Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/23/2004WO2004082014A1 Vision system and method for calibrating a wafer carrying robot
09/23/2004WO2004082013A1 Alignment system for integrated circuit fabrication
09/23/2004WO2004082011A1 Semiconductor device and method for manufacturing semiconductor device
09/23/2004WO2004082010A2 Method of improving interlayer adhesion
09/23/2004WO2004082009A1 Device for cleaning cvd device and method of cleaning cvd device
09/23/2004WO2004082008A1 Cvd apparatus and method for cleaning cvd apparatus
09/23/2004WO2004082007A1 Substrate holding structure for semiconductor processing, and plasma processing device
09/23/2004WO2004082005A1 Semiconductor mos, cmos devices and capacitors and method of manufacturing the same
09/23/2004WO2004082004A1 Method of delineating a conducting element which is disposed on an insulating layer, and device and transistor thus obtained
09/23/2004WO2004082003A2 Apparatuses and methods for forming a substantially facet-free epitaxial film
09/23/2004WO2004082002A1 A method of forming an element of a microelectronic circuit
09/23/2004WO2004082001A1 Method for the production of stress-relaxed layer structure on a non-lattice adapted substrate and utilization of said layer system in electronic and/or optoelectronic components
09/23/2004WO2004082000A1 Method for forming pattern in semi-conductor device
09/23/2004WO2004081997A1 Semiconductor device producing device, and semiconductor device producing method
09/23/2004WO2004081996A1 Gate valve for semiconductor treatment system and vacuum container
09/23/2004WO2004081995A1 Method and system to compensate for scanner system timing variability in a semiconductor wafer fabrication system
09/23/2004WO2004081994A2 Substrate support lift mechanism
09/23/2004WO2004081992A2 Semiconductor wafer with non-rectangular shaped dice
09/23/2004WO2004081990A2 Coated metal stud bump formed by a coated wire for flip chip
09/23/2004WO2004081989A2 Angled implant for trench isolation
09/23/2004WO2004081987A2 Sige rectification process
09/23/2004WO2004081986A2 Method to planarize and reduce defect density of silicon germanium
09/23/2004WO2004081984A2 Two-step post nitridation annealing for lower eot plasma nitrided gate dielectrics
09/23/2004WO2004081983A2 Substrate processing apparatus and method for the controlled formation of layers incuding self-assembled monolyaers
09/23/2004WO2004081982A2 Shallow trench isolation process
09/23/2004WO2004081976A2 Thin film transistor substrate ofa display device and method of manufacturing the same
09/23/2004WO2004081974A2 A method of producing substrates or components on substrates involving transfer of a useful layer, for microelectronics, optoelectronics, or optics
09/23/2004WO2004081943A1 Magnetic memory device and read method thereof
09/23/2004WO2004081262A1 Method of electroplating a workpiece having high-aspect ratio holes
09/23/2004WO2004081261A2 Plating apparatus
09/23/2004WO2004081258A2 Apparatus and method for non-contact cleaning of a surface
09/23/2004WO2004081255A1 Semiconductor device
09/23/2004WO2004080889A2 Crystalline membranes
09/23/2004WO2004080887A1 Three dimensional mecrofabrication
09/23/2004WO2004080852A1 Automatic storage system
09/23/2004WO2004080642A1 Laser beam machining method
09/23/2004WO2004066347A3 Device for producing electroconductive passages in a semiconductor wafer by means of thermomigration
09/23/2004WO2004066307A3 Stacked memory cell having diffusion barriers
09/23/2004WO2004061974A3 Silicon carbide power mos field effect transistors and manufacturing methods
09/23/2004WO2004049072A3 Method and apparatus for overlay control using multiple targets
09/23/2004WO2004042794B1 Removal of particle contamination on patterned slilicon/silicon dioxide using supercritical carbon dioxide/chemical formulations
09/23/2004WO2004042779A3 Method of detaching a thin film at moderate temperature after co-implantation
09/23/2004WO2004038770A3 Integrated circuit arrangement comprising a capacitor, and production method
09/23/2004WO2004037962A3 Aqueous phosphoric acid compositions for cleaning semiconductor devices
09/23/2004WO2004032182A3 Method for making a wire nanostructure in a semiconductor film
09/23/2004WO2003107382A3 Plasma apparatus and method for processing a substrate
09/23/2004WO2002095802A3 Methods and apparatus for semiconductor testing
09/23/2004WO2002044811A3 Polymers blends and their use in photoresist compositions for microlithography
09/23/2004US20040187058 Semiconductor integrated circuit and scan test method therefor
09/23/2004US20040187057 Logic circuit and methods for designing and testing the same
09/23/2004US20040186626 Robot hand
09/23/2004US20040186622 Wafer processing apparatus and transfer device adjustment system
09/23/2004US20040186621 Method of implementing multiple pump speeds for dispensing a viscous material
09/23/2004US20040186610 Semiconductor processing process control system and its control method
09/23/2004US20040186609 Process monitoring system for lithography lasers
09/23/2004US20040186605 Balancing work release based on both demand and supply variables
09/23/2004US20040186223 Etch-stop resins
09/23/2004US20040186008 Catalyst-imparting treatment solution and electroless plating method
09/23/2004US20040185811 Single chip direct conversion transceiver for reducing DC offset and method of manufacturing the same
09/23/2004US20040185751 Substrate processing apparatus
09/23/2004US20040185694 Contact for spiral contactor and spiral contactor
09/23/2004US20040185683 Wiring, display device and method of manufacturing the same
09/23/2004US20040185681 Novel polysilicon material and semiconductor devices formed therefrom
09/23/2004US20040185680 Method and device for thermal treatment of substrates
09/23/2004US20040185679 Forming a dielectric layer using porogens
09/23/2004US20040185678 Integrated circuit dielectric and method
09/23/2004US20040185677 Method for stabilizing high pressure oxidation of a semiconductor device
09/23/2004US20040185676 Semiconductor device and method of manufacturing semiconductor device
09/23/2004US20040185675 Magnetoresistive random access memory (mram) cell patterning
09/23/2004US20040185674 Nitrogen-free hard mask over low K dielectric
09/23/2004US20040185673 Film formation method and manufacturing method of semiconductor device
09/23/2004US20040185672 PIN alloy-semiconductor, radiation detectors with rectifying junction contacts, methods and systems for forming PIN alloy-semiconductor devices with rectifying junction contacts, and systems and methods for analyzing alloy-semiconductor properties
09/23/2004US20040185671 Method for fabricating semiconductor device
09/23/2004US20040185670 Processing system and method for treating a substrate
09/23/2004US20040185669 Method of etching a SiN/Ir/TaN or SiN/Ir/Ti stack using an aluminum hard mask
09/23/2004US20040185668 Method of fabricating semiconductor device using Plasma-Enhanced CVD
09/23/2004US20040185667 Method of continuous processing of thin-film batteries and like devices
09/23/2004US20040185666 Single crystalline aluminum nitride film, method of forming the same, base substrate for group III element nitride film, light emitting device and surface acoustic wave device
09/23/2004US20040185665 Fabrication method of semiconductor wafer
09/23/2004US20040185664 Method of and apparatus for manufacturing a semiconductor device using a polysilicon hard mask
09/23/2004US20040185663 Semiconductor device and method of manufacturing the same
09/23/2004US20040185662 Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
09/23/2004US20040185661 Scrubber system for pretreatment of an effluent waste stream containing arsenic
09/23/2004US20040185660 Method for manufacturing semiconductor device
09/23/2004US20040185659 Method for manufacturing semiconductor device
09/23/2004US20040185658 Method of forming inter-dielectric layer in semiconductor device
09/23/2004US20040185657 Semiconductor device having landing pad and fabrication method thereof
09/23/2004US20040185656 Filling small dimension vias using supercritical carbon dioxide
09/23/2004US20040185655 Barc etch comprising a selective etch chemistry and a high polymerizing gas for CD control
09/23/2004US20040185654 Low-temperature growth high-quality ultra-thin praseodymium gate dielectrics
09/23/2004US20040185653 Semiconductor device and method for fabricating the same
09/23/2004US20040185652 Integrated circuit with modified metal features and method of fabrication therefor
09/23/2004US20040185651 [method of forming bumps]
09/23/2004US20040185650 Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls
09/23/2004US20040185649 [a wafer bumping process]
09/23/2004US20040185648 Diffusion connections for integrated circuits
09/23/2004US20040185647 Floating gate nitridation
09/23/2004US20040185646 Method for creating a stepped structure on a substrate
09/23/2004US20040185645 Perovskite-type material forming methods, capacitor dielectric forming methods, and capacitor constructions
09/23/2004US20040185644 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and stencil mask