| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/09/2004 | US20040172813 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
| 09/09/2004 | DE4226389B4 Halbleiter-Speicherzelle und Verfahren zu deren Herstellung A semiconductor memory cell and process for their preparation |
| 09/09/2004 | DE202004009233U1 Kühlkörper mit geneigten Flächen Heatsink with inclined surfaces |
| 09/09/2004 | DE19781822B4 Reinigungsstation zur Verwendung bei einem System zum Reinigen, Spülen und Trocknen von Halbleiterscheiben Cleaning station for use in a system for cleaning, rinsing and drying of semiconductor wafers |
| 09/09/2004 | DE19601055B4 Verfahren und Vorrichtung zum Beloten von Flächen Method and apparatus for applying brazing material surfaces of |
| 09/09/2004 | DE10361829A1 Halbleiterbauelement mit epitaktischer C49-Titan-Silizid(TiSi2)-Schicht und Verfahren zur Herstellung desselben Of the same semiconductor device with an epitaxial C49-titanium silicide (TiSi2) layer and processes for preparing |
| 09/09/2004 | DE10350770A1 Druckkontakt-Halbleiterbauelement mit Blindsegment The pressure contact type semiconductor device having dummy segment |
| 09/09/2004 | DE10345211A1 Herstellungsverfahren für ein elektronisches Bauelement mit einer Verdrahtungsanschlußstruktur Manufacturing method for an electronic component having a wiring connection structure |
| 09/09/2004 | DE10325602B3 Temperature regulated processing system for substrates including thick film contacts for solar cells has quartz tube with gas inlet, inspection window and pyrometer, surrounded by heating coil |
| 09/09/2004 | DE10309728A1 Verfahren zur Herstellung von Si-Wafern mit einer Praseodymsilikat-Schicht A process for production of Si wafers with a praseodymium-layer |
| 09/09/2004 | DE10308970A1 Halbleiterspeicherzelle und Verfahren zu deren Herstellung A semiconductor memory cell and process for their preparation |
| 09/09/2004 | DE10308928A1 Direkt auf ungehäusten Bauelementen erzeugte freitragende Kontaktierstrukturen Directly generated on unpackaged devices cantilever contacting structures |
| 09/09/2004 | DE10308888A1 Two-capacitor apparatus in or on a substrate where the outer capacitor partially encloses the inner capacitor useful in computer and semiconductor technology, e.g. for dynamic random access memory (DRAM) components |
| 09/09/2004 | DE10306597A1 Semiconductor structure with increased breakdown voltage has recess in buried semiconductor layer with semiconductor area lower in he substrate than the buried layer |
| 09/09/2004 | DE10303643B3 Electrical connection of active semiconductor structures with the substrate, at a silicon-on-insulator semiconductor wafer, has a passage opening through the insulating layer for a metal filling covered by a layered stack |
| 09/09/2004 | DE10301939A1 FET whose gate electrodes consist of monocrystalline silicon in trench, insulated by gate oxide from source and/or drain, with gate electrodes of same material as source |
| 09/09/2004 | DE10258508B3 Reinforcement for edge of semiconductor wafer consists of layer of material strong in compression and tension covering one side of edge and engaging pair of keying grooves |
| 09/09/2004 | DE10256936B3 Verfahren zur Herstellung von selbstjustierten Kontaktierungen auf vergrabenen Bitleitungen A process for the production of self-aligned contacts on the buried bit lines |
| 09/09/2004 | DE10238135B4 Verfahren zur Herstellung von Gruppe-II-Oxid Schichten mit der Gasphasenepitaxie, Gruppe-II-Oxid Schicht und Gruppe-II-Oxid Halbleiterbauelement A process for preparing Group II oxide layers with the vapor phase epitaxy, Group-II-oxide layer and the group II-oxide semiconductor device |
| 09/09/2004 | DE10237247B4 Verfahren zur Herstellung einer Halbleiterscheibe aus Silicium A process for producing a semiconductor wafer of silicon |
| 09/09/2004 | DE10201863B4 Waferraumhaltevorrichtung, die auf einer elektrostatischen Aufnahmevorrichtung installiert ist, und Verfahren zur Herstellung derselben Wafer space holding device that is installed on an electrostatic recording apparatus, and method for manufacturing the same |
