Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/02/2004US20040169240 Semiconductor device and method of manufacturing semiconductor device
09/02/2004US20040169239 Multiple gate MOSFET structure with strained Si Fin body
09/02/2004US20040169238 Non-volatile semiconductor memory devices with a gate electrode having a higher work-function than a polysilicon layer
09/02/2004US20040169237 Semiconductor integrated circuit device
09/02/2004US20040169236 Process to improve Nwell-Nwell isolation with a blanket low dose high energy implant
09/02/2004US20040169235 Semiconductor device including a plurality of kinds of MOS transistors and method of manufacturing the same
09/02/2004US20040169234 Bipolar ESD protection structure
09/02/2004US20040169232 Semiconductor apparatus with improved ESD withstanding voltage
09/02/2004US20040169231 Bipolar ESD protection structure
09/02/2004US20040169230 Bipolar ESD protection structure
09/02/2004US20040169228 Semiconductor device and method of manufacturing the same
09/02/2004US20040169227 Doping methods for fully-depleted SOI structures, and device comprising the resulting doped regions
09/02/2004US20040169226 Semiconductor device having patterned SOI structure and method for fabricating the same
09/02/2004US20040169225 Isotopically pure silicon-on-insulator wafers and method of making same
09/02/2004US20040169224 Semiconductor device and manufacturing method therefor
09/02/2004US20040169223 Method of enlarging contact area of a gate electrode, semiconductor device having a surface-enlarged gate electrode, and method of manufacturing the same
09/02/2004US20040169222 Semiconductor device and method of fabricating the same
09/02/2004US20040169221 MOS transistor with elevated source and drain structures and method of fabrication thereof
09/02/2004US20040169220 Semiconductor device and manufacturing method thereof
09/02/2004US20040169219 Transistor storing multiple bits and method of manufacturing semiconductor memory including the same
09/02/2004US20040169218 Method and system for erasing a nitride memory device
09/02/2004US20040169217 Integrated DRAM process/structure using contact pillars
09/02/2004US20040169216 Semiconductor device and method of manufacturing same
09/02/2004US20040169215 Semiconductor storage location
09/02/2004US20040169214 Magnetic storage apparatus having dummy magnetoresistive effect element and manufacturing method thereof
09/02/2004US20040169213 Integrated circuit and seed layers
09/02/2004US20040169211 Avoiding shorting in capacitors
09/02/2004US20040169210 Barrier material
09/02/2004US20040169207 Integrated circuit devices having contact holes exposing gate electrodes in active regions and methods of fabricating the same
09/02/2004US20040169203 Bumped die and wire bonded board-on-chip package
09/02/2004US20040169202 Ferroelectric memory devices having an expanded plate electrode and methods for fabricating the same
09/02/2004US20040169201 Layout structure of multiplexer cells
09/02/2004US20040169197 Fabrication of a heterojunction bipolar transistor with integrated MIM capacitor
09/02/2004US20040169196 Hetero-junction bipolar transistor having a transition layer between the base and the collector
09/02/2004US20040169195 Quantum semiconductor device and method for fabricating the same
09/02/2004US20040169194 Semiconductor device
09/02/2004US20040169193 Nitride-based semiconductor element and method of forming nitride-based semiconductor
09/02/2004US20040169192 Method for producing group III nitride compounds semiconductor
09/02/2004US20040169183 Semiconductor device and method of manufacturing the same
09/02/2004US20040169182 Flat panel display and fabrication method thereof
09/02/2004US20040169180 Compound semiconductor device, production method thereof, light-emitting device and transistor
09/02/2004US20040169179 Semiconductor substrate for optoelectronic components and method for fabricating it
09/02/2004US20040169178 Diamond semiconductor and diamond semiconductor light-emitting device that uses the semiconductor
09/02/2004US20040169177 Semiconductor device and method of manufacturing the same
09/02/2004US20040169176 Methods of forming thin film transistors and related systems
09/02/2004US20040169162 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent
09/02/2004US20040169147 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus using deflector
09/02/2004US20040169140 Charged particle beam device for inspecting or structuring a specimen
09/02/2004US20040169033 Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed
09/02/2004US20040169032 Wall surfaces fitted with removal lining; detaching using light source; cleaning wastes from cracking of semiconductor wafer; irratiation substrate with flashlight to heat substrate
09/02/2004US20040169024 Methods for preparing ball grid array substrates via use of a laser
