| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/29/2004 | US20040144315 Semiconductor substrate processing chamber and accessory attachment interfacial structure |
| 07/29/2004 | US20040144312 Cleaning a polishing pad surface subsequent to chemical-mechanical polishing a wafer surface of copper; applying a cleaning composition ofethylenediamine, an acid to bring the pH from about 8 to about 11; and deionized water; reducing polishing defects in semiconductor wafers |
| 07/29/2004 | US20040144311 Apparatus and method for hybrid chemical processing |
| 07/29/2004 | US20040144310 CVD apparatuses and methods of forming a layer over a semiconductor substrate |
| 07/29/2004 | US20040143989 Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components |
| 07/29/2004 | US20040143962 Universal clamping mechanism |
| 07/29/2004 | DE4111060B4 Positiv arbeitende lichtempfindliche Zusammensetzung The positive-working light-sensitive composition |
| 07/29/2004 | DE19842441B4 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 07/29/2004 | DE19825524B4 Dünnfilmtransistor und Verfahren zu seiner Herstellung A thin film transistor and method for its preparation |
| 07/29/2004 | DE19815136B4 Integrierte Halbleiterschaltung mit einem Kondensator und einem Sicherungselement und Herstellungsverfahren A semiconductor integrated circuit having a capacitor and a fuse element and manufacturing method |
| 07/29/2004 | DE19811624B4 Aktives Paneel für eine LCD und Herstellungsverfahren für ein aktives Paneel einer LCD Active panel for an LCD and method for manufacturing an active panel of an LCD |
| 07/29/2004 | DE19740534B4 Halbleitervorrichtung mit mindestens zwei Verbindungsebenen sowie Verfahren zu deren Hertellung A semiconductor device comprising at least two connecting levels as well as processes for their Hertel Lung |
| 07/29/2004 | DE19726835B4 Photomaske für einen Prozeßspielraumtest und ein Verfahren zum Durchführen eines Prozeßspielraumtests unter Verwendung dieser Maske Photomask for a process margin test and a method for performing a process margin test using this mask |
| 07/29/2004 | DE19723330B4 Verfahren zur Herstellung von Dünnschichttransistoren und Dünnschichttransistor A process for the manufacture of thin film transistors and thin film transistor |
| 07/29/2004 | DE19718394B4 Dünnfilmtransistor und Verfahren zu seiner Herstellung A thin film transistor and method for its preparation |
| 07/29/2004 | DE10361384A1 Strukturübertragung bei der Bauelementeherstellung Pattern transfer in the device fabrication |
| 07/29/2004 | DE10357919A1 Abbildungs-Anordnung und Verfahren zu deren Herstellung Imaging arrangement and method for their preparation |
| 07/29/2004 | DE10343564A1 Verfahren zum Herstellen eines Oxinitridfilms A method for producing a oxynitride film |
| 07/29/2004 | DE10301827A1 Power semiconductor measurement arrangement for measuring chips still contained within a wafer, whereby a wafer support has individual recesses in which testing needles are inserted to ensure they are precisely positioned |
| 07/29/2004 | DE10301482A1 Process and device to crystallize amorphous semiconductor especially amorphous silicon layers uses at least two successive melting radiation pulses separated by one microsecond |
| 07/29/2004 | DE10301245A1 Method of processing a workpiece and attaching to a carrier especially for silicon semiconductor wafers permits a simple separation and handling |
| 07/29/2004 | DE10297171T5 Wafermaschine Wafer machine |
| 07/29/2004 | DE10297170T5 Einheitlicher Rahmen für ein Handhabungssystem für Halbleitermaterial Uniform framework for a handling system for semiconductor material |
| 07/29/2004 | DE10297169T5 Handhabungssystem für Halbleitermaterial Handling system for semiconductor material |
| 07/29/2004 | DE10297167T5 Universelles modulares Wafer-Transportsystem Universal modular wafer transport system |
| 07/29/2004 | DE10297034T5 Fluoriertes aromatisches Polymer und Verwendung davon Fluorinated aromatic polymer and use thereof |
| 07/29/2004 | DE10153619B4 Verfahren zur Herstellung eines Gate-Schichtenstapels für eine integrierte Schaltungsanordnung und integrierte Schaltungsanordnung A method for producing a gate-layer stack for an integrated circuit arrangement and integrated circuit arrangement |
| 07/29/2004 | DE10140827B4 Vorrichtung zum Debonden von Dünnwafern Apparatus for Debonding of thin wafers |
| 07/29/2004 | DE10005484B4 Verfahren zum Ausbilden einer dünnen kristallisierten Schicht A method of forming a thin crystallized layer |
| 07/29/2004 | CA2511842A1 Method for the production of a semiconductor component |
| 07/28/2004 | EP1441426A1 Method for fabricating semiconductor light emitting element, semiconductor light emitting element, method for fabricating semiconductor element, semiconductor element, method for fabricating element and element |
| 07/28/2004 | EP1441393A2 Integrated semiconductor device and method of manufacturing thereof |
| 07/28/2004 | EP1441392A1 Magnetic memory device |
| 07/28/2004 | EP1441391A2 Dual-trench isolated crosspoint memory array and method for fabricating same |
| 07/28/2004 | EP1441390A2 A method for forming a conductive copper structure |
| 07/28/2004 | EP1441389A2 Electronic parts packaging structure and method of manufacturing the same |
| 07/28/2004 | EP1441388A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 07/28/2004 | EP1441387A2 Etching method |
