Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2004
07/13/2004US6762474 Method and apparatus for temperature compensation of read-only memory
07/13/2004US6762470 Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized
07/13/2004US6762469 High performance CMOS device structure with mid-gap metal gate
07/13/2004US6762468 Semiconductor device and method of manufacturing the same
07/13/2004US6762465 BiCMOS inverter
07/13/2004US6762464 N-p butting connections on SOI substrates
07/13/2004US6762463 MOSFET with SiGe source/drain regions and epitaxial gate dielectric
07/13/2004US6762461 Semiconductor element protected with a plurality of zener diodes
07/13/2004US6762460 Protection circuit provided in semiconductor circuit
07/13/2004US6762459 Method for fabricating MOS device with halo implanted region
07/13/2004US6762458 High voltage transistor and method for fabricating the same
07/13/2004US6762457 LDMOS device having a tapered oxide
07/13/2004US6762456 Multiple conductive plug structure including at least one conductive plug region and at least one between-conductive-plug region for lateral RF MOS devices
07/13/2004US6762455 Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component
07/13/2004US6762454 Stacked polysilicon layer for boron penetration inhibition
07/13/2004US6762453 Programmable memory transistor
07/13/2004US6762452 Non-volatile memory cells integrated on a semiconductor substrate
07/13/2004US6762451 Nucleation for improved flash erase characteristics
07/13/2004US6762450 Method of forming a capacitor and a capacitor construction
07/13/2004US6762449 Semiconductor integrated circuit device and the process of manufacturing the same having poly-silicon plug, wiring trenches and bit lines formed in the wiring trenches having a width finer than a predetermined size
07/13/2004US6762448 Dielectric fin structure is chosen such that a significant stress is induced in the single-crystal silicon material, enhanced mobility can be achieved
07/13/2004US6762447 Field-shield-trench isolation for gigabit DRAMs
07/13/2004US6762446 Integrated capacitive device with hydrogen degradable dielectric layer protected by getter layer
07/13/2004US6762445 DRAM memory cell with dummy lower electrode for connection between upper electrode and upper layer interconnect
07/13/2004US6762444 Semiconductor integrated circuit device and a method of manufacturing the same
07/13/2004US6762443 Vertical transistor and transistor fabrication method
07/13/2004US6762442 Semiconductor device carrying a plurality of circuits
07/13/2004US6762434 Electrical print resolution test die
07/13/2004US6762433 Semiconductor product wafer having vertically and horizontally arranged patterned areas including a limited number of test element group regions
07/13/2004US6762431 Wafer-level package with test terminals
07/13/2004US6762422 Analyzer/observer
07/13/2004US6762417 System in which a rotating body is connected to a rotary shaft in an ion implanter
07/13/2004US6762399 Shape measurement device
07/13/2004US6762367 Electronic package having high density signal wires with low resistance
07/13/2004US6762268 Radiation transparent, sensitivity, chemical resistance
07/13/2004US6762136 Method for rapid thermal processing of substrates
07/13/2004US6762135 Method of cleaning a polishing pad conditioner
07/13/2004US6762134 Metal-assisted chemical etch to produce porous group III-V materials
07/13/2004US6762133 System and method for control of hardmask etch to prevent pattern collapse of ultra-thin resists
07/13/2004US6762132 Compositions for dissolution of low-K dielectric films, and methods of use
07/13/2004US6762131 Method for large-scale fabrication of atomic-scale structures on material surfaces using surface vacancies
07/13/2004US6762130 Method of photolithographically forming extremely narrow transistor gate elements
07/13/2004US6762129 Dry etching method, fabrication method for semiconductor device, and dry etching apparatus
07/13/2004US6762128 Apparatus and method for manufacturing a semiconductor circuit
07/13/2004US6762127 Etch process for dielectric materials comprising oxidized organo silane materials
07/13/2004US6762126 Coating a spin on glass film, including a polysilazane, on a dielectric layer having the wire pattern exposed by chemical mechanical polishing; baking, hardening, heating and oxdidation, degassing, annealing; smooothness
07/13/2004US6762125 Modified facet etch to prevent blown gate oxide and increase etch chamber life
07/13/2004US6762123 Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method
07/13/2004US6762120 Semiconductor device and method for fabricating the same
07/13/2004US6762118 Package having array of metal pegs linked by printed circuit lines
07/13/2004US6762117 Method of fabricating metal redistribution layer having solderable pads and wire bondable pads
07/13/2004US6762116 System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon
07/13/2004US6762115 Chip structure and process for forming the same
07/13/2004US6762114 Methods for transistor gate fabrication and for reducing high-k gate dielectric roughness
07/13/2004US6762113 Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
07/13/2004US6762112 Method for manufacturing isolating structures
07/13/2004US6762111 Method of manufacturing a semiconductor device
07/13/2004US6762110 Method of manufacturing semiconductor device having capacitor
07/13/2004US6762109 Method of manufacturing semiconductor device with reduced number of process steps for capacitor formation
07/13/2004US6762108 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed
07/13/2004US6762106 Semiconductor device and method for fabricating the same
07/13/2004US6762105 Short channel transistor fabrication method for semiconductor device
07/13/2004US6762104 Method for fabricating semiconductor device with improved refresh characteristics
07/13/2004US6762103 Method of forming an isolation film in a semiconductor device
07/13/2004US6762102 Methods for manufacturing semiconductor devices and semiconductor devices
07/13/2004US6762101 Damascene double-gate FET
07/13/2004US6762100 Mask ROM cell and method of fabricating the same
07/13/2004US6762099 Method for fabricating buried strap out-diffusions of vertical transistor
07/13/2004US6762098 Trench DMOS transistor with embedded trench schottky rectifier
07/13/2004US6762097 Semiconductor device and method for manufacturing the same
07/13/2004US6762096 Method for forming a polysilicon spacer with a vertical profile
07/13/2004US6762095 Method of fabricating flash memory
07/13/2004US6762094 Nanometer-scale semiconductor devices and method of making
07/13/2004US6762093 High coupling floating gate transistor
07/13/2004US6762092 Scalable self-aligned dual floating gate memory cell array and methods of forming the array
07/13/2004US6762091 Methods for manufacturing semiconductor devices having a metal layer
07/13/2004US6762090 Method for fabricating a capacitor
07/13/2004US6762089 Method for manufacturing a memory device
07/13/2004US6762087 Process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor
07/13/2004US6762086 Method for fabricating semiconductor device with triple well structure
07/13/2004US6762085 Method of forming a high performance and low cost CMOS device
07/13/2004US6762084 Integrated circuit having a memory cell transistor with a gate oxide layer which is thicker than the gate oxide layer of a peripheral circuit transistor
07/13/2004US6762083 Method for manufacturing heterojunction field effect transistor device
07/13/2004US6762082 Semiconductor device and method of fabricating the same
07/13/2004US6762081 Method for fabricating a semiconductor device
07/13/2004US6762080 Method of manufacturing a semiconductor device having a cathode and an anode from a wafer
07/13/2004US6762078 Semiconductor package having semiconductor chip within central aperture of substrate
07/13/2004US6762077 Integrated sensor packages and methods of making the same
07/13/2004US6762076 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
07/13/2004US6762075 Semiconductor module and producing method therefor
07/13/2004US6762074 Method and apparatus for forming thin microelectronic dies
07/13/2004US6762071 Method for fabricating a metal-oxide electron tunneling device for solar energy conversion
07/13/2004US6762068 Transistor with variable electron affinity gate and methods of fabrication and use
07/13/2004US6762066 Method for fabricating a semiconductor structure using a protective layer, and semiconductor structure
07/13/2004US6762065 Semiconductor device having ferroelectric capacitor and method for manufacturing the same
07/13/2004US6762064 Process for fabrication of a ferrocapacitor
07/13/2004US6762063 Method of fabricating non-volatile ferroelectric transistors
07/13/2004US6762007 A blends comprising a partially etherified polyhydroxystyrene-p and a partially esterified polyhydroxystyrene-p with pivalic acid, an acid generators; photolithography activated by high-energy ultraviolet ray
07/13/2004US6762005 Sensitivity, definition, and stability of latent image before development, can yield a patterned resist thin film with high contrast, invites less scum and has satisfactory thermal resistance
07/13/2004US6762001 Method of fabricating an exposure mask for semiconductor manufacture