09/02/2004US20040169023 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
09/02/2004US20040169020 Method and device for installation
09/02/2004US20040169011 Vaporization of etchant; heating; reducing quantity of etchant used
09/02/2004US20040169010 Using water vapor to removal impurities; etching titanium nitride film using photoresist as masking; using oxygen, nitrogen as ashing gases; then water
09/02/2004US20040169009 Dry developing method
09/02/2004US20040169005 Methods for forming a thin film on an integrated circuit including soft baking a silicon glass film
09/02/2004US20040169003 On substrate; hardness; wear resistance
09/02/2004US20040168926 Electrodeposition; supplying solution; rotating wafers
09/02/2004US20040168908 Method of forming a conductive barrier layer having improved coverage within critical openings
09/02/2004US20040168825 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
09/02/2004US20040168771 Layout of electromagnets positioning on edges of plasma enclosure; impacting particles; controlling distribution of current signals
09/02/2004US20040168769 Plasma processing equipment and plasma processing method
09/02/2004US20040168768 Aftertreatment plasma processing; closing valve; ejecting cleaning gas through holes of showder plate; applying microwaves
09/02/2004US20040168767 Semiconductor processing apparatus
09/02/2004US20040168766 Monitoring, controlling gas supply ; evacuated enclosure; controlling circulation ratio
09/02/2004US20040168765 Transport apparatus
09/02/2004US20040168764 Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method
09/02/2004US20040168742 Module for transferring a substrate
09/02/2004US20040168712 Method for cleaning semiconductor manufacturing system
09/02/2004US20040168710 Cleaning solution and method of cleaning a semiconductor substrate using the same
09/02/2004US20040168709 Process control, monitoring and end point detection for semiconductor wafers processed with supercritical fluids
09/02/2004US20040168706 Method and apparatus for megasonic cleaning with reflected acoustic waves
09/02/2004US20040168705 Method of cleaning a surface of a material layer
09/02/2004US20040168682 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine
09/02/2004US20040168642 Film deposition system
09/02/2004US20040168641 Apparatus for manufacturing semiconductor or liquid crystal
09/02/2004US20040168640 Substrate table, production method therefor and plasma treating device
09/02/2004US20040168639 Method and device for short-term thermal-treatment of flat objects
09/02/2004US20040168638 System and method for heat treating semiconductor
09/02/2004US20040168633 Substrate processing apparatus and substrate processing method
09/02/2004US20040168631 Plasma processing apparatus having protection members
09/02/2004US20040168627 Atomic layer deposition of oxide film
09/02/2004US20040168626 Process for forming semiconductor quantum dots with superior structural and phological stability
09/02/2004US20040168588 Method of orientating a template with respect to a substrate in response to a force exerted on the template
09/02/2004US20040168586 Imprint lithography template having a feature size under 250 nm
09/02/2004US20040168338 High-speed drying apparatus
09/02/2004US20040168311 Size reduction of chip mounting system
09/02/2004US20040168287 Pressing apparatus for a semiconductor device
09/02/2004DE10359270A1 Steuerung einer Vakuumpumpe Control of a vacuum pump
09/02/2004DE10356081A1 Halbleiterbauelement Semiconductor device
09/02/2004DE10352055A1 Spannungsgesteuerter Schwingkreis A voltage controlled oscillator
09/02/2004DE10339022A1 Halbleitervorrichtung Semiconductor device
09/02/2004DE10324615A1 Electronic component comprises a semiconductor chip with contact surfaces on an active surface, a plastic housing composition in which the chip with side edges and a rear side are embedded, and a heat-conducting plate
09/02/2004DE10308466A1 Producing quartz glass material used in microlithography-projection devices comprises minimizing the amount of peroxide defects in the material
09/02/2004DE10308258A1 Vorrichtung und Verfahren zur Dünnschichtmetrologie Apparatus and method for thin film metrology
09/02/2004DE10306318A1 Semiconducting circuit arrangement with trench isolation has at least one trench that passes through charge storage layer and through doped semiconducting layer
09/02/2004DE10306315A1 Semiconductor device used as field effect transistor, especially FIN-FET, comprises first doping region, second doping region, channel region arranged between two regions, and gate structure arranged over channel region
09/02/2004DE10306281A1 Arrangement of vertical transistor cells for dynamic read-write memory has active regions joining at least transistor cells adjacent in x-direction; charge transport is enabled between such cells
09/02/2004DE10297047T5 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly