| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/16/2004 | US20040178413 Semiconductor device and method for producing the same |
| 09/16/2004 | US20040178412 Thin film transistor and method of manufacturing the same and display apparatus using the transistor |
| 09/16/2004 | US20040178411 Substrate for display, method of manufacturing the same and display having the same |
| 09/16/2004 | US20040178410 Flat panel display with thin film transistor (TFT) |
| 09/16/2004 | US20040178409 Thin film transistor panel for liquid crystal display |
| 09/16/2004 | US20040178406 Dual strain-state SiGe layers for microelectronics |
| 09/16/2004 | US20040178405 Emitter for electron-beam projection lithography system and manufacturing method thereof |
| 09/16/2004 | US20040178366 Electron-beam drawing apparatus and electron-beam drawing method |
| 09/16/2004 | US20040178364 Electron beam lithography apparatus using a patterned emitter and method of fabricating the patterned emitter |
| 09/16/2004 | US20040178362 Lithographic apparatus and method of manufacturing a device |
| 09/16/2004 | US20040178351 Method of optimizing focus of optical inspection apparatus and method and apparatus of detecting defects using the same |
| 09/16/2004 | US20040178323 Multi-trench region for accumulation of photo-generated charge in a CMOS imager |
| 09/16/2004 | US20040178180 Plasma processing apparatus |
| 09/16/2004 | US20040178177 Plasma processing apparatus |
| 09/16/2004 | US20040178176 Apparatus and method for cleaning a bell jar in a barrel epitaxial reactor |
| 09/16/2004 | US20040178174 Dual gate nitride process |
| 09/16/2004 | US20040178172 Method of removing metal etching residues following a metal etchback process to improve a CMP process |
| 09/16/2004 | US20040178171 Sloped trench etching process |
| 09/16/2004 | US20040178170 Mask blank for charged particle beam exposure, method of forming mask blank and mask for charged particle beam exposure |
| 09/16/2004 | US20040178169 Hard mask integrated etch process for patterning of silicon oxide and other dielectric materials |
| 09/16/2004 | US20040178114 Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed |
| 09/16/2004 | US20040178107 Packaging platform having an adjustable thickness |
| 09/16/2004 | US20040178065 Electrode semiconductor workpiece holder and processing methods |
| 09/16/2004 | US20040178060 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
| 09/16/2004 | US20040178059 Controlled potential anodic etching process for the selective removal of conductive thin films |
| 09/16/2004 | US20040178058 Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film |
| 09/16/2004 | US20040177997 Electronic apparatus |
| 09/16/2004 | US20040177926 Method and apparatus for processing substrates and method for manufacturing a semiconductor device |
| 09/16/2004 | US20040177925 Plasma processing system and apparatus and a sample processing method |
| 09/16/2004 | US20040177924 Data processing apparatus for semiconductor processing apparatus |
| 09/16/2004 | US20040177921 Joining method using anisotropic conductive adhesive |
| 09/16/2004 | US20040177918 Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board |
| 09/16/2004 | US20040177917 Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method |
| 09/16/2004 | US20040177867 Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal |
| 09/16/2004 | US20040177813 Substrate support lift mechanism |
| 09/16/2004 | US20040177812 Heating systems |
| 09/16/2004 | US20040177811 DAF tape adhering apparatus and DAF tape adhering method |
| 09/16/2004 | US20040177700 Stress measurement method using X-ray diffraction |
| 09/16/2004 | US20040177655 Apparatus for cleaning a substrate having metal interconnects |
| 09/16/2004 | US20040177563 For chemical-mechanical polishing; combining a polymer resin with a supercritical gas to produce a single phase solution and forming a pad from the solution; gas is generated by subjecting a gas to an elevated temperature and pressure. |
| 09/16/2004 | US20040177520 Positioning apparatus |
| 09/16/2004 | US20040177498 Electronic device and manufacturing same |
| 09/16/2004 | DE20122196U1 Imprint lithography template for producing microelectronic devices, has multiple recesses of specified size and alignment marks and is transparent to activating light |
| 09/16/2004 | DE19881310B4 Wafer Transfervorrichtung und Verfahren zum Übertragen und Verdichten von mehreren Wafern Wafer transfer apparatus and method for transferring and compressing a plurality of wafers |
| 09/16/2004 | DE19860052B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit einer Speicherknotenstruktur A method of manufacturing a semiconductor device having a storage node structure |
| 09/16/2004 | DE19838106B4 Verfahren zur Verbesserung der Wärmebeständigkeit von Wolframsilicid A process for improving the heat resistance of tungsten silicide |
| 09/16/2004 | DE19816489B4 Verfahren und Vorrichtung zum Prüfen der Filtereffizienz von für den Einsatz in einer Reinraumumgebung bestimmten Geweben Method and device for testing the efficiency of filter intended for use in a clean room environment tissues |
| 09/16/2004 | DE19750896B4 Halbleitereinrichtung mit einer leitenden Schicht und ihr Herstellungsverfahren A semiconductor device having a conductive layer and its manufacturing method |
| 09/16/2004 | DE19711268B4 Chemisches Dampfabscheidungsverfahren mit induktiv gekoppeltem Plasma, Verwendung des Verfahrens zum Herstellen von Dünnschichttransistoren und durch das Verfahren hergestellte Dünnschichten aus amorphen Silizium Chemical vapor deposition method using inductively coupled plasma, using the method for manufacturing thin film transistors and thin films produced by the process of amorphous silicon |
| 09/16/2004 | DE19708002B4 Anschlußrahmen für Halbleiterbauelement Lead frame for semiconductor device |
| 09/16/2004 | DE10353285A1 Padanordnung einer integrierten Schaltung und Verfahren zum Herstellen der Padanordnung Pad arrangement of an integrated circuit and method of manufacturing the pad arrangement |
| 09/16/2004 | DE10351977A1 Maskenmanagementvorrichtung in einem Halbleiter-Wafer-Herstellungsverfahren Mask management device in a semiconductor wafer manufacturing process |
| 09/16/2004 | DE10351373A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/16/2004 | DE10345194A1 Simulator für chemisch/mechanisches Polieren Simulator for chemical / mechanical polishing |
| 09/16/2004 | DE10320646A1 Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
| 09/16/2004 | DE10314274B3 Production of a first contact perforated surface in a storage device having storage cells comprises preparing a semiconductor substrate with an arrangement of gate electrode strips on the semiconductor surface, and further processing |
| 09/16/2004 | DE10309711A1 Verfahren zum Einätzen von Strukturen in einem Ätzkörper mit einem Plasma Method for etching of structures in an etching body with a plasma |
| 09/16/2004 | DE10309079A1 Semiconductor appliance consists of at least one non-wrapped chip inserted in pocket-shaped depression of wafer pack, with contacting members including contact faces |
| 09/16/2004 | DE10308968A1 Verfahren zur Herstellung einer leitenden Barrierenschicht mit verbesserter Bedeckung innerhalb kritischer Öffnungen A method for producing a conductive barrier layer with an improved cover within critical openings |
| 09/16/2004 | DE10308927A1 Integrierte Halbleiterschaltung mit einem Transistor und mit einer Leiterbahn A semiconductor integrated circuit with a transistor and to a conductor track |
| 09/16/2004 | DE10308926A1 Semiconductor chip appliance with exchange of signals between semiconductor substrates takes place via lateral contacts in substrate side faces, instead of via printed circuit board |
| 09/16/2004 | DE10308855A1 Semiconductor wafer for electronic components, with integrated circuits in lines and columns for semiconductor chips on wafer top surface with strip-shaped dividing regions between chip integrated circuits |
| 09/16/2004 | DE10308842A1 Gripper for large number of substrates for making thin photovoltaic plates has offset tongues with slit between, flexible pads being slid along to reduce width of slit |
| 09/16/2004 | DE10308381A1 Verfahren zur Abscheidung von Silizium A process for the deposition of silicon |
| 09/16/2004 | DE10297292T5 Verbesserung der Auslösung eines ESD-NMOS durch die Verwendung einer N-Unterschicht Improving the triggering of an NMOS ESD through the use of a N-undercoat layer |
| 09/16/2004 | DE10297264T5 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/16/2004 | DE10260645B3 Compensation frame for holding substrate for semiconducting manufacture has polygonal inner profile for holding substrate, area of upper main surface of frame with different widths at different points |
