| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/27/2005 | WO2005008849A2 Method of forming a scribe line on a passive electronic component substrate |
| 01/27/2005 | WO2005008795A1 Nitride semiconductor light emitting device |
| 01/27/2005 | WO2005008785A1 Thin film transistor and method for manufacturing same |
| 01/27/2005 | WO2005008779A1 Lens sensor and method for the production thereof and detection device |
| 01/27/2005 | WO2005008778A1 Integrated circuit device, and method of fabricating same |
| 01/27/2005 | WO2005008777A1 Multi-power source semiconductor device |
| 01/27/2005 | WO2005008772A2 Electronic component and flat conductor frame comprising a structured metal layer which is non-wettable by a solder material for the production of the component |
| 01/27/2005 | WO2005008771A1 Method of forming a contact hole with a barrier layer in a device and resulting device |
| 01/27/2005 | WO2005008770A1 Dram-semi conductor memory cell and method for the production thereof |
| 01/27/2005 | WO2005008769A1 Transportation apparatus and drive mechanism |
| 01/27/2005 | WO2005008767A2 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump |
| 01/27/2005 | WO2005008766A1 Method for generation of soldered contacts on components and component or solder deposit support plate suitable for application in said method |
| 01/27/2005 | WO2005008764A1 Vertical boat for heat treatment, and method of producing the same |
| 01/27/2005 | WO2005008763A2 Methods of forming deuterated silicon nitride-containing materials |
| 01/27/2005 | WO2005008762A1 Low-permittivity film, and production method therefor, and electronic component using it |
| 01/27/2005 | WO2005008761A1 Layered components, materials, methods of production and uses thereof |
| 01/27/2005 | WO2005008760A2 Method for anisotropically etching a recess in a silicon substrate and use of a plasma etching system |
| 01/27/2005 | WO2005008759A1 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/27/2005 | WO2005008758A1 Ultra-uniform silicides in integrated circuit technology |
| 01/27/2005 | WO2005008757A1 n-TYPE OHMIC ELECTRODE FOR n-TYPE GROUP III NITRIDE SEMICONDUCTOR, SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH THE ELECTRODE, AND METHOD FOR FORMING n-TYPE OHMIC ELECTRODE |
| 01/27/2005 | WO2005008756A1 Method for implantation through an irregular surface |
| 01/27/2005 | WO2005008755A1 Temperature control method, substrate processing system and process for producing semiconductor |
| 01/27/2005 | WO2005008754A1 Flare measurement method, exposure method, and flare measurement mask |
| 01/27/2005 | WO2005008753A1 Template creation method and device, pattern detection method, position detection method and device, exposure method and device, device manufacturing method, and template creation program |
| 01/27/2005 | WO2005008752A1 Exposure device, exposure method, and device manufacturing method |
| 01/27/2005 | WO2005008751A1 Multi-layer barrier allowing recovery anneal for ferroelectric capacitors |
| 01/27/2005 | WO2005008750A1 Production device control management system |
| 01/27/2005 | WO2005008749A1 Ceramic bonded compact, process for producing ceramic bonded compact, ceramic temperature controller and ceramic temperature control unit |
| 01/27/2005 | WO2005008748A1 An image sensor with a vertical overflow drain and short micro-lens to silicon distance |
| 01/27/2005 | WO2005008746A2 Methods of forming a phosphorus doped silicon dioxide layer |
| 01/27/2005 | WO2005008745A2 Selective etching of silicon carbide films |
| 01/27/2005 | WO2005008744A2 A transistor device with metallic electrodes and a method for use in forming such a device |
| 01/27/2005 | WO2005008743A2 A semiconductor device with metallic electrodes and a method for use in forming such a device |
| 01/27/2005 | WO2005008740A2 Methods of processing of gallium nitride |
| 01/27/2005 | WO2005008739A2 Micellar technology for post-etch residues |
| 01/27/2005 | WO2005008738A2 SEMI-INSULATING GaN AND METHOD OF MAKING THE SAME |
| 01/27/2005 | WO2005008737A2 Inspection and metrology module cluster tool with multi-tool manager |
| 01/27/2005 | WO2005008730A2 Low cost, high performance flip chip package structure |
| 01/27/2005 | WO2005008726A2 Flip chip device assembly machine |
| 01/27/2005 | WO2005008724A2 Wafer-level chip scale package and method for fabricating and using the same |
| 01/27/2005 | WO2005008700A1 Electric double layer capacitor |
| 01/27/2005 | WO2005008450A2 Method and apparatus for nanogap device and array |
| 01/27/2005 | WO2005008355A1 Semiconductor device with high-breakdown-voltage regulator |
| 01/27/2005 | WO2005008350A1 Semiconductor production system and semiconductor production process |
| 01/27/2005 | WO2005007933A1 Electrochemical processing cell |
| 01/27/2005 | WO2005007770A1 Abrasive particles for chemical mechanical polishing |
| 01/27/2005 | WO2005007769A1 Method for setting firing temperature of cerium carbonate, method for producing cerium oxide abrasives and cerium oxide abrasives obtained by the method |
