 Organic electroluminescence display panel |
| 07/15/2004 | US20040135171 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
| 07/15/2004 | US20040135169 Plasma oscillation switching device |
| 07/15/2004 | US20040135161 P-type quantum-well-base bipolar transistor device employing interdigitated base and emitter formed with a capping layer |
| 07/15/2004 | US20040135151 Light-emitting apparatus |
| 07/15/2004 | US20040135150 Display device |
| 07/15/2004 | US20040135146 Electronic device |
| 07/15/2004 | US20040135143 Display device and manufacturing method of the same |
| 07/15/2004 | US20040135141 Electrostatic Discharge Protection Networks For Triple Well Semiconductor Devices |
| 07/15/2004 | US20040135138 System and method for isolating silicon germanium dislocation regions in strained-silicon CMOS applications |
| 07/15/2004 | US20040135137 Bipolar structure with two base-emitter junctions in the same circuit |
| 07/15/2004 | US20040135102 Charged-particle-beam exposure apparatus and method of controlling same |
| 07/15/2004 | US20040134979 Semiconductor device and an information management system therefore |
| 07/15/2004 | US20040134974 Solder bump structure and method for forming a solder bump |
| 07/15/2004 | US20040134899 Ceramic substrate for a semiconductor-production/inspection device |
| 07/15/2004 | US20040134896 Laser-based method and system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134894 Laser-based system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134885 Etching and cleaning of semiconductors using supercritical carbon dioxide |
| 07/15/2004 | US20040134882 Soft lithography; crosslinking using photoinitiators; masking; patterning; curing |
| 07/15/2004 | US20040134878 Method for manufacturing an LCD device |
| 07/15/2004 | US20040134876 Semiconductor memory device utilizing tunnel magneto resistive effects and method for manufacturing the same |
| 07/15/2004 | US20040134875 Circuit-parts sheet and method of producing a multi-layer circuit board |
| 07/15/2004 | US20040134873 Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| 07/15/2004 | US20040134831 Adjustable cassette for accommodating substrates and method for adjusting same |
| 07/15/2004 | US20040134830 Tray for substrate |
| 07/15/2004 | US20040134829 Wafer container with removable sidewalls |
| 07/15/2004 | US20040134828 Wafer shipping container |
| 07/15/2004 | US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits |
| 07/15/2004 | US20040134792 electroplating; ball assemblies comprises interior housing, annular seat, conductive adapter, and coupled conductive contact |
| 07/15/2004 | US20040134789 electrolytic/electroless plating; surface treatment; for filling copper in fine interconnection patterns/trenches in semiconductor substrate |
| 07/15/2004 | US20040134787 Method and apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| 07/15/2004 | US20040134776 Assemblies comprising molybdenum and aluminum; and methods of utilizing interlayers in forming target/backing plate assemblies |
| 07/15/2004 | US20040134775 Electrochemical processing cell |
| 07/15/2004 | US20040134774 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
| 07/15/2004 | US20040134773 Method and apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| 07/15/2004 | US20040134769 first step of sputter depositing copper into hole at first temperature of less than 100 degrees C. and filling bottom third of hole and second step of completely filling hole with copper |