| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/30/2004 | US20040188670 Increasing stress-enhanced drive current in a MOS transistor |
| 09/30/2004 | US20040188641 Device for the detection of substrates stacked with a specific spacing |
| 09/30/2004 | US20040188636 Exposure apparatus |
| 09/30/2004 | US20040188635 Electron beam apparatus with aberration corrector |
| 09/30/2004 | US20040188631 Ion implantation ion source, system and method |
| 09/30/2004 | US20040188628 Apparatus and method for measuring EUV light intensity distribution |
| 09/30/2004 | US20040188621 Infrared absorption measurement method, infrared absorption measurement device, and method of manufacturing semiconductor device |
| 09/30/2004 | US20040188609 Inspection method and apparatus using an electron beam |
| 09/30/2004 | US20040188503 Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
| 09/30/2004 | US20040188501 Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process |
| 09/30/2004 | US20040188499 Wire bonding method and wire bonding apparatus |
| 09/30/2004 | US20040188497 Solder reflow type electrical apparatus packaging having integrated circuit and discrete components |
| 09/30/2004 | US20040188487 Apparatus and method for splitting substrates |
| 09/30/2004 | US20040188413 Ceramic Susceptor and Semiconductor or Liquid-Crystal Manufacturing Apparatus in Which the Susceptor Is Installed |
| 09/30/2004 | US20040188400 Wafer dicing device and method |
| 09/30/2004 | US20040188399 Energy-efficient, laser-based method and system for processing target material |
| 09/30/2004 | US20040188387 Removing silicon nano-crystals |
| 09/30/2004 | US20040188386 Substrate treating method and apparatus |
| 09/30/2004 | US20040188385 Etching agent composition for thin films having high permittivity and process for etching |
| 09/30/2004 | US20040188383 Non-resolving mask tiling method for flare reduction |
| 09/30/2004 | US20040188381 Positive tone bi-layer imprint lithography method |
| 09/30/2004 | US20040188380 Dry etch process to edit copper lines |
| 09/30/2004 | US20040188378 Bumping process |
| 09/30/2004 | US20040188321 Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed |
| 09/30/2004 | US20040188320 Thin wafer insert |
| 09/30/2004 | US20040188319 Wafer carrier having improved processing characteristics |
| 09/30/2004 | US20040188273 Measurement electrical resistance of electroconductive coatings on substrate; detection of end-points |
| 09/30/2004 | US20040188265 Methods for reducing protrusions and within die thickness variations on plated thin film |
| 09/30/2004 | US20040188260 Method of plating a semiconductor structure |
| 09/30/2004 | US20040188244 Electro-chemical machining apparatus |
| 09/30/2004 | US20040188243 Apparatus for enhancing the lifetime of stencil masks |
| 09/30/2004 | US20040188240 connecting a remote plasma generator to a rapid thermal processing chamber and introducing nitrogen plasma into the chamber as the metal layer is converted into a nitridated metal salicide layer |
| 09/30/2004 | US20040188239 Ionized PVD with sequential deposition and etching |
| 09/30/2004 | US20040188136 Method of production of multilayer circuit board with built-in semiconductor chip |
| 09/30/2004 | US20040188026 Bonding apparatus |
| 09/30/2004 | US20040188021 Method and system for monitoring RF impedance to determine conditions of a wafer on an electrostatic chuck |
| 09/30/2004 | US20040188020 Wafer supporter |
| 09/30/2004 | US20040188018 Wafer protection system |
| 09/30/2004 | US20040187984 of copper and molybdenum, and aluminum, gold, silver, titanium, nickel, cobalt or silicon; improved corrosion resistance |
| 09/30/2004 | US20040187975 Metal filling method and memeber with filled metal sections |
| 09/30/2004 | US20040187968 Reacting aluminum hydrocarbylamine chelate compound precursor to form aluminum nitride or alumina; oxidation, nitriding, vapor deposition |
| 09/30/2004 | US20040187899 Chamber for wafer cleaning and method for making the same |
| 09/30/2004 | US20040187896 Substrate processing method and apparatus |
| 09/30/2004 | US20040187894 Evacuation source configured to depressurize lower volume when in operation to cause a pressure in upper volume to be higher |
| 09/30/2004 | US20040187891 Longitudinally extending hollow member including gaseous bubble producing apertures extending through a side wall applying ultrasound energy; circulation, filtration |
| 09/30/2004 | US20040187792 Chamber for high-pressure wafer processing and method for making the same |
| 09/30/2004 | US20040187791 Mobile transportable electrostatic substrate holder |
| 09/30/2004 | US20040187789 Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed |
| 09/30/2004 | US20040187788 Gas-cooled clamp for RTP |
| 09/30/2004 | US20040187787 Substrate support having temperature controlled substrate support surface |
| 09/30/2004 | US20040187786 Processing apparatus for processing sample in predetermined atmosphere |
| 09/30/2004 | US20040187785 Deposition apparatus and deposition method |
| 09/30/2004 | US20040187781 Vacuum chamber assembly |
| 09/30/2004 | US20040187780 Thin film deposition reactor |
| 09/30/2004 | US20040187779 Thin film deposition reactor |
| 09/30/2004 | US20040187778 Process and device for producing a layer of tantalum pentoxide on a carrier material, in particular titanium nitride, and integrated circuit incorporating a layer of tantalum pentoxide |
| 09/30/2004 | US20040187777 CVD apparatus |
| 09/30/2004 | US20040187769 Method of producing SOI wafer |
| 09/30/2004 | US20040187766 Method of fabricating monocrystalline crystals |
| 09/30/2004 | US20040187731 Bath contains carrier; water soluble, mercapto-containing organic brightener; and leveling agent; semiconductor connectors |
| 09/30/2004 | US20040187722 Alignment system for lithographic apparatus for measuring a position of an alignment mark |
| 09/30/2004 | US20040187616 Bellows lateral stiffness adjustment |
| 09/30/2004 | US20040187575 Semiconductor dynamic sensor, and methods of transport and collet suction for the same |
| 09/30/2004 | US20040187551 Device and method for fabricating lead frame by press forming, and resultant lead frame |
| 09/30/2004 | US20040187544 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 09/30/2004 | US20040187452 Load-lock system, exposure processing system, and device manufacturing method |
| 09/30/2004 | US20040187451 Substrate transport apparatus, pod and method |
| 09/30/2004 | US20040187344 Heat treatment apparatus and method of heat treatment |
| 09/30/2004 | US20040187342 Substrate treating method and apparatus |
| 09/30/2004 | US20040187338 Vacuum processing apparatus and operating method therefor |
| 09/30/2004 | US20040187337 Vacuum processing apparatus and operating method therefor |
| 09/30/2004 | US20040187310 Method of using micro-contact imprinted features for formation of electrical interconnects for substrates |
| 09/30/2004 | US20040187308 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 09/30/2004 | US20040187307 Heat sink |
| 09/30/2004 | US20040187306 Temperature sustaining flip chip assembly process |
| 09/30/2004 | US20040187304 Enhancement of Cu line reliability using thin ALD TaN film to cap the Cu line |
| 09/30/2004 | US20040187298 System for handling microelectronic dies having a non-piercing die ejector |
| 09/30/2004 | US20040187280 Work attracting apparatus and work attracting method |
| 09/30/2004 | DE69630730T2 Analogabtastpfadzelle Analogabtastpfadzelle |
| 09/30/2004 | DE4447597B4 Semiconductor device with improved wiring structure |
| 09/30/2004 | DE202004010351U1 Mobile, electrostatic substrate click for wafers in semiconductor manufacture, comprises additional capacitor structures for charge storage, extending over several electrode levels, on support substrate |
| 09/30/2004 | DE19930169B4 Testeinrichtung und Verfahren zum Prüfen eines Speichers Test device and method for testing a memory |
| 09/30/2004 | DE19736754B4 Integriertes Gasentladungsbauelement zum Überspannungsschutz Integrated gas discharge device for overvoltage protection |
| 09/30/2004 | DE19718983B4 Vorrichtungen, Verwendung und Verfahren zum Aufbringen einer Substanz auf eine Oberfläche eines Halbleiterwafers Devices, use and method of applying a substance to a surface of a semiconductor wafer |
| 09/30/2004 | DE10358964A1 Magnetowiderstandsdirektzugriffsspeicher und Herstellungsverfahren hierzu Magnetoresistive random access memory and manufacturing method therefor |
| 09/30/2004 | DE10351609A1 Halbleiterbauelement und dessen Herstellungsverfahren A semiconductor device and its manufacturing method |
| 09/30/2004 | DE10351511A1 Halbleitervorrichtung Semiconductor device |
| 09/30/2004 | DE10322751B3 Production of an optoelectronic component encased in a plastic comprises connecting an optical window as optical window wafer to semiconductor chips in a semiconductor wafer |
| 09/30/2004 | DE10312109A1 Manufacture of solder contacts on semiconductor wafer chip, by applying structured solder film to contact pad arrangement on chips and melting |
| 09/30/2004 | DE10310842A1 Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse und Verfahren zur Herstellung desselben The same electronic device having the semiconductor chip and the plastic housing and methods for preparing |
| 09/30/2004 | DE10310811A1 Production of a trench capacitor used in integrated circuits comprises forming a trench in a substrate using a hard mask, forming a capacitor dielectric in the lower and middle trench region, and further processing |
| 09/30/2004 | DE10310740A1 Verfahren zur Herstellung einer spannungsrelaxierten Schichtstruktur auf einem nicht gitterangepassten Substrat, sowie Verwendung eines solchen Schichtsystems in elektronischen und/oder optoelektronischen Bauelementen A method for producing a stress-relaxed layer structure on a non-lattice matched substrate, as well as use of such a layer system in electronic and / or optoelectronic devices |
| 09/30/2004 | DE10310346A1 Manufacturing photomask on semiconductor structure, involves filling wells in semiconductor structure, removing filling layer, and forming photomask on planar surface of auxiliary layer |
| 09/30/2004 | DE10303771B3 Production of a field effect transistor comprises forming an origin web made from semiconductor material on a substrate using lithography, forming a gate dielectric layer on the longitudinal sides of the web, and further processing |
| 09/30/2004 | DE10258467B3 Power semiconductor component used as a power transistor has a field electrode formed in the lower region of the trenches away from the upper surface of the semiconductor body |
| 09/30/2004 | DE10253250B4 Automatisches Präzisionsausrichtungsverfahren für eine Halbleiterwaferschneidevorrichtung Automatic precision alignment method for a semiconductor wafer cutter |
| 09/30/2004 | DE102004009647A1 Bondsystem und Halbleitersubstratherstellungsvefahren Bond system and Halbleitersubstratherstellungsvefahren |
| 09/30/2004 | DE10160521B4 Positioniereinrichtungen für Halbleiterobjekte Positioning devices for semiconductor objects |
| 09/30/2004 | CA2519893A1 Electrical connections in substrates |
| 09/29/2004 | EP1463382A1 Hot plate unit |