| 01/27/2005 | WO2005007748A1 Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device |
| 01/27/2005 | WO2005007718A1 Positive photoresist composition and method of forming resist pattern |
| 01/27/2005 | WO2005007564A1 Method for fixing metal particle, and method for producing metal particle-containing substrate, method for producing carbon nanotube-containing substrate and method for producing semiconductor crystalline rod-containing substrate respectively using such fixing method |
| 01/27/2005 | WO2005007342A1 Polishing apparatus |
| 01/27/2005 | WO2005007335A1 Laser processing method and device, and processed product |
| 01/27/2005 | WO2004106580B1 Mask retaining device |
| 01/27/2005 | WO2004105101A3 A process system health index and method of using the same |
| 01/27/2005 | WO2004104492A3 Optically ignited or electrically ignited self-contained heating unit and drug-supply unit employing same |
| 01/27/2005 | WO2004097909A3 Method and apparatus for deep trench silicon etch |
| 01/27/2005 | WO2004097907A3 Method for the production of permeable membranes from semiconductor materials using macro- and micro-pore etching |
| 01/27/2005 | WO2004097077A3 Method for the etching of permeable membranes made from semiconductor materials using macro- and meso-pore etching |
| 01/27/2005 | WO2004095515A3 Methods for contracting conducting layers overlying magnetoelectronic elements of mram devices |
| 01/27/2005 | WO2004093185A3 Electrical interconnect structures for integrated circuits and methods of manufacturing the same |
| 01/27/2005 | WO2004093152A3 Carrier with ultraphobic surfaces |
| 01/27/2005 | WO2004093147A3 Wafer carrier cleaning system |
| 01/27/2005 | WO2004092453A3 METHOD FOR GROWING SINGLE CRYSTAL GaN ON SILICON |
| 01/27/2005 | WO2004085305A3 Metal oxide-containing nanoparticles |
| 01/27/2005 | WO2004074931A3 Method and apparatus for megasonic cleaning of patterned substrates |
| 01/27/2005 | WO2004064121A3 A supercritical fluid cleaning system and method |
| 01/27/2005 | WO2004063028A3 Wafer shipping container |
| 01/27/2005 | WO2004061960A3 Semiconductor device power interconnect striping |
| 01/27/2005 | WO2004061920A3 Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer |
| 01/27/2005 | WO2004055864A3 Composition and method for copper chemical mechanical planarization |
| 01/27/2005 | WO2004053929A3 Semiconductor nanocrystal heterostructures |
| 01/27/2005 | WO2004032198A3 Method for maintaining solder thickness in flipchip attach packaging processes |
| 01/27/2005 | WO2004032193A3 Large-area nanoenabled macroelectronic substrates and uses therefor |
| 01/27/2005 | WO2004030049A3 A method and system for etching high-k dielectric materials |
| 01/27/2005 | WO2004025701A3 Load lock optimization method and system |
| 01/27/2005 | WO2004015776A3 Electrostatic discharge protection circuitry and method of operation |
| 01/27/2005 | WO2003063200A3 Method for improving the adhesion of a coating |
| 01/27/2005 | US20050022148 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method |
| 01/27/2005 | US20050022082 Integrated circuit test apparatus |
| 01/27/2005 | US20050021993 Semiconductor device card methods of intializing checking the authenticity and the indentity thereof |
| 01/27/2005 | US20050021303 Method for analyzing fail bit maps of wafers |
| 01/27/2005 | US20050021299 System for, method of and computer program product for detecting failure of manufacturing apparatuses |
| 01/27/2005 | US20050021272 Method and apparatus for performing metrology dispatching based upon fault detection |
| 01/27/2005 | US20050021268 Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus |
| 01/27/2005 | US20050021165 Mechanism for inter-fab mask process management |
| 01/27/2005 | US20050020793 Fluorinated copolymers for microlithography |
| 01/27/2005 | US20050020702 Organic compositions |
| 01/27/2005 | US20050020402 Apparatus and method for balancing and for providing a compliant range to a test head |
| 01/27/2005 | US20050020194 Method and apparatus for polishing a workpiece |
| 01/27/2005 | US20050020192 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 01/27/2005 | US20050020188 Polishing pad, method of producing same, and polishing method |
| 01/27/2005 | US20050020185 Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| 01/27/2005 | US20050020177 Apparatus and method for manufacturing liquid crystal display devices |
| 01/27/2005 | US20050020096 Method of fabricating semiconductor device |
| 01/27/2005 | US20050020095 Method for surface treating a semiconductor |
| 01/27/2005 | US20050020094 Strained semiconductor by full wafer bonding |
| 01/27/2005 | US20050020093 Method for forming flowable dielectric layer in semiconductor device |
| 01/27/2005 | US20050020092 Process for producing yttrium oxide thin films |
| 01/27/2005 | US20050020091 Wet etching method of removing silicon from a substrate and method of forming trench isolation |
| 01/27/2005 | US20050020090 Method for an integrated circuit contact |