Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/14/2004US6791339 Method and apparatus for nondestructive measurement and mapping of sheet materials
09/14/2004US6791308 Internal power supply for an integrated circuit having a temperature compensated reference voltage generator
09/14/2004US6791242 Uniform acoustic energy cleaning of rotating objects
09/14/2004US6791233 Semiconductor device
09/14/2004US6791214 Moving-magnet linear motor, aligner and apparatus provided therewith, and method for manufacturing devices using the same
09/14/2004US6791200 Semiconductor memory device
09/14/2004US6791199 Heat radiating semiconductor device
09/14/2004US6791198 Method and apparatus for gate blocking X-outs during a molding process
09/14/2004US6791197 Reducing layer separation and cracking in semiconductor devices
09/14/2004US6791196 Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same
09/14/2004US6791195 Semiconductor device and manufacturing method of the same
09/14/2004US6791190 Self-aligned contact/borderless contact opening and method for forming same
09/14/2004US6791188 Thin film aluminum alloy and sputtering target to form the same
09/14/2004US6791187 Decreasing lithography alignment allowance and number of steps
09/14/2004US6791186 Mounting substrate and structure having semiconductor element mounted on substrate
09/14/2004US6791185 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
09/14/2004US6791178 Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
09/14/2004US6791173 Semiconductor device and its manufacturing method
09/14/2004US6791171 Systems for testing and packaging integrated circuits
09/14/2004US6791169 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
09/14/2004US6791168 Semiconductor package with circuit side polymer layer and wafer level fabrication method
09/14/2004US6791167 Resin-molded device and manufacturing apparatus thereof
09/14/2004US6791164 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
09/14/2004US6791161 Precision Zener diodes
09/14/2004US6791160 Semiconductor device and process for fabrication thereof
09/14/2004US6791156 Semiconductor device and method for manufacturing it
09/14/2004US6791155 Stress-relieved shallow trench isolation (STI) structure and method for forming the same
09/14/2004US6791154 Integrated semiconductor circuit device having Schottky barrier diode
09/14/2004US6791153 Photo detector with passivation layer and antireflection layer made of the same material
09/14/2004US6791149 Diffusion barrier layer for semiconductor wafer fabrication
09/14/2004US6791148 Method and composite for decreasing charge leakage
09/14/2004US6791147 Semiconductor memory device and method for manufacturing the same
09/14/2004US6791145 Semiconductor device formed by utilizing deformed pattern
09/14/2004US6791144 Thin film transistor and multilayer film structure and manufacturing method of same
09/14/2004US6791143 Power semiconductor devices having laterally extending base shielding regions that inhibit base reach-through
09/14/2004US6791142 Stacked-gate flash memory and the method of making the same
09/14/2004US6791141 Semiconductor constructions comprising stacks with floating gates therein
09/14/2004US6791140 Memory transistor structure
09/14/2004US6791139 Semiconductor memory and method for fabricating the same
09/14/2004US6791138 Use of atomic oxygen process for improved barrier layer
09/14/2004US6791137 Semiconductor integrated circuit device and process for manufacturing the same
09/14/2004US6791136 Memory device structure and method of fabricating the same
09/14/2004US6791135 Semiconductor device with improved capacitive element and method of forming the same
09/14/2004US6791134 Semiconductor memory device and manufacturing method thereof
09/14/2004US6791132 Memory semiconductor device with reduced sense amplifier area
09/14/2004US6791131 Method for forming a storage cell capacitor compatible with high dielectric constant materials
09/14/2004US6791130 Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure
09/14/2004US6791128 Semiconductor integrated circuit device and method for designing the same
09/14/2004US6791126 Heterojunction bipolar transistor with zero conduction band discontinuity
09/14/2004US6791124 Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same
09/14/2004US6791122 Silicon controlled rectifier electrostatic discharge protection device with external on-chip triggering and compact internal dimensions for fast triggering
09/14/2004US6791120 Reduced contact resistance
09/14/2004US6791113 Capacitor constructions comprising a nitrogen-containing layer over a rugged polysilicon layer
09/14/2004US6791112 Electro-optical device and manufacturing method thereof
09/14/2004US6791111 Semiconductor device
09/14/2004US6791106 Semiconductor device and method of manufacturing the same
09/14/2004US6791103 Light-emitting gallium nitride-based compound semiconductor device
09/14/2004US6791099 Laser scanning wafer inspection using nonlinear optical phenomena
09/14/2004US6791098 Multi-input, multi-output motion control for lithography system
09/14/2004US6791097 Adjustable conductance limiting aperture for ion implanters
09/14/2004US6791096 Process conditions change monitoring systems that use electron beams, and related monitoring methods
09/14/2004US6791084 Method and scanning electron microscope for measuring dimension of material on sample
09/14/2004US6791082 Process conditions change monitoring systems that use electron beams, and related monitoring methods
09/14/2004US6791074 Light curtain system for establishing a protective light curtain, tool and system for processing objects and method for loading/unloading a tool
09/14/2004US6791059 Laser processing
09/14/2004US6791036 Circuit elements using z-axis interconnect
09/14/2004US6790793 Method for manufacturing semiconductor device
09/14/2004US6790792 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
09/14/2004US6790791 Lanthanide doped TiOx dielectric films
09/14/2004US6790790 High modulus filler for low k materials
09/14/2004US6790789 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
09/14/2004US6790788 Method of improving stability in low k barrier layers
09/14/2004US6790786 Etching processes for integrated circuit manufacturing including methods of forming capacitors
09/14/2004US6790785 Metal-assisted chemical etch porous silicon formation method
09/14/2004US6790784 Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for intergrated circuit structure
09/14/2004US6790783 Semiconductor fabrication apparatus
09/14/2004US6790782 Process for fabrication of a transistor gate including high-K gate dielectric with in-situ resist trim, gate etch, and high-K dielectric removal
09/14/2004US6790781 Dual depth trench isolation
09/14/2004US6790780 Fabrication of 3-D capacitor with dual damascene process
09/14/2004US6790779 Anisotropic dry etching technique for deep bulk silicon etching
09/14/2004US6790778 Method for capping over a copper layer
09/14/2004US6790777 Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device
09/14/2004US6790776 Barrier layer for electroplating processes
09/14/2004US6790775 Method of forming a through-substrate interconnect
09/14/2004US6790774 Method of forming a wiring film by applying high temperature/high pressure
09/14/2004US6790773 Process for forming barrier/seed structures for integrated circuits
09/14/2004US6790772 Dual damascene processing method using silicon rich oxide layer thereof and its structure
09/14/2004US6790771 Bitline structure for DRAM and method of forming the same
09/14/2004US6790770 Method for preventing photoresist poisoning
09/14/2004US6790769 CMP slurry and method of manufacturing semiconductor device
09/14/2004US6790768 Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
09/14/2004US6790767 Method for formation of copper diffusion barrier film using aluminum
09/14/2004US6790766 Method of fabricating semiconductor device having low dielectric constant insulator film
09/14/2004US6790765 Method for forming contact
09/14/2004US6790764 Processing methods for providing metal-comprising materials within high aspect ratio openings
09/14/2004US6790763 Substrate processing method
09/14/2004US6790762 Method of making an electrical device including an interconnect structure
09/14/2004US6790761 Method of fabricating a semiconductor device
09/14/2004US6790759 Semiconductor device with strain relieving bump design
09/14/2004US6790758 Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging