Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/03/2005US20050241128 Method of laminating low temperature co-fired ceramic (LTCC) material and product formed thereby
11/03/2005US20050241087 Cleaning device for a substrate
11/03/2005DE4426121B4 Verfahren zur Herstellung einer Halbleiterspeichervorrichtung A method of manufacturing a semiconductor memory device
11/03/2005DE4309898B4 Verfahren zur Herstellung eines Bipolartransistors mit einer Polysiliziumschicht zwischen einem Halbleiterbereich und einem Oberflächenelektrodenmetall A process for producing a bipolar transistor having a polysilicon layer between a semiconductor region and a surface of electrode metal
11/03/2005DE4223658B4 Testvorrichtung für Halbleiter-Chips Test apparatus for semiconductor chips
11/03/2005DE19960563B4 Halbleiterstruktur und entsprechendes Herstellungsverfahren Semiconductor structure and corresponding manufacturing method
11/03/2005DE19919716B4 Mikroelektronische Baugruppe Microelectronic assembly
11/03/2005DE19880680B4 Halbleiterbauelement-Testgerät und Verfahren zur Durchführung von Tests in einem solchen A semiconductor device testing apparatus and method for performing tests, in such a
11/03/2005DE19856805B4 Grabenisolierstruktur und Verfahren zu ihrer Herstellung Trench isolation structure and methods for their preparation
11/03/2005DE19845294B4 Halbleitervorrichtung und Herstellungsverfahren einer Halbleitervorrichtung A semiconductor device and manufacturing method of a semiconductor device
11/03/2005DE19735425B4 Mosfet Mosfet
11/03/2005DE10393631T5 Floatgate-Transistoren The floating gate transistors
11/03/2005DE10356885B4 Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement A method for housings of components and a housed component
11/03/2005DE10356668B4 Herstellungsverfahren für eine Hartmaske auf einer Halbleiterstruktur Production method of a hard mask on a semiconductor structure
11/03/2005DE10354263B4 Verfahren zum Polieren einer Vielzahl von Halbleiterscheiben A method of polishing a plurality of semiconductor wafers
11/03/2005DE10258194B4 Halbleiterspeicher mit Charge-trapping-Speicherzellen und Herstellungsverfahren Semiconductor memory having charge trapping memory cells and manufacturing processes
11/03/2005DE10217610B4 Metall-Halbleiter-Kontakt, Halbleiterbauelement, integrierte Schaltungsanordnung und Verfahren Metal-semiconductor junction, semiconductor device, integrated circuit and method
11/03/2005DE102005018280A1 Semiconductor device, e.g. liquid crystal display driver integrated circuit package, includes bump structures having width greater than pitch gap between successively arrayed bump structures, and having non-conductive sidewall
11/03/2005DE102005017288A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Graben in einem Siliziumcarbid-Halbleitersubstrat A method of manufacturing a semiconductor device having a trench in a silicon carbide semiconductor substrate
11/03/2005DE102005016830A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/03/2005DE102005015362A1 Production of praseodymium layers comprises depositing metallic praseodymium on thin silica, silicon oxynitride or silicon nitride layer, reacting deposited praseodymium with oxygen or water vapor and heating substrate in pure nitrogen
11/03/2005DE102005015138A1 Fabrication of semiconductor device involves etching first portions of conductive layer formed outside openings in faster rate than second portions of the conductive layer formed inside the openings to obtain lower electrodes
11/03/2005DE102005013787A1 Arsen-Dotiermittel für das Ziehen von Siliziumeinzelkristallen, Verfahren für deren Erzeugung und Verfahren zur Erzeugung eines Siliziumeinzelkristalls unter deren Verwendung Arsenic dopant for pulling silicon single crystals, methods for their production and process for producing a silicon single crystal using them
11/03/2005DE102005012607A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
11/03/2005DE102005012144A1 Futter- bzw. Einspanntisch zur Verwendung in einer Laserstrahlbearbeitungsmaschine Chuck table for use in a laser beam processing machine
11/03/2005DE102005008491A1 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
11/03/2005DE102005006766A1 Niedrig dotierte Schicht für ein nitrid-basiertes Halbleiterbauelement Lightly doped layer for a nitride-based semiconductor device
11/03/2005DE102004063066A1 Vorrichtung und Verfahren zur Waferplanierung Apparatus and method for Waferplanierung
11/03/2005DE102004041026A1 Contact formation at predetermined points, comprises filling a mould containing contact cut outs, with a hardenable elastic material, hardening and removal
11/03/2005DE102004035595A1 Verfahren zur Justage eines Projektionsobjektives Method for adjusting a projection objective
11/03/2005DE102004031515A1 Halbleiterbauelement Semiconductor device
11/03/2005DE102004023305A1 Leistungshalbleiter Power semiconductor
11/03/2005DE102004020328A1 Separating a carbon doped silicon containing dielectric layer by low temperature gas phase separation of a surface comprises reacting silicon organic compound with hydrogen peroxide to separate a dielectric layer on surface
11/03/2005DE102004019445A1 Mit planarer Verbindungstechnik auf einem insbesondere elektrischleitendem Substrat aufgebaute Schaltung Circuit with planar connection technology built on a particular substrate elektrischleitendem
11/03/2005DE102004019435A1 An einer Kühlrippe angeordnetes Bauelement Arranged on a cooling fin component
11/03/2005DE102004018817A1 Removing material substrate surface for manufacturing semiconductor integrated circuits and devