Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2005
06/30/2005WO2005058562A1 Cutting device and control of the cutting device
06/30/2005WO2005058133A2 Implantable pressure sensors
06/30/2005WO2005044899A8 Prepolymer, prepolymer composition, high molecular weight polymer having structure containing hole and electrically insulating film
06/30/2005WO2005044451A9 Electrical connection of components
06/30/2005WO2005043603A3 Integrated ashing and implant annealing method
06/30/2005WO2005040011B1 Photochromic substrate container
06/30/2005WO2005038932A3 Fully depleted silicon-on-insulator cmos logic
06/30/2005WO2005038865A3 Amorphous carbon layer to improve photoresist adhesion
06/30/2005WO2005034207A3 Varying carrier mobility on finfet active surfaces to achieve overall design goals
06/30/2005WO2005031812A3 Improved copper bath for electroplating fine circuitry on semiconductor chips
06/30/2005WO2005031035A3 Method for producing thin semiconductor films by deposition from solution
06/30/2005WO2005024094A3 In-situ-etch-assisted hdp deposition using sif4 and hydrogen
06/30/2005WO2005019497A3 Methods of reducing plasma-induced damage for advanced plasma cvd dielectrics
06/30/2005WO2005013338A3 Production of a structure comprising a protective layer against chemical treatment
06/30/2005WO2005006458A3 Test structures and methods
06/30/2005WO2004108985A3 Methods for forming aluminum containing films utilizing amino aluminum precursors
06/30/2005WO2004105096A3 Method of making barrier layers
06/30/2005WO2004105093A3 Tetra-organic ammonium fluoride and hf in supercritical fluid for photoresist and residue removal
06/30/2005WO2004093145A3 Voltage tunable photodefinable dielectric and method of manufacture therefore
06/30/2005WO2004087563A3 Barrier layers for microelectromechanical systems
06/30/2005WO2004084287A9 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
06/30/2005WO2004083490A3 Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles
06/30/2005WO2004066027A3 Electron beam processing for mask repair
06/30/2005WO2004053905A3 Dye sensitized solar cells having foil electrodes
06/30/2005WO2004042798A3 Apparatus and method for treating objects with radicals generated from plasma
06/30/2005US20050144579 Method of calibrating semiconductor line width
06/30/2005US20050144576 Design method for semiconductor circuit device, design method for semiconductor circuit, and semiconductor circuit device
06/30/2005US20050144546 Semiconductor integrated circuit and evaluation method of wiring in the same
06/30/2005US20050144539 Semiconductor device capable of preventing malfunction resulting from false signal generated in level shift circuit
06/30/2005US20050144515 Semiconductor integrated circuit
06/30/2005US20050143849 Controlling method for manufacturing process
06/30/2005US20050143690 Cystotomy catheter capture device and methods of using same
06/30/2005US20050143534 relatively low lamination temperature; low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter
06/30/2005US20050143271 with a sulfur-containing detergent that forms a protective film to prevent corrosion of aluminum wires; used in the manufacture of a highly integrated semiconductor with advanced scale-down; e.g. oxalic acid, ammonium sulfate, ultrapure water
06/30/2005US20050143270 Cleaning solutions and etchants and methods for using same
06/30/2005US20050143035 Etching methods to prevent plasma damage to metal oxide semiconductor devices
06/30/2005US20050143022 Wireless programmable logic devices
06/30/2005US20050142996 Polishing pad and method of producing same
06/30/2005US20050142995 Method of controlling carrier head with multiple chambers
06/30/2005US20050142993 Multi-chamber carrier head with a flexible membrane
06/30/2005US20050142991 Substrate polishing apparatus
06/30/2005US20050142989 Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method
06/30/2005US20050142988 CMP process using slurry containing abrasive of low concentration
06/30/2005US20050142954 Modular sockets using flexible interconnects
06/30/2005US20050142898 Method for manufacturing a nano-structured electrode of metal oxide
06/30/2005US20050142897 Method for forming polycrystalline silicon film
06/30/2005US20050142896 Liquid drop jetting apparatus using charged beam and method for manufacturing a pattern using the apparatus
06/30/2005US20050142893 Method for manufacturing semiconductor device
06/30/2005US20050142892 Method and structure for fabricating a halftone mask for the manufacture of semiconductor wafers
06/30/2005US20050142891 Method and apparatus for oxidizing nitrides
06/30/2005US20050142890 Atomic layer deposition apparatus and method
06/30/2005US20050142889 Method of forming oxide layer in semiconductor device
06/30/2005US20050142888 Film bulk acoustic resonator and method for manufacturing the same
06/30/2005US20050142887 Method and apparatus for etchback profile control
06/30/2005US20050142886 Method for forming a contact in semiconductor device
06/30/2005US20050142885 Method of etching and etching apparatus
06/30/2005US20050142884 Storage nodes of a semiconductor memory
06/30/2005US20050142883 Apparatus and method for supplying chemicals
06/30/2005US20050142882 Semiconductor water manufacturing method and wafer
06/30/2005US20050142881 Mask and method of using the same
06/30/2005US20050142880 Polymer removal method for use in manufacturing semiconductor devices
06/30/2005US20050142879 Wafer bonded epitaxial templates for silicon heterostructures
06/30/2005US20050142878 Method for detecting end-point of chemical mechanical polishing process
06/30/2005US20050142877 Chemical-mechanical polishing proximity correction method and correction pattern thereof
06/30/2005US20050142876 Maskless lateral epitaxial overgrowth of aluminum nitride and high aluminum composition aluminum gallium nitride
06/30/2005US20050142875 Selective heating using flash anneal
06/30/2005US20050142874 Methods for fabricating a copper interconnect
06/30/2005US20050142873 Plasma processing method and plasma processing apparatus
06/30/2005US20050142872 Method of forming fine pattern for semiconductor device
06/30/2005US20050142871 Method of forming a conductive via plug
06/30/2005US20050142870 Method for manufacturing semiconductor device using dual-damascene pattern
06/30/2005US20050142869 Method for fabricating cylinder type capacitor
06/30/2005US20050142868 Method and apparatus for rapid cooldown of annealed wafer
06/30/2005US20050142867 Method for forming polysilicon plug of semiconductor device
06/30/2005US20050142866 Method for forming aluminum interconnect
06/30/2005US20050142865 Methods of fabricating via hole and trench
06/30/2005US20050142864 Methods for forming copper interconnect of semiconductor devices
06/30/2005US20050142863 Process for forming tapered trenches in a dielectric material
06/30/2005US20050142862 Dual damascene interconnection in semiconductor device and method for forming the same
06/30/2005US20050142861 Method of forming an interconnection line in a semiconductor device
06/30/2005US20050142860 Method for fabricating metal wirings of semiconductor device
06/30/2005US20050142859 Method for forming contact hole for dual damascene interconnection in semiconductor device
06/30/2005US20050142858 Method of forming barrier metal in semiconductor device
06/30/2005US20050142857 Method for forming metal line in semiconductor device
06/30/2005US20050142856 Method of fabricating interconnection structure of semiconductor device
06/30/2005US20050142855 Method for manufacturing semiconductor device
06/30/2005US20050142854 Methods for preventing copper oxidation in a dual damascene process
06/30/2005US20050142853 Dual damascene process for forming a multi-layer low-K dielectric interconnect
06/30/2005US20050142851 Method of fabricating MIM capacitor
06/30/2005US20050142850 Method of forming metal wiring of semiconductor device
06/30/2005US20050142849 Method for forming metal wirings of semiconductor device
06/30/2005US20050142848 Method for forming interlayer insulation film in semiconductor device
06/30/2005US20050142847 Method for forming metal wiring in semiconductor device
06/30/2005US20050142846 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
06/30/2005US20050142845 Method of forming plug of semiconductor device
06/30/2005US20050142844 Method for fabricating metal interconnect in semiconductor device
06/30/2005US20050142843 Method for forming metallic interconnects in semiconductor devices
06/30/2005US20050142842 Method for forming metal wiring of semiconductor device
06/30/2005US20050142841 Method for forming metal pattern to reduce contact resistivity with interconnection contact
06/30/2005US20050142840 Semiconductor device having a multilevel interconnection and a method for manufacturing the same
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