| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/20/2004 | US6764386 Air bearing-sealed micro-processing chamber |
| 07/20/2004 | US6764385 Methods for resist stripping and cleaning surfaces substantially free of contaminants |
| 07/20/2004 | US6764381 Polishing apparatus |
| 07/20/2004 | US6764380 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 07/20/2004 | US6764271 Substrate conveyer robot |
| 07/20/2004 | US6764212 Chemical supply system |
| 07/20/2004 | US6763994 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/20/2004 | US6763840 Method and apparatus for cleaning substrates using liquid carbon dioxide |
| 07/20/2004 | US6763839 Substrate cleaning system |
| 07/20/2004 | US6763714 Method and apparatus for controlling the level of liquids |
| 07/20/2004 | US6763700 Trap apparatus |
| 07/20/2004 | US6763608 Method of transporting a reticle |
| 07/20/2004 | US6763585 Method for producing micro bump |
| 07/20/2004 | US6763581 Method for manufacturing spiral contactor |
| 07/20/2004 | US6763578 Method and apparatus for manufacturing known good semiconductor die |
| 07/20/2004 | CA2318968C Slip free vertical rack design having rounded horizontal arms |
| 07/20/2004 | CA2222857C Process to create metallic stand-offs on an electronic circuit |
| 07/20/2004 | CA2167396C Silicon pixel electrode |
| 07/15/2004 | WO2004060034A1 Electronic component-built-in module |
| 07/15/2004 | WO2004060028A1 Organic electroluminescence element and organic electroluminescence display |
| 07/15/2004 | WO2004059841A1 Ground switching circuit |
| 07/15/2004 | WO2004059838A1 Non-volatile latch circuit and method for driving same |
| 07/15/2004 | WO2004059809A2 Methods of forming semiconductor devices having self aligned semiconductor mesas and contact layers and related devices |
| 07/15/2004 | WO2004059808A2 Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices |
| 07/15/2004 | WO2004059751A2 Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices |
| 07/15/2004 | WO2004059745A1 Magnetic switching device and magnetic memory |
| 07/15/2004 | WO2004059744A1 Compound semiconductor epitaxial substrate and method for manufacturing same |
| 07/15/2004 | WO2004059743A1 Compound semiconductor epitaxial substrate and method for manufacturing same |
| 07/15/2004 | WO2004059742A1 High electron mobility epitaxial substrate |
| 07/15/2004 | WO2004059739A2 Memory architecture with series grouped memory cells |
| 07/15/2004 | WO2004059738A1 Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement, and method for the production of a fin field effect transistor memory cell |
| 07/15/2004 | WO2004059737A1 Multi-level memory cell with lateral floating spacers |
| 07/15/2004 | WO2004059736A1 Method for manufacturing semiconductor device |
| 07/15/2004 | WO2004059732A1 Ic tiling pattern method, ic so formed and analysis method |
| 07/15/2004 | WO2004059731A1 Silicon on sapphire structure (devices) with buffer layer |
| 07/15/2004 | WO2004059730A1 Method of self-assembling electronic circuitry and circuits formed thereby |
| 07/15/2004 | WO2004059728A2 Method of fabricating an integrated circuit and semiconductor chip |
| 07/15/2004 | WO2004059727A1 Methods of forming structure and spacer and related finfet |
| 07/15/2004 | WO2004059726A1 Integrated antifuse structure for finfet and cmos devices |
| 07/15/2004 | WO2004059725A1 Method of the production of cavities in a silicon sheet |
| 07/15/2004 | WO2004059724A1 End effector assembly for supporting substrates |
| 07/15/2004 | WO2004059723A2 System to identify a wafer manufacturing problem and method therefor |
| 07/15/2004 | WO2004059721A1 Electronic component unit |
| 07/15/2004 | WO2004059720A1 Three-dimensional device fabrication method |
| 07/15/2004 | WO2004059718A1 Method of fabricating a tft device formed by printing |
| 07/15/2004 | WO2004059717A1 Thin film transistor, method for producing a thin film transistor and electronic device having such a transistor |
| 07/15/2004 | WO2004059716A1 A system and method for controlling plasma with an adjustable coupling to ground circuit |
| 07/15/2004 | WO2004059715A1 Polishing pads, conditioner and methods for polishing using the same |
| 07/15/2004 | WO2004059713A1 Selective etching of a protective layer |
| 07/15/2004 | WO2004059711A1 Method of producing mixed substrates and structure thus obtained |
| 07/15/2004 | WO2004059709A1 Coating device and coating film forming method |
| 07/15/2004 | WO2004059708A2 Structure and method for bonding to copper interconnect structures |
