Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2004
07/22/2004US20040140520 Provide a higher operating speed
07/22/2004US20040140518 Semiconductor devices and methods for fabricating the same
07/22/2004US20040140517 LDMOS transistor with high voltage source and drain terminals hideaki tsuchiko
07/22/2004US20040140515 Method for manufacturing electro-optical substrate, method for manufacturing electro-optical apparatus, and electro-optical apparatus
07/22/2004US20040140513 Atomic layer deposition of CMOS gates with variable work functions
07/22/2004US20040140512 Integrated device with Schottky diode and MOS transistor and related manufacturing process
07/22/2004US20040140510 Electrically erasable read only memory; efficiency
07/22/2004US20040140509 Non-volatile memory and fabricating method thereof
07/22/2004US20040140508 Forming a first insulating film on a semiconductor substrate; removing part of the first insulating film; forming a second insulating film forming an undoped semiconductor film on first and second insulating films; implanting an impurity; removing
07/22/2004US20040140507 Method of building a CMOS structure on thin SOI with source/drain electrodes formed by in situ doped selective amorphous silicon
07/22/2004US20040140506 Enhanced T-gate structure for modulation doped field effect transistors
07/22/2004US20040140505 Electrostatic discharge device protection structure
07/22/2004US20040140504 Low power flash memory cell and method
07/22/2004US20040140503 Semiconductor device and method for fabricating the same
07/22/2004US20040140502 Semiconductor integrated circuit device and a method of manufacturing the same
07/22/2004US20040140501 Integrated circuit devices having fuse structures including buffer layers and methods of fabricating the same
07/22/2004US20040140500 Stack gate with tip vertical memory and method for fabricating the same
07/22/2004US20040140499 Method of manufacturing a semiconductor device
07/22/2004US20040140498 Dual-bit nitride read only memory cell
07/22/2004US20040140497 Forming deep N well on a P-type substrate; forming single polysilicon EEPROM (Electrically Erasable Programmable Read Only Memory), cell, wherein the EEPROM cell is isolated from the P-type substrate by the N well
07/22/2004US20040140496 Bitline structure for DRAM and method of forming the same
07/22/2004US20040140495 Semiconductor integrated circuit device and the process of manufacturing the same having poly-silicon plug, wiring trenches and bit lines formed in the wiring trenches having a width finer than a predetermined size
07/22/2004US20040140494 Contact structure
07/22/2004US20040140493 Ferroelectric memory and method for fabricating the same
07/22/2004US20040140492 Thin film magnetic memory device
07/22/2004US20040140491 Deep implanted region for a cmos imager
07/22/2004US20040140490 Sputtering aluminum under high pressure; reduced power source
07/22/2004US20040140487 Semiconductor device
07/22/2004US20040140486 Dynamic random access memory
07/22/2004US20040140484 Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features
07/22/2004US20040140483 Semiconductor integrated circuit and fabrication method for same
07/22/2004US20040140482 Semiconductor device and process for producing semiconductor device
07/22/2004US20040140481 Optimized blocking impurity placement for SiGe HBTs
07/22/2004US20040140480 Semiconductor device and power amplifier using the same
07/22/2004US20040140479 Compliant substrate for a heteroepitaxial structure and method for making same
07/22/2004US20040140472 Light emitting device
07/22/2004US20040140471 Semiconductor device and manufacturing method thereof
07/22/2004US20040140470 Semiconductor device and method of fabricating the same
07/22/2004US20040140469 Panel of a flat display and method of fabricating the panel
07/22/2004US20040140468 Buffer layer for promoting electron mobility and thin film transistor having the same
07/22/2004US20040140467 Semiconductor device having pad
07/22/2004US20040140466 Semiconductor device that can measure timing difference between input and output signals
07/22/2004US20040140442 Method and apparatus for accessing microelectronic workpiece containers
07/22/2004US20040140437 Electron beam array write head system and method
07/22/2004US20040140436 Transfer method and apparatus, exposure method and apparatus, method of manufacturing exposure apparatus, and device manufacturing method
07/22/2004US20040140418 System and method for lithography process monitoring and control
07/22/2004US20040140365 Substrate treating apparatus
07/22/2004US20040140298 Iced film substrate cleaning
07/22/2004US20040140297 Laser irradiation method, method for manufacturing semiconductor device, and laser irradiation system
07/22/2004US20040140291 Forming an acetic salt in a solution by reacting in acid with hydroxide;applying acetic salt to integrated circuit to etch the copper layer;supplying acid to solution to completely consume the hydroxide; etching the copper layer with acetic salt
07/22/2004US20040140289 Method for selectively etching organosilicate glass with respect to a doped silicon carbide
07/22/2004US20040140288 Wet etch of titanium-tungsten film
07/22/2004US20040140287 Edge and bevel cleaning process and system
07/22/2004US20040140217 Noble metal contacts for plating applications
07/22/2004US20040140206 Method for fabricating silicon targets
07/22/2004US20040140205 Rotational and reciprocal radial movement of a sputtering magnetron
07/22/2004US20040140204 Magnetron cathode and magnetron sputtering apparatus comprising the same