| 09/09/2004 | DE102004008773A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 09/09/2004 | DE102004007895A1 Selektives Silizidierungsverfahren für Speichervorrichtungen und zugehörige Halbleitervorrichtung Selective silicidation for memory devices and related semiconductor device |
| 09/09/2004 | DE102004007105A1 Verfahren zum Unterdrücken eines Lithographievorgangs am Rand einer Halbleiterscheibe A method of suppressing a lithography process at the edge of a semiconductor wafer |
| 09/09/2004 | DE102004005685A1 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component |
| 09/09/2004 | DE102004004790A1 Verfahren und Anordnung zum Verbessern des elektrischen Widerstands von Leiterbahnen Method and apparatus for improving the electrical resistance of interconnects |
| 09/09/2004 | DE102004004594A1 Ausnehmung des Gatemetalls zum Schutz gegen Oxidation und zur Reduzierung der parasitären Kapazität Recess of the gate metal for protection against oxidation and to reduce the parasitic capacitance |
| 09/09/2004 | DE102004004532A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/09/2004 | DE102004001672A1 Verfahren zum Herstellen einer Halbleitervorrichtung mit Doppel-Damaszener-Struktur A method of manufacturing a semiconductor device having dual damascene structure |
| 09/09/2004 | DE10082995B4 Wafer-Haltevorrichtung Wafer holding device |
| 09/09/2004 | DE10065722B9 Verfahren zur Herstellung einer elektrischen Verbindung und Vorrichtung mit einer elektrischen Verbindung A method for making an electrical connection and an electrical connection device with |
| 09/08/2004 | EP1455397A2 Vertical MOS device and method of making the same |
| 09/08/2004 | EP1455396A1 Flat panel display with thin film transistor (TFT) |
| 09/08/2004 | EP1455394A1 Transfer method, method of manufacturing thin film element, method of manufacturing integrated circuit, circuit substrate and method of manufacturing the circuit substrate, electro-optic device and method of manufacturing the electro-optic device, and ic card and electronic equipment |
| 09/08/2004 | EP1455393A1 Complementary mis device |
| 09/08/2004 | EP1455392A1 Semiconductor device and method for manufacturing the same |
| 09/08/2004 | EP1455390A2 Buried magnetic tunnel-junction memory cell and methods for fabricating |
| 09/08/2004 | EP1455389A2 Solid-state imaging device, method for manufacturing the same and interline transfer CCD image sensor |
| 09/08/2004 | EP1455388A1 Reliability evaluation tester, reliability evaluation test system, contactor, and reliability evaluation test method |
| 09/08/2004 | EP1455387A1 Probe device |
| 09/08/2004 | EP1455386A2 Semiconductor device and fabrication method therefor |
| 09/08/2004 | EP1455385A1 Method for Forming FerroElectric Memory Capacitor |
| 09/08/2004 | EP1455384A2 An apparatus for fabricating a semiconductor device and a method for fabricating a polysilicon film using the same |
| 09/08/2004 | EP1455365A2 Reflective X-ray microscope and inspection system for examining objects with wavelengths 100nm |
| 09/08/2004 | EP1455330A1 Electro-optical device manufacturing method, electro-optical device manufactured by the manufacturing method, and electronic device |
| 09/08/2004 | EP1455233A2 Processing method and system |
| 09/08/2004 | EP1455232A2 Exposure apparatus and method of producing a device |
| 09/08/2004 | EP1455230A2 Polymers and photoresists comprising same |
| 09/08/2004 | EP1455229A1 Silicon-containing fluorinated polymers and photoresists comprising same |
| 09/08/2004 | EP1454973A1 Adhesive for bonding circuit members, circuit board and process for its production |
| 09/08/2004 | EP1454879A1 Process for producing thin oxide film and production apparatus |
| 09/08/2004 | EP1454368A2 Method for the production of led bodies |
| 09/08/2004 | EP1454367A2 Baking oven for photovoltaic devices |
| 09/08/2004 | EP1454361A1 Trench mosfet device with polycrystalline silicon source contact structure |
| 09/08/2004 | EP1454360A1 TRENCH MOSFET DEVICE WITH IMPROVED ON−RESISTANCE |
| 09/08/2004 | EP1454359A2 Semiconductor device and method for production thereof |