| 09/16/2004 | DE10250541B9 Elektronisches Bauteil mit Unterfüllstoffen aus Thermoplasten und Verfahren zu dessen Herstellung Electronic component with sub fillers from thermoplastics, and methods for its preparation |
| 09/16/2004 | DE10245091B4 Verfahren zur Herstellung einer dünnen Halbleiterbauelementstruktur A process for producing a thin semiconductor device structure |
| 09/16/2004 | DE102004010633A1 Elektronisches Baulelement zum Verkleben einer Mehrzahl von Elektroden und Verfahren zum Montieren desselben The same electronic Baulelement for bonding a plurality of electrodes, and method of assembling |
| 09/16/2004 | DE102004010127A1 Halbleitervorrichtung mit einer Grabengatestruktur und Verfahren zum Herstellen dergleichen Like semiconductor device with a grave gate structure and methods for preparing |
| 09/16/2004 | DE102004009562A1 Verfahren zur Ausbildung von rückstandsfreien Hartmaskenelementen während eines Halbleiterbauelementherstellungsprozesses Method for forming residue free hard mask elements during a semiconductor device fabrication process |
| 09/16/2004 | DE102004009336A1 Verfahren zum Unterdrücken eines Lithographievorgangs am Rand einer Halbleiterscheibe A method of suppressing a lithography process at the edge of a semiconductor wafer |
| 09/16/2004 | DE102004005502A1 Metal-oxide semiconductor transistor production comprises doping epitaxial layer provided on substrate with impurities using gate electrode as mask to form source/drain extension regions in epitaxial layer proximal to gate dielectric layer |
| 09/16/2004 | DE102004004782A1 Verfahren zum Reduzieren der Kontamination von Geräten zur Verarbeitung von Halbleitern A method for reducing the contamination of devices for the processing of semiconductors |
| 09/16/2004 | DE102004003858A1 Bearbeitungsvorrichtung, die mit einem drehbaren bzw. Drehwerkzeug ausgerüstet ist Processing apparatus, which is equipped with a rotatable or rotating tool |
| 09/16/2004 | DE10120516B4 Halbleiterspeicherzelle und Verfahren zu ihrer Herstellung A semiconductor memory cell and process for its preparation |
| 09/16/2004 | CA2518065A1 Apparatus and method for reducing impurities in a semiconductor material |
| 09/16/2004 | CA2517857A1 Methods for preventing gluconoylation of proteins |
| 09/16/2004 | CA2517133A1 Plasma processing apparatus and method |
| 09/16/2004 | CA2495908A1 Nitride semiconductor device and method for manufacturing same |
| 09/15/2004 | EP1458066A2 Line selected F2 two chamber laser system |
| 09/15/2004 | EP1458033A2 Semiconductor protection element, semiconductor device comprising the same and corresponding manufacturing methods |
| 09/15/2004 | EP1458032A1 Transistor and semiconductor memory comprising it |
| 09/15/2004 | EP1458030A2 Novel and conductive elements for thin film transistors used in a flat panel display |
| 09/15/2004 | EP1458029A2 Novel conductive elements for thin film transistors used in a flat panel display |
| 09/15/2004 | EP1458025A2 Integrated circuits having separate power supply lines |
| 09/15/2004 | EP1458024A2 Interposer and semiconductor device |
| 09/15/2004 | EP1458023A2 Electronic assembly having electrically-isolated heat conductive structure and method therefor |
| 09/15/2004 | EP1458022A2 Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument |
| 09/15/2004 | EP1458021A2 Semiconductor device fabrication method |
| 09/15/2004 | EP1458020A2 Method for forming a void free VIA |
| 09/15/2004 | EP1458019A2 Mobile transportable electrostatic substrate holders |
| 09/15/2004 | EP1458018A1 Electronic component device and manufacturing method therefor |
| 09/15/2004 | EP1458017A1 Silicon wafer and method for production of silicon wafer |
| 09/15/2004 | EP1458015A2 Spin coating apparatus for coating photoresist |
| 09/15/2004 | EP1458014A1 Daf tape adhering apparatus and method |
| 09/15/2004 | EP1458013A1 A method and an apparatus for determining a position of a substrate relative to a support stage |
| 09/15/2004 | EP1458012A2 Ultraviolet light irradiating method and an apparatus using the same |
| 09/15/2004 | EP1458006A1 Continuous deposition of insulating material using multiple anodes alternated between positive and negative voltages |