07/22/2004US20040140199 Plating apparatus, plating cup and cathode ring
07/22/2004US20040140197 Sputtering target, Al interconnection film, and electronic component
07/22/2004US20040140196 Shaping features in sputter deposition
07/22/2004US20040140176 Convey device for a plate-like workpiece
07/22/2004US20040140122 Product comprising a substrate and a chip attached to the substrate
07/22/2004US20040140053 Method and apparatus for micro-jet enabled, low-energy ion generation and transport in plasma processing
07/22/2004US20040140052 Method for aligning key in semiconductor device
07/22/2004US20040140040 Ceramic substrate and process for producing the same
07/22/2004US20040140039 Adhesive tape applying method and apparatus
07/22/2004US20040140036 Plasma processing method and apparatus
07/22/2004US20040139991 Using nitrogen laden isopropyl alcohol as dynamic barrier that wipes down surface during rinsing and drying; entraining water and contaminants
07/22/2004US20040139986 Imparting turbulence; increasing circulation of supercritical fluid; pressure chamber with rotable impeller and drive shaft
07/22/2004US20040139985 Determining endpoint; optimizing and controlling process; optical thickness measurement
07/22/2004US20040139982 Sonic-energy cleaner system with gasified fluid
07/22/2004US20040139917 Plasma processing apparatus
07/22/2004US20040139916 Applying the particles to be separated on a substrate supported membrane, such that the particles are mobile across the surface of the substrate supported membrane; providing an electrical field; temporarily modifying the electrical field and/or adding a substrate supported membrane
07/22/2004US20040139915 Plasma CVD apparatus and dry cleaning method of the same
07/22/2004US20040139820 a powder batch and method of making copper metal particles that are substantially spherical, have a weight average particle size of less than about 5 mu m and a narrow particle size distribution and high crystallinity
07/22/2004US20040139626 Substrate drying method and apparatus
07/22/2004US20040139603 Wired board with bump electrode and method of fabricating the same
07/22/2004US20040139601 Method for cutting a wafer
07/22/2004US20040139589 Method of producing circuit carriers with integrated passive components
07/22/2004US20040139574 Substrate cleaning device and substrate processing facility
07/22/2004DE202004007917U1 A device with a receiver for reception of a plate-like workpiece (9), especially a silicon wafer, useful in semiconductor technology e.g. for dealing with silicon wafers
07/22/2004DE19830161B4 Verfahren zur Herstellung einer Induktionsspule einer Halbleitereinrichtung A process for producing an induction coil of a semiconductor device
07/22/2004DE19758704B4 Self-aligned process for semiconductor memory production
07/22/2004DE19757269B4 Verfahren zur Herstellung eines Silicium-Auf-Isolator-Halbleitersubstrats A method for producing a silicon-on-insulator semiconductor substrate
07/22/2004DE19727396B4 Polysilizium-Dünnschichttransistor mit Silizid und Herstellungsverfahren dafür Polysilicon thin film transistor with silicide and production method thereof
07/22/2004DE10361649A1 Verfahren zum Herstellen einer Flüssigkristallanzeigevorrichtung A method of manufacturing a liquid crystal display device
07/22/2004DE10356766A1 Laserbearbeitungsverfahren Laser processing method
07/22/2004DE10355666A1 Thin film transistor array substrate for LCD panel, comprises gate insulation pattern and protection film pattern formed in region other than region where transparent electrode pattern is formed
07/22/2004DE10354866A1 Fabrication of liquid crystal display device used to display picture, comprises forming passivation layer on substrate including pixel electrode, forming common electrode, and injecting liquid crystal material between substrates
07/22/2004DE10353773A1 SiGe-Kontakt eines vertikalen Gates für eine Nachätzbehandlung des Gateleiters SiGe contact of a vertical gates for a Nachätzbehandlung the gate conductor
07/22/2004DE10351775A1 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung Laser processing method and laser processing apparatus
07/22/2004DE10347462A1 Bodenelektrode eines Kondensators einer Halbleitervorrichtung und Verfahren zur Herstellung derselben Bottom electrode of a capacitor of a semiconductor device and method of manufacturing the same
07/22/2004DE10346581A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
07/22/2004DE10334435A1 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation
07/22/2004DE10334434A1 Verfahren und Gerät zum Reinigen eines Halbleitersubstrats Method and apparatus for cleaning a semiconductor substrate
07/22/2004DE10317747B3 Process for control of thickness reduction of semiconductor elements involves use of a simple test structure with a series of trenches of different widths formed in a plate
07/22/2004DE10317115A1 Halbleiter-Waferteilungsanordnung und Halbleitereinrichtungs-Herstellungsverfahren Semiconductor wafer dividing device and semiconductor device manufacturing method
07/22/2004DE10317098A1 Bipolar transistor production comprises formation of semiconductor substrate with n type collector region
07/22/2004DE10312662A1 Halbleitereinrichtungsherstellungsanordnung und Halbleitereinrichtungsherstellungsverfahren zum Bilden von Halbleiterchips durch Teilen von Halbleiterwafern A semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing the semiconductor wafers
07/22/2004DE10309502A1 Lothügelstruktur und Verfahren zur Herstellung derselben Lothügelstruktur and methods for making the same