| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/29/2004 | US20040147114 Method of manufacturing semiconductor device with contact body extending in direction of bit line to contact storage node |
| 07/29/2004 | US20040147113 Method for manufacturing conductive layer and semiconductor device |
| 07/29/2004 | US20040147112 Line-to-line reliability enhancement using a dielectric liner for a low dielectric constant interlevel and intralevel (or intermetal and intrametal) dielectric layer |
| 07/29/2004 | US20040147111 Polycarbosilane buried etch stops in interconnect structures |
| 07/29/2004 | US20040147110 Method of forming integrated circuit contacts |
| 07/29/2004 | US20040147109 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond |
| 07/29/2004 | US20040147108 Fill material for dual damascene processes |
| 07/29/2004 | US20040147107 Method for the production of an integrated circuit |
| 07/29/2004 | US20040147106 Manufacturing of a semiconductor device with a reduced capacitance between wirings |
| 07/29/2004 | US20040147105 Method for fabricating microelectronic product with attenuated bond pad corrosion |
| 07/29/2004 | US20040147104 Method of barrier-less integration with copper alloy |
| 07/29/2004 | US20040147103 Technique for high efficiency metaloganic chemical vapor deposition |
| 07/29/2004 | US20040147102 Production method for a semiconductor component |
| 07/29/2004 | US20040147101 Surface preparation prior to deposition |
| 07/29/2004 | US20040147100 Damascene method employing composite etch stop layer |
| 07/29/2004 | US20040147099 Method of producing semiconductor device |
| 07/29/2004 | US20040147098 Method for forming, by CVD, nanostructures of semi-conductor material of homogeneous and controlled size on dielectric material |
| 07/29/2004 | US20040147097 Metal reduction in wafer scribe area |
| 07/29/2004 | US20040147096 Method of manufacturing Group III nitride substrate |
| 07/29/2004 | US20040147095 Method of manufacturing a semiconductor device |
| 07/29/2004 | US20040147094 Methods of forming semiconductor devices having self aligned semiconductor mesas and contact layers and related devices |
| 07/29/2004 | US20040147093 Deep insulating trench and method for production thereof |
| 07/29/2004 | US20040147092 Method for fabricating thin film transistor display device |
| 07/29/2004 | US20040147091 Method of fabricating trench isolation structure of a semiconductor device |
| 07/29/2004 | US20040147090 Shallow trench isolation |
| 07/29/2004 | US20040147089 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 07/29/2004 | US20040147088 Capacitor |
| 07/29/2004 | US20040147087 Adjustable 3D capacitor |
| 07/29/2004 | US20040147086 Methods and apparatus for forming rhodium-containing layers |
| 07/29/2004 | US20040147085 Method for fabricating a capacitor using a metal insulator metal structure |
| 07/29/2004 | US20040147084 Method of manufacturing semiconductor device having MIM capacitor |
| 07/29/2004 | US20040147083 Working method of metal material and semiconductor apparatus fabricated by the method |
| 07/29/2004 | US20040147082 Methods of manufacturing semiconductor devices |
| 07/29/2004 | US20040147081 Dual-trench isolated crosspoint memory array and method for fabricating same |
| 07/29/2004 | US20040147080 Technique for suppression of latchup in integrated circuits (ics) |
| 07/29/2004 | US20040147079 Output prediction logic circuits with ultra-thin vertical transistors and methods of formation |
| 07/29/2004 | US20040147078 Semiconductor device and a method for manufacturing same |
| 07/29/2004 | US20040147077 Semiconductor integrated circuitry and method for manufacturing the circuitry |
| 07/29/2004 | US20040147076 Method for fabrication a flash memory device self-aligned contact |
| 07/29/2004 | US20040147075 Semiconductor memory and method of manufacturing the same |
| 07/29/2004 | US20040147074 Method for fabricating a storage capacitor |
| 07/29/2004 | US20040147073 Integrated circuit memory devices |
| 07/29/2004 | US20040147072 Method for fabricating semiconductor memories with charge trapping memory cells |
| 07/29/2004 | US20040147071 Method of manufacturing a semiconductor device |
| 07/29/2004 | US20040147070 Ultra-shallow junction formation for nano MOS devices using amorphous-si capping layer |
| 07/29/2004 | US20040147069 Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates |
| 07/29/2004 | US20040147068 Producing method of CMOS image sensor |
| 07/29/2004 | US20040147067 Semiconductor apparatus and method for manufacturing the same |
| 07/29/2004 | US20040147066 Functionalizing si wafer or Au substrate with silane or disulfide perfluorophenylazides, applying a polymer such as polystyrene or poly2-ethyl-2-oxazoline on functionalized surface, exposing polymer in preferred pattern to covalently bond substrate with polymer; applying 2nd polymer, forming microwell |
| 07/29/2004 | US20040147065 Semiconductor device and manufacturing method thereof |
| 07/29/2004 | US20040147064 Neo-wafer device and method |
| 07/29/2004 | US20040147063 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device |
| 07/29/2004 | US20040147062 Filling plugs through chemical mechanical polish |
| 07/29/2004 | US20040147059 Method for manufacturing CMOS image sensor having microlens therein with high photosensitivity |
