Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/07/2004US6787191 Coating composition for the production of insulating thin films
09/07/2004US6787181 Dissolving trimethylbismuth and a metal compound in a solvent; forming mist with carrier gas; vaporizing; applying vapor onto integrated circuit substrate to produce thin film superlattice material; completing the fabrication of integrated ciruit
09/07/2004US6787093 Semiconductor resin molding method
09/07/2004US6787061 Copper polish slurry for reduced interlayer dielectric erosion and method of using same
09/07/2004US6787056 Planarization method using anisotropic wet etching
09/07/2004US6787054 Two-stage etching process
09/07/2004US6787053 Carbonyl fluoride, fluoroformate and oxygen gas mixtures antideposit agents for silicon; low global warming
09/07/2004US6787052 Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
09/07/2004US6787010 Non-thermionic sputter material transport device, methods of use, and materials produced thereby
09/07/2004US6787006 Operating a magnetron sputter reactor in two modes
09/07/2004US6786998 Wafer temperature control apparatus and method
09/07/2004US6786997 Plasma processing apparatus
09/07/2004US6786996 Apparatus and method for edge bead removal
09/07/2004US6786977 Gas-expanded liquids, methods of use thereof, and systems using gas-expanded liquids for cleaning integrated circuits
09/07/2004US6786974 Insulating film forming method and insulating film forming apparatus
09/07/2004US6786973 Method for depositing in particular crystalline layers, gas-admission element and device for carrying out the method
09/07/2004US6786970 Equipment for fabricating a semiconductor product
09/07/2004US6786945 Polishing compound and method for polishing substrate
09/07/2004US6786944 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices
09/07/2004US6786936 Methods, complexes, and systems for forming metal-containing films on semiconductor structures
09/07/2004US6786935 Vacuum processing system for producing components
09/07/2004US6786810 Curing abrasive coating having a backing to make transparent to visible light
09/07/2004US6786809 Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography
09/07/2004US6786799 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
09/07/2004US6786789 Apparatus and method for manufacturing organic EL display device
09/07/2004US6786607 Arrangement for storing and transporting at least one optical component
09/07/2004US6786392 Wire bonding device and wire bonding method
09/07/2004US6786387 Method for clamping and wire-bonding the leads of a lead frame one set at a time
09/07/2004US6786320 Chip-transferring station for a bonding machine
09/07/2004US6786224 Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing
09/07/2004US6786176 Diamond film depositing apparatus and method thereof
09/07/2004US6786175 Showerhead electrode design for semiconductor processing reactor
09/07/2004US6786174 Method of robotic manipulation using fluidic patterning
09/07/2004CA2306948C Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
09/02/2004WO2004075309A2 Reflective ohmic contact for silicon carbide, light emitting diode in including the same, and manufacturing method
09/02/2004WO2004075300A1 Semiconductor device and method of manufacturing such a device
09/02/2004WO2004075298A1 Method for manufacturing soi wafer and soi wafer
09/02/2004WO2004075297A1 Semiconductor storage device
09/02/2004WO2004075296A1 Method for manufacturing ferroelectric capacitor
09/02/2004WO2004075294A2 Flip-chip component packaging process and flip-chip component
09/02/2004WO2004075293A1 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
09/02/2004WO2004075291A1 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
09/02/2004WO2004075288A1 Integrated electronic component having specifically produced nanotubes in vertical structures
09/02/2004WO2004075287A1 Semiconductor structure on an extremely rough substrate
09/02/2004WO2004075286A1 Transfer device and semiconductor processing system
09/02/2004WO2004075285A1 Substrate treating device
09/02/2004WO2004075284A1 Method for judging quality of semiconductor epitaxial crystal wafer and wafer manufacturing method using the same
09/02/2004WO2004075282A1 Semiconductor device and radiation detector employing it
09/02/2004WO2004075281A1 Semiconductor device and radiation detector employing it
09/02/2004WO2004075280A1 Semiconductor device
09/02/2004WO2004075278A1 Method and apparatus for liquid etching
09/02/2004WO2004075277A1 Method of etching, etching apparatus and process for producing semiconductor device
09/02/2004WO2004075276A1 Polishing apparatus, method of polishing and process for producing semiconductor device
09/02/2004WO2004075275A1 Carrier head for chemical mechanical polishing apparatus
09/02/2004WO2004075274A1 Method for introducing impurities
09/02/2004WO2004075273A1 N-type diamond semiconductor and its manufacturing method
09/02/2004WO2004075272A1 Substrate-processing apparatus and method of producing semiconductor device
09/02/2004WO2004075271A1 Carburetor, method of vaporizing material solution, and method of washing carburetor
09/02/2004WO2004075270A1 Probe pin zero-point detecting method and probe device
09/02/2004WO2004075269A1 Neutral particle beam lithography
09/02/2004WO2004075267A1 Semiconductor device and semiconductor production management system
09/02/2004WO2004075266A2 Method for immersing a substrate
09/02/2004WO2004075265A2 Methods for selectively bumping integrated circuit substrates and related structures
09/02/2004WO2004075264A2 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
09/02/2004WO2004075263A2 System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
09/02/2004WO2004075258A2 Method for depositing a low-k material having a controlled thickness range
09/02/2004WO2004075255A2 End point detection in time division multiplexed etch processes
09/02/2004WO2004075252A2 Surface modification of silicon nitride for thick film silver metallization of solar cell
09/02/2004WO2004075251A2 Tmos-infrared uncooled sensor and focal plane array
09/02/2004WO2004075249A2 Buffer structure for modifying a silicon substrate
09/02/2004WO2004075248A2 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits
09/02/2004WO2004075240A1 Ion beam processing method
09/02/2004WO2004075218A1 Capacitor, semiconductor device with a capacitor and method of manufactuing thereof
09/02/2004WO2004075011A2 Methods and apparatus for data analysis
09/02/2004WO2004074941A1 Water soluble resin composition, method of pattern formation and method of inspecting resist pattern
09/02/2004WO2004074939A1 Exposure apparatus for liquid crystal panel and exposure apparatus
09/02/2004WO2004074932A2 Method and apparatus for cleaning of native oxides with hydroge-containing radicals
09/02/2004WO2004074931A2 Method and apparatus for megasonic cleaning of patterned substrates
09/02/2004WO2004074816A1 Scanning probe microscope and sample observing method using this and semiconductor device production method
09/02/2004WO2004074543A1 Method for forming film
09/02/2004WO2004074359A2 Flame retardant molding compositions containing group iva metal oxides
09/02/2004WO2004074355A1 Low-permittivity material, and production and use thereof
09/02/2004WO2004074180A1 Alkali-resistant cocoon-shaped colloidal silica particle and process for producing the same
09/02/2004WO2004074173A1 Method of forming quantum layer and patterned structure by multiple dip-coating process
09/02/2004WO2004074168A2 Packaged microchip with thermal stress relief
09/02/2004WO2004074152A1 Device and method for transporting film carrier tape for mounting electronic components
09/02/2004WO2004073922A2 Abrasives for copper cmp and methods for making
09/02/2004WO2004073893A2 Gas gate for isolating regions of differing gaseous pressure
09/02/2004WO2004073849A2 Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases
09/02/2004WO2004064147A3 Integration of ald/cvd barriers with porous low k materials
09/02/2004WO2004061910A3 Pre-etch implantation damage for the removal of thin film layers
09/02/2004WO2004059737B1 Multi-level memory cell with lateral floating spacers
09/02/2004WO2004059707A3 A method and apparatus for forming a high quality low temperature silicon nitride film
09/02/2004WO2004057661A3 Non-volatile memory cell and method of fabrication
09/02/2004WO2004055917A3 Manufacture of thin film transistors
09/02/2004WO2004053008A3 Passivative chemical mechanical polishing composition for copper film planarization
09/02/2004WO2004051743A3 Radiation protection in integrated circuits
09/02/2004WO2004051738A3 Method for the manufacture of a display
09/02/2004WO2004051706A3 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
09/02/2004WO2004049441A3 Low thermal budget fabrication of ferroelectric memory using rtp