| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/22/2004 | WO2004044075A3 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
| 07/22/2004 | WO2004041454A3 Substrate processing apparatus and method |
| 07/22/2004 | WO2004040622A3 Nickel silicide with reduced interface roughness |
| 07/22/2004 | WO2004040621A3 Method and apparatus for planarizing a semiconductor wafer |
| 07/22/2004 | WO2004040616A3 Field effect transistor and method for production thereof |
| 07/22/2004 | WO2004039886A3 Flip-chip system and method of making same |
| 07/22/2004 | WO2004038766A3 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging |
| 07/22/2004 | WO2004037711A3 Processes for hermetically packaging wafer level microscopic structures |
| 07/22/2004 | WO2004036627A3 Plasma system and method for anistropically etching structures into a substrate |
| 07/22/2004 | WO2004031072A3 Electrostatically driven lithography |
| 07/22/2004 | WO2004027873A3 N-p butting connections on soi substrates |
| 07/22/2004 | WO2004027863A3 Hybrid card |
| 07/22/2004 | WO2004021420A9 Fabrication method for a monocrystalline semiconductor layer on a substrate |
| 07/22/2004 | WO2004017383A3 Low termperature deposition of silicon oxides and oxynitrides |
| 07/22/2004 | WO2004015854A3 Monolithic, software-definable circuit including a power amplifier |
| 07/22/2004 | WO2004013900A3 System and method for manufacturing embedded conformal electronics |
| 07/22/2004 | WO2004009861A3 Method to form ultra high quality silicon-containing compound layers |
| 07/22/2004 | WO2004008493A9 Method and apparatus for supporting semiconductor wafers |
| 07/22/2004 | WO2004008255A8 Method and apparatus for measuring critical dimensions with a particle beam |
| 07/22/2004 | WO2004003963A3 Plasma processor with electrode simultaneously responsive to plural frequencies |
| 07/22/2004 | WO2003107394A3 Organic electroluminescent device |
| 07/22/2004 | WO2003100835A3 Gate oxide process methods for high performance mos transistors by reducing remote scattering |
| 07/22/2004 | WO2003098662A3 PLASMA ETCHING OF Cu-CONTAINING LAYERS |
| 07/22/2004 | WO2003094226A3 Contacting of nanotubes |
| 07/22/2004 | WO2003090445A3 Wide bandgap digital radiation imaging array |
| 07/22/2004 | WO2003088314A3 Remote monitoring system for chemical liquid delivery |
| 07/22/2004 | WO2003065120A3 Microcontact printing |
| 07/22/2004 | WO2003003421A3 Optical chip packaging via through hole |
| 07/22/2004 | WO2002082510A9 Single transistor rare earth manganite ferroelectric nonvolatile memory cell |
| 07/22/2004 | US20040143806 Wiring diagram verifying method, program, and apparatus |
| 07/22/2004 | US20040143805 Device for determining the mask version utilized for each metal layer of an integrated circuit |
| 07/22/2004 | US20040143418 Apparatus for predicting life of rotary machine and equipment using the same |
| 07/22/2004 | US20040143410 Method and apparatus to dynamically recalibrate VLSI chip thermal sensors through software control |
| 07/22/2004 | US20040143370 programmable logic controller in communication with the system control computer and operatively coupled to electrically controlled valves; refresh time for control of the valves is less than 10 millisecond so repetitive cycling is fast |
| 07/22/2004 | US20040143357 Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
| 07/22/2004 | US20040143356 Multi-electron beam exposure method and apparatus |
| 07/22/2004 | US20040143353 Method for managing semiconductor manufacturing equipment and system for managing semiconductor manufacturing line |
| 07/22/2004 | US20040143082 Polysiloxane, process for production thereof and radiation-sensitive resin composition |
| 07/22/2004 | US20040142836 Resist and etching by-product removing composition and resist removing method using the same |
| 07/22/2004 | US20040142835 Washing liquid for semiconductor substrate |
| 07/22/2004 | US20040142641 Polishing pad and method |
| 07/22/2004 | US20040142640 Polishing processes for shallow trench isolation substrates |
| 07/22/2004 | US20040142583 Spring interconnect structures |
| 07/22/2004 | US20040142582 Thin film structure from LILAC annealing |
| 07/22/2004 | US20040142581 Method for manufacturing a semiconductor device |
| 07/22/2004 | US20040142580 Silylation treatment unit and method |
| 07/22/2004 | US20040142579 Semiconductor device and method for fabricating the same |
| 07/22/2004 | US20040142578 Thin film nanostructures |
| 07/22/2004 | US20040142577 Method for producing material of electronic device |
| 07/22/2004 | US20040142576 Semiconductor fabrication method for making small features |
| 07/22/2004 | US20040142575 Large area printing method for integrating device and circuit components |
| 07/22/2004 | US20040142574 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/22/2004 | US20040142573 Method for manufacturing MOSFET semiconductor device |
| 07/22/2004 | US20040142571 Local dry etching method |
| 07/22/2004 | US20040142570 Post high voltage gate dielectric pattern plasma surface treatment |
| 07/22/2004 | US20040142569 Methods for fabricating semiconductor devices |
| 07/22/2004 | US20040142568 Method of manufacturing a CMOS image sensor |
| 07/22/2004 | US20040142567 Semiconductor device and method of manufacturing the same |
| 07/22/2004 | US20040142566 Continuous bleed-and-feed process and equipment |
| 07/22/2004 | US20040142565 Single and multilevel rework |
| 07/22/2004 | US20040142564 Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
| 07/22/2004 | US20040142563 Methods and systems for exchanging messages in a controller for a substrate processing system |
| 07/22/2004 | US20040142562 Method of fabricating a shallow trench isolation structure |
| 07/22/2004 | US20040142561 Novel method of fabricating barrierless and embedded copper damascene interconnects |
| 07/22/2004 | US20040142560 Method of selective growth of carbon nano-structures on silicon substrates |
| 07/22/2004 | US20040142559 Technique for high efficiency metalorganic chemical vapor deposition |
| 07/22/2004 | US20040142557 Deposition of tungsten nitride |
| 07/22/2004 | US20040142554 Underlayer protection for the dual damascene etching |
| 07/22/2004 | US20040142553 Methods of manufacturing semiconductor devices |
| 07/22/2004 | US20040142552 Conductive bump for semiconductor device and method for making the same |
| 07/22/2004 | US20040142551 Semiconductor device and a method of manufacturing the same |
| 07/22/2004 | US20040142550 Method for producing III-IV group compound semiconductor layer, method for producing semiconductor light emitting element, and vapor phase growing apparatus |
| 07/22/2004 | US20040142549 Method for forming semiconductor device bonding pads |
| 07/22/2004 | US20040142548 Method for production of contacts on a wafer |
| 07/22/2004 | US20040142547 Method of fabricating non-volatile memory |
| 07/22/2004 | US20040142546 Semiconductor device and method for fabricating the same |
| 07/22/2004 | US20040142544 Semiconductor device including semiconductor thin films having different crystallinity, substrate of the same, and manufacturing method of the same, and liquid crystal display amd manufacturing method of the same |
| 07/22/2004 | US20040142543 Method of fabricating a semiconductor device utilizing a catalyst material solution |
| 07/22/2004 | US20040142542 Film or layer made of semi-conductive material and method for producing said film or layer |
| 07/22/2004 | US20040142541 Strained silicon-on-insulator (ssoi) and method to form the same |
| 07/22/2004 | US20040142540 Wafer bonding for three-dimensional (3D) integration |
| 07/22/2004 | US20040142539 Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument |
| 07/22/2004 | US20040142538 Method of manufacturing semiconductor device |
| 07/22/2004 | US20040142537 Strained-silicon channel CMOS with sacrificial shallow trench isolation oxide liner |
| 07/22/2004 | US20040142536 Methods of forming materials comprising tungsten and nitrogen, and methods of forming capacitors |
| 07/22/2004 | US20040142535 Method for forming metal-insulator-metal capacitor of semiconductor device |
| 07/22/2004 | US20040142534 Semiconductor device having trench isolation structure and method of fabricating the same |
| 07/22/2004 | US20040142532 Method for forming salicide in semiconductor device |
| 07/22/2004 | US20040142531 Method of forming a stacked capacitor structure with increased surface area for a DRAM device |
| 07/22/2004 | US20040142530 Memory cell structures including a gap filling layer and methods of fabricating the same |
| 07/22/2004 | US20040142529 Methods of manufacturing semiconductor memory devices |
| 07/22/2004 | US20040142528 Decoupling capacitor for high frequency noise immunity |
| 07/22/2004 | US20040142527 High voltage tolerant ESD design for analog and RF applications in deep submicron CMOS technologies |
| 07/22/2004 | US20040142526 Fuse boxes with guard rings for integrated circuits and integrated circuits including the same |
| 07/22/2004 | US20040142525 Method of manufacturing a semiconductor device |
| 07/22/2004 | US20040142524 Insulated gate field effect transistor having passivated Schottky barriers to the channel |
| 07/22/2004 | US20040142523 Method of forming vertical mosfet with ultra-low on-resistance and low gate charge |
| 07/22/2004 | US20040142522 Semiconductor device |
| 07/22/2004 | US20040142521 Methods for manufacturing a semiconductor device |
| 07/22/2004 | US20040142520 Soi device with reduced drain induced barrier lowering |