Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/02/2004US20040171190 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
09/02/2004US20040171187 Method of producing solar cell module
09/02/2004US20040171186 Method of protecting microfabricated devices with protective caps
09/02/2004US20040171183 Photodiode and method of manufacturing the same
09/02/2004US20040171181 Method for fabricating image sensor
09/02/2004US20040171180 Monitoring of VCSEL output power with photodiodes
09/02/2004US20040171178 Forming a semiconductor device feature using acquired parameters
09/02/2004US20040171177 Amorphous and polycrystalline silicon nanolaminate
09/02/2004US20040171054 Preparing biochips comprising multiple probes for use in genetic analysis; high throughput assay and medical diagnostics
09/02/2004US20040170929 Fine line printing by trimming the sidewalls of pre-developed resist image
09/02/2004US20040170924 Oxime ester photoiniators having a combined structure
09/02/2004US20040170917 Method of forming thick resist pattern
09/02/2004US20040170916 Resist material and nanofabrication method
09/02/2004US20040170915 Laser etching to roughen the surface of substrate for better adhesion; encapsulation in mold; semiconductors
09/02/2004US20040170907 produces a phase shift of the transmitted light formed with an optically translucent film made of metal, silicon, nitrogen and oxygen, and an etch stop layer is added to improve the etch selectivity of the phase shifting layer
09/02/2004US20040170825 Device cover having a gapped adhesive preform thereon for covering a device on an electronic substrate
09/02/2004US20040170819 Encapsulation using microcellular foamed materials
09/02/2004US20040170775 Shape persistent triptycene based moieties; dielectric coatings; liquid crystal displays which exhibit unusual responses when subjected to stimuli
09/02/2004US20040170772 Pump with pressure vessel with partitions for separation and discharging a solution
09/02/2004US20040170771 Moving a liquid between a substrate and a template, forming an oblique angle in a plane reducing the distance between substrate and plane and forming a dispersion
09/02/2004US20040170766 Electroless plating method and device, and substrate processing method and apparatus
09/02/2004US20040170760 Forming a dielectric layer using a hydrocarbon-containing precursor
09/02/2004US20040170552 Hafnium silicide target for forming gate oxide film and method for preparation thereof
09/02/2004US20040170524 Unleaded solder
09/02/2004US20040170407 Substrate support
09/02/2004US20040170252 EUV, XUV, and X-Ray wavelength sources created from laser plasma produced from liquid metal solutions, and nano-size particles in solutions
09/02/2004US20040170203 Multi-beam semiconductor laser element
09/02/2004US20040170076 Thin film magnetic memory device suppressing influence of magnetic field noise from power supply wiring
09/02/2004US20040170045 Ferroelectric-type nonvolatile semiconductor memory
09/02/2004US20040170044 Semiconductor integrated circuit device
09/02/2004US20040170006 Interconnect module with reduced power distribution impedance
09/02/2004US20040170003 Adjustable cassette for substrates
09/02/2004US20040169991 Active matrix substrate, method of manufacturing the same, and image sensor incorporating the same
09/02/2004US20040169940 Retainer
09/02/2004US20040169937 Optical system for providing a useful light beam influenced by polarization
09/02/2004US20040169924 Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
09/02/2004US20040169914 Catadioptric optical system and exposure apparatus having the same
09/02/2004US20040169869 Method and apparatus for inspecting an edge exposure area of a wafer
09/02/2004US20040169866 Transmission shear grating in checkerboard configuration for EUV wavefront sensor
09/02/2004US20040169853 Surface inspection apparatus
09/02/2004US20040169852 System and methods for classifying anomalies of sample surfaces
09/02/2004US20040169851 Method and apparatus for inspecting a substrate
09/02/2004US20040169850 System and method for double sided optical inspection of thin film disks or wafers
09/02/2004US20040169849 Surface foreign matter inspecting device
09/02/2004US20040169837 Enhanced lithographic displacement measurement system
09/02/2004US20040169834 Optical device for use with a lithography method
09/02/2004US20040169833 Exposure apparatus and exposure method
09/02/2004US20040169832 Vacuum chamber having instrument-mounting bulkhead exhibiting reduced deformation in response to pressure differential, and energy-beam systems comprising same
09/02/2004US20040169812 Thin film transistor array panel and liquid crystal display including the panel
09/02/2004US20040169780 Liquid crystal display
09/02/2004US20040169740 Photodiode CMOS imager with column-feedback soft-reset for imaging under ultra-low illumination and with high dynamic range
09/02/2004US20040169645 Electronic module and driving circuit board therefor
09/02/2004US20040169548 Simple step-up apparatus including level shift circuits capable of low breakdown voltage
09/02/2004US20040169541 Semiconductor integrated device and apparatus for designing the same
09/02/2004US20040169535 Semiconductor integrated circuit device
09/02/2004US20040169516 Apparatus and method for detection and measurement of environmental parameters
09/02/2004US20040169474 Fine particle sizes; narrow particle size distribution
09/02/2004US20040169460 Active matrix organic light emitting display and method of forming the same
09/02/2004US20040169444 Method of producing piezoelectric component and piezoelectric component
09/02/2004US20040169441 Apparatus to orientate a body with respect to a surface
09/02/2004US20040169337 Shaft sealing apparatus
09/02/2004US20040169316 Encapsulation method and leadframe for leadless semiconductor packages
09/02/2004US20040169293 Basic cells configurable into different types of semiconductor integrated circuits
09/02/2004US20040169292 Standoffs for centralizing internals in packaging process
09/02/2004US20040169289 Semiconductor device, a method of manufacturing the same and an electronic device
09/02/2004US20040169287 Flip-chip type semiconductor device and method of manufacturing the same
09/02/2004US20040169286 Semiconductor device and method for manufacturing the same
09/02/2004US20040169283 Integrated circuit devices and methods of forming the same that have a low dielectric insulating interlayer between conductive structures
09/02/2004US20040169282 Semiconductor device and method of fabricating the same
09/02/2004US20040169281 Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication
09/02/2004US20040169280 Etch back of interconnect dielectrics
09/02/2004US20040169279 Etch back of interconnect dielectrics
09/02/2004US20040169278 Bumped die and wire bonded board-on-chip package
09/02/2004US20040169277 Multileveled printed circuit board unit including substrate interposed between stacked bumps
09/02/2004US20040169276 Method of packaging a semiconductor chip
09/02/2004US20040169275 Area-array device assembly with pre-applied underfill layers on printed wiring board
09/02/2004US20040169274 Semiconductor devices and methods for manufacturing the same
09/02/2004US20040169273 Ball grid array semiconductor package and method of fabricating the same
09/02/2004US20040169272 Chip on board with heat sink attachment and assembly
09/02/2004US20040169271 Circuit device and method of manufacture thereof
09/02/2004US20040169269 Contacts to semiconductor fin devices
09/02/2004US20040169265 Two-stage transfer molding device to encapsulate MMC module
09/02/2004US20040169264 Integrated chip package structure using organic substrate and method of manufacturing the same
09/02/2004US20040169263 Compliant package with conductive elastomeric posts
09/02/2004US20040169262 Co-packaged control circuit, transistor and inverted diode
09/02/2004US20040169261 Lead frame and its manufacturing method
09/02/2004US20040169259 Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2CI2) interface seeding layer
09/02/2004US20040169258 Semiconductor wafer having separation groove on insulating film on dicing line region and its manufacturing method
09/02/2004US20040169257 Vertical bipolar transistor and a method of manufacture therefor
09/02/2004US20040169256 Semiconductor component
09/02/2004US20040169255 Semiconductor device and method of manufacturing same
09/02/2004US20040169253 Field effect transistor with improved isolation structures
09/02/2004US20040169252 Semiconductor device and method for fabricating the same
09/02/2004US20040169251 Semiconductor device and manufacturing method therefor
09/02/2004US20040169250 Nonvolatile semiconductor memory device with improved gate oxide film arrangement
09/02/2004US20040169248 Backside thinning of image array devices
09/02/2004US20040169246 Structure and fabricating method to make a cell with multi-self-alignment in split gate flash
09/02/2004US20040169245 Reflective layer buried in silicon and method of fabrication
09/02/2004US20040169243 Apparatus and method for fabricating arrays of atomic-scale contacts and gaps between electrodes and applications thereof
09/02/2004US20040169241 Electronic device using carbon nanotubes