| 09/08/2004 | EP1454358A1 A method for fabricating high aspect ratio electrodes |
| 09/08/2004 | EP1454355A2 Method for producing a layered assembly and a layered assembly |
| 09/08/2004 | EP1454354A2 Silicon substrate having an insulating layer, silicon substrate, and assembly of a silicon substrate with an insulating layer |
| 09/08/2004 | EP1454353A1 Method of forming narrow trenches in semiconductor substrates |
| 09/08/2004 | EP1454352A1 Method for forming trench mosfet device with low parasitic resistance |
| 09/08/2004 | EP1454351A2 Combined methods of athermal annealing and rapid thermal annealing |
| 09/08/2004 | EP1454350A1 Apparatus and method for single- or double- substrate processing |
| 09/08/2004 | EP1454349A2 Trilayered beam mems device and related methods |
| 09/08/2004 | EP1454348A1 Method for suppressing transient enhanced diffusion of dopants in silicon |
| 09/08/2004 | EP1454347A1 Method for forming thin film |
| 09/08/2004 | EP1454346A1 Method and apparatus for chemical vapor ddeposition capable of preventing contamination and enhancing film growth rate |
| 09/08/2004 | EP1454345A1 Integrated semiconductor product comprising a metal-insulator-metal capacitor |
| 09/08/2004 | EP1454344A1 Integrated semiconductor product comprising a metal-insulator-metal capacitor |
| 09/08/2004 | EP1454343A2 A method of forming a silicon nitride layer on a substrate |
| 09/08/2004 | EP1454342A2 A method of forming differential spacers for individual optimization of n-channel and p-channel transistors |
| 09/08/2004 | EP1454340A2 Wafer handling apparatus and method |
| 09/08/2004 | EP1454339A1 An integrated circuit resistant to the formation of cracks in a passivation layer |
| 09/08/2004 | EP1454336A2 Raster shaped beam, electron beam exposure strategy using a two dimensional multiplexel flash field |
| 09/08/2004 | EP1454334A2 Lens array with a laterally movable optical axis for corpuscular rays |
| 09/08/2004 | EP1454333A1 Mems device having a trilayered beam and related methods |
| 09/08/2004 | EP1454324A2 Segmented write line architecture |
| 09/08/2004 | EP1454321A2 Asymmetric mram cell and bit design for improving bit yield |
| 09/08/2004 | EP1454257A2 Programmable gate array having interconnecting logic to support embedded fixed logic circuitry |
| 09/08/2004 | EP1454194A1 Method and apparatus for patterning a workpiece |
| 09/08/2004 | EP1454192A2 Method of enhancing clear field phase shift masks by adding parallel line to phase 0 region |
| 09/08/2004 | EP1454191A1 Method of enhancing phase shift masks |
| 09/08/2004 | EP1454112A2 Interferometry system having a dynamic beam-steering assembly for measuring angle and distance |
| 09/08/2004 | EP1453991A1 Electrolytic processing apparatus and method |
| 09/08/2004 | EP1453924A2 Dual cure b-stageable adhesive for die attach |
| 09/08/2004 | EP1453745A1 Wafer carrier with wafer retaining system |
| 09/08/2004 | EP1453741A1 Wafer enclosure sealing arrangement for wafer containers |
| 09/08/2004 | EP1453618A1 An apparatus and method for cleaning glass substrates using a cool hydrogen flame |
| 09/08/2004 | EP1453617A1 Semiconductor wafer cleaning systems and methods |
| 09/08/2004 | EP1261755B1 Device and method for carrying out plasma enhanced surface treatment of substrates in a vacuum |
| 09/08/2004 | EP1220303B1 Hot plate unit |
| 09/08/2004 | EP1110248A4 Method for depositing layers of high quality semiconductor material |
| 09/08/2004 | EP1027473A4 Mini-batch process chamber |
| 09/08/2004 | EP0980092B1 Vacuum processing method |
| 09/08/2004 | EP0958401B1 Apparatus and method for high density plasma chemical vapor deposition or etching |
| 09/08/2004 | EP0852063B1 Method of modifying an exposed surface of a semiconductor wafer |
| 09/08/2004 | EP0834243B1 Photolithographically patterned spring contact |
| 09/08/2004 | CN2640036Y Locating mechanism for packing image sensor |
| 09/08/2004 | CN2640035Y Vernier screw set of semiconductor chip pushing apparatus |
| 09/08/2004 | CN2640034Y Internal drive control device capable of self-regulating IC oscillation frequency |