| 07/28/2004 | EP1441386A1 Method and pad for polishing wafer |
| 07/28/2004 | EP1441385A1 METHOD OF FORMING SCRIBE LINE ON SEMICONDUCTOR WAFER, AND SCRIBE LINE FORMING DEVICE |
| 07/28/2004 | EP1441381A2 Cooling of a device for influencing an electron beam |
| 07/28/2004 | EP1441295A2 Expert system for guidance through a design flow for integrated circuits |
| 07/28/2004 | EP1441258A2 Alignment method and apparatus and exposure apparatus |
| 07/28/2004 | EP1441257A2 Illumination apparatus, projection exposure apparatus, and device fabricating method |
| 07/28/2004 | EP1441256A1 Radiation-sensitive resin composition |
| 07/28/2004 | EP1441233A1 Method and apparatus for inspecting wire breaking of an integrated circuit |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441048A2 Plating apparatus, plating cup and cathode ring |
| 07/28/2004 | EP1441043A2 Supply of gas to semiconductor process chamber |
| 07/28/2004 | EP1441042A1 Precursors for depositing silicon containing films and processes thereof |
| 07/28/2004 | EP1440957A2 Ceramic heater |
| 07/28/2004 | EP1440931A1 Method for manufacturing metal microstructure |
| 07/28/2004 | EP1440608A1 Method for opening the plastic housing of an electronic module |
| 07/28/2004 | EP1440473A2 Thermally balanced power transistor |
| 07/28/2004 | EP1440472A2 Pattern for improved visual inspection of semiconductor devices |
| 07/28/2004 | EP1440471A2 Ball grid array with x-ray alignment mark |
| 07/28/2004 | EP1440470A2 Wirebond contact structure and method of wire bonding a microelectronic die |
| 07/28/2004 | EP1440469A2 Electronic assembly with filled no-flow underfill and methods of manufacture |
| 07/28/2004 | EP1440468A2 Multilevel poly-si tiling for semiconductor circuit manufacture |
| 07/28/2004 | EP1440467A2 Method of characterising an implantation step in a substrate of material |
| 07/28/2004 | EP1440466A2 METHOD FOR PLANARIZATION ETCH WITH i IN-SITU /i MONITORING BY INTERFEROMETRY PRIOR TO RECESS ETCH |
| 07/28/2004 | EP1440465A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 07/28/2004 | EP1440464A2 QUICK PUNCH THROUGH IGBT HAVING GATE−CONTROLLABLE i d /i i i /d /i t AND REDUCED EMI DURING INDUCTIVE TURN OFF i /i |
| 07/28/2004 | EP1440463A2 Method for cleaning silicon wafers surfaces before bonding |
| 07/28/2004 | EP1440462A1 Method and device for thinning an integrated circuit board |
| 07/28/2004 | EP1440461A2 High resistivity silicon carbide single crystal |
| 07/28/2004 | EP1440460A2 Low temperature formation of backside ohmic contacts for vertical devices |
| 07/28/2004 | EP1440459A2 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
| 07/28/2004 | EP1440458A2 Method of semiconductor nanoparticle synthesis |
| 07/28/2004 | EP1440457A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor |
| 07/28/2004 | EP1440456A1 Merie plasma reactor with showerhead rf electrode tuned to the plasma with arcing suppression |
| 07/28/2004 | EP1440450A2 Superhard dielectric compounds and methods of preparation |
| 07/28/2004 | EP1440428A2 Active matrix display device |
| 07/28/2004 | EP1440349A1 Method for the production of a semiconductor device |
| 07/28/2004 | EP1440285A1 Confocal wafer inspection system and method |
| 07/28/2004 | EP1440179A1 Chemical vapor deposition system |
| 07/28/2004 | EP1439937A2 Device and method for handling fragile objects, and manufacturing method thereof |
| 07/28/2004 | EP1439935A2 Electrochemical mechanical processing with advancible sweeper |
| 07/28/2004 | EP1439900A2 Method of etching high aspect ratio features |
| 07/28/2004 | EP1362132A4 Rejuvenation of refractory metal products |
| 07/28/2004 | EP1349969A4 Semiconductor stripping composition containing 1,3-dicarbonyl compounds |
| 07/28/2004 | EP1246706B1 Anti-reflective coating process and apparatus |
| 07/28/2004 | EP1154929A4 Passively activated valve for carrier purging |
| 07/28/2004 | EP1012878B1 Reduction of charge loss in nonvolatile memory cells by phosphorous implantation into pecvd nitride/oxynitride films |
| 07/28/2004 | EP0897594B1 Control of junction depth and channel length using generated interstitial gradients to oppose dopant diffusion |
| 07/28/2004 | CN1516917A Electron tunneling device |
| 07/28/2004 | CN1516902A Intermediate manuafcture for dual-gate logic device |
| 07/28/2004 | CN1516900A Semiconductor integrated circuit apparatus and its manufacturing method |
| 07/28/2004 | CN1516899A 半导体集成电路 The semiconductor integrated circuit |
| 07/28/2004 | CN1516896A Method of selectively alloying interconnect regions by depostion process |
| 07/28/2004 | CN1516895A Barrier enhancement process for copper interconnects |
| 07/28/2004 | CN1516894A Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 07/28/2004 | CN1516893A Dry-etching method |
| 07/28/2004 | CN1516892A Cleaning gas and etching gas |
| 07/28/2004 | CN1516891A Doped silicon deposition process in resistively heated single wafer chamber |
| 07/28/2004 | CN1516890A Device and method for plasma treatment |
| 07/28/2004 | CN1516826A Ion-beam deposition process for mfg. attenuated phase shift photomask blanks |
| 07/28/2004 | CN1516819A Objective with pupil obscuration |
| 07/28/2004 | CN1516635A Laser segmented cutting |
| 07/28/2004 | CN1516633A Controlled attenuation capillary bonding tool with planar surface |