| 07/29/2004 | US20040147058 Method of fabricating an x-ray detector array element |
| 07/29/2004 | US20040147056 Micro-fabricated device and method of making |
| 07/29/2004 | US20040147054 Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices |
| 07/29/2004 | US20040147053 Method for integrating optical devices in a single epitaxial growth step |
| 07/29/2004 | US20040147052 System and method for increasing nitrogen incorporation into a semiconductor material layer using an additional element |
| 07/29/2004 | US20040147051 Miniature optical element for wireless bonding in an electronic instrument |
| 07/29/2004 | US20040147049 Low-temperature formation method for emitter tip including copper oxide nanowire or copper nanowire and display device or light source having emitter tip manufactured using the same |
| 07/29/2004 | US20040147048 Balancing planarization of layers and the effect of underlying structure on the metrology signal |
| 07/29/2004 | US20040147047 Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device |
| 07/29/2004 | US20040147046 Method of manufacturing a semiconductor device |
| 07/29/2004 | US20040146827 Hot liner insertion/removal fixture |
| 07/29/2004 | US20040146809 superior anti-refractivity and dry-etch resistance in a bi-layer resist process employing a light source having a wavelength of 193 nm or below |
| 07/29/2004 | US20040146808 an assembly of lithographic sub-masks together forming a fictitious design mask for configuring a device pattern in a layer of a substrate |
| 07/29/2004 | US20040146803 sacrificial polymer that undergoes acid-catalyzed decomposition and a catalytic amount of a photoacid generator |
| 07/29/2004 | US20040146790 coating a photomask substrate with a chemically amplified photoresist containing a modified phenolic polymer, and an onium salt-containing chemical amplifier; coating ; baking such chemically amplified photoresist on said photomask substrate |
| 07/29/2004 | US20040146789 based on discovery that the flatness of the mask substrate was degraded after chucked depending on the surface shape of the mask substrate, and found that such degraded flatness was a major cause to lower the product yield |
| 07/29/2004 | US20040146788 Method of manufacturing a photo mask and method of manufacturing a semiconductor device |
| 07/29/2004 | US20040146737 design of a joining layer having thicker and thinner portions to prevent the crack formation upon thermal cycles |
| 07/29/2004 | US20040146701 Semiconductor substrate having SOI structure and manufacturing method and semiconductor device thereof |
| 07/29/2004 | US20040146661 Hydrogen assisted hdp-cvd deposition process for aggressive gap-fill technology |
| 07/29/2004 | US20040146659 Applying electrical potentials between electrode plates; reducing static electricity; transferring particles |
| 07/29/2004 | US20040146655 Using tris/tert-butyloxy/silanol ; cyclic process |
| 07/29/2004 | US20040146648 Overcoating a substrate with photoresist; receiving an image; determination of time; adjustment of fluid flow |
| 07/29/2004 | US20040146644 Precursors for depositing silicon containing films and processes thereof |
| 07/29/2004 | US20040146636 Fluid displacement deposition of metallic films on electronics in vessels containing supercritical fluid mixtures; interfaces |
| 07/29/2004 | US20040146448 Connecting vessel with phosphorus pentoxide to vessel with hafnium tetrachloride; cooling with liquid nitrogen; dropping fuming nitric acid into first vessel to produce nitrogen pentoxide; heating, disconnecting, refluxing; pumping, sublimation |
| 07/29/2004 | US20040146379 System and method of producing wafer |
| 07/29/2004 | US20040146295 System for detection of wafer defects |
| 07/29/2004 | US20040146236 Layered structure is etched over a depth starting from exposed surface; masked region unaffected by etching; electromigration resistance; uniformity; electrooptics, integrated circuits |
| 07/29/2004 | US20040146194 Image matching method, image matching apparatus, and wafer processor |
| 07/29/2004 | US20040146082 Laser spectral engineering for lithographic process |
| 07/29/2004 | US20040145956 Semiconductor memory device having a sub-amplifier configuration |
| 07/29/2004 | US20040145955 Semiconductor device |
| 07/29/2004 | US20040145951 Method of erasing non-volatile memory data |
| 07/29/2004 | US20040145950 Nonvolatile memory cell and operating method |
| 07/29/2004 | US20040145942 Reconfigurable logic device |
| 07/29/2004 | US20040145937 Semiconductor integrated circuit device having flip-flops that can be reset easily |
| 07/29/2004 | US20040145936 Ferroelectric memory device |
| 07/29/2004 | US20040145877 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
| 07/29/2004 | US20040145874 Method, system, and apparatus for embedding circuits |
| 07/29/2004 | US20040145855 On-chip decoupling capacitor and method of making same |
| 07/29/2004 | US20040145806 Correction of birefringence in cubic crystalline optical systems |
| 07/29/2004 | US20040145733 Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool |
| 07/29/2004 | US20040145718 Pad coating system and interlock method thereof |
| 07/29/2004 | US20040145715 Positioning system and exposure apparatus having the same |
| 07/29/2004 | US20040145713 Movable stage apparatus |