| 07/15/2004 | WO2004059707A2 A method and apparatus for forming a high quality low temperature silicon nitride film |
| 07/15/2004 | WO2004059706A2 Electronic devices including semiconductor mesa structures and conductivity junctions and methods of forming said devices |
| 07/15/2004 | WO2004059705A1 Apparatus and methods for dispensing fluids with rotatable dispense arms |
| 07/15/2004 | WO2004059704A1 Method of manufacturing an oxide beam |
| 07/15/2004 | WO2004059703A1 Finfet sram cell using inverted finfet thin film transistors |
| 07/15/2004 | WO2004059702A2 Method and apparatus for monitoring a material processing system |
| 07/15/2004 | WO2004059700A2 Photoresist removal |
| 07/15/2004 | WO2004059699A2 System and method for on-the-fly eccentricity recognition |
| 07/15/2004 | WO2004059697A2 Adaptive negative differential resistance device |
| 07/15/2004 | WO2004059695A2 Ultrasonic levitation in a rapid thermal processing plant for wafers |
| 07/15/2004 | WO2004059689A2 Method and apparatus for monitoring a plasma in a material processing system |
| 07/15/2004 | WO2004059682A1 Low-temperature formation method for emitter tip including copper oxide nanowire or copper oxide nanowire or copper nanowire and display device or light source having emitter tip manufactured using the same |
| 07/15/2004 | WO2004059678A1 Push/pull actuator for microstructures |
| 07/15/2004 | WO2004059391A1 Resist composition and method of forming resist pattern using same |
| 07/15/2004 | WO2004059384A1 Lithography mask blank |
| 07/15/2004 | WO2004059383A2 Fluoride in supercritical fluid for photoresist and residue removal |
| 07/15/2004 | WO2004059271A1 Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system |
| 07/15/2004 | WO2004059242A1 Method and apparatus for metrological process control implementing complimentary sensors |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | WO2004059038A1 Etching of algainassb |
| 07/15/2004 | WO2004058453A1 Polishing pad having multi-windows |
| 07/15/2004 | WO2004053994A3 Buffer layer comprising quaternary and ternary alloys in semiconductor devices |
| 07/15/2004 | WO2004051729A3 Method and device for pre-treating surfaces of substrates to be bonded |
| 07/15/2004 | WO2004049424A3 Microelectronic packaging and components |
| 07/15/2004 | WO2004049400A3 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition |
| 07/15/2004 | WO2004047148A3 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 07/15/2004 | WO2004042794A3 Removal of particle contamination on patterned slilicon/silicon dioxide using supercritical carbon dioxide/chemical formulations |
| 07/15/2004 | WO2004042784A8 Stabilized semiconductor nanocrystals |
| 07/15/2004 | WO2004041972A3 Gas layer formation materials |
| 07/15/2004 | WO2004040623A3 An improved barrier layer for a copper metallization layer including a low k dielectric |
| 07/15/2004 | WO2004038787A3 Using scatterometry to optimize circuit structure manufacturing processes |
| 07/15/2004 | WO2004038764A3 Semiconductor device with quantum well and etch stop |
| 07/15/2004 | WO2004030083A3 User interface for quantifying wafer non-uniformities and graphically explore significance |
| 07/15/2004 | WO2004027865A3 Support structures for wirebond regions of contact pads over low modulus materials |
| 07/15/2004 | WO2004017361A3 Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material |
| 07/15/2004 | WO2004017143A3 Method for irradiating a resist |
| 07/15/2004 | WO2004015741A3 Notch-free etching of high aspect soi structures using alternating deposition and etching and pulsed plasma |
| 07/15/2004 | WO2004013697A3 Micro-contact printing method |
| 07/15/2004 | WO2004008246A3 Method and system for context-specific mask writing |
| 07/15/2004 | WO2004003970A9 A semiconductor device and method of fabricating a semiconductor device |
| 07/15/2004 | WO2004000718A3 Bridges for microelectromechanical structures |
| 07/15/2004 | WO2003107350B1 Magnetoresistive random access memory with reduced switching field |
| 07/15/2004 | WO2003106328A3 Micromechanical component and corresponding production method |
| 07/15/2004 | WO2003104344A8 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization |
| 07/15/2004 | WO2003098636A3 STACKED 1T-nMEMORY CELL STRUCTURE |
| 07/15/2004 | WO2003085742A8 Method for forming a modified semiconductor having a plurality of band gaps |
| 07/15/2004 | WO2003084688A3 Method and system for providing a thin film |
| 07/15/2004 | WO2003079240A3 System and method for placement of dummy metal fills while preserving device matching and/or limiting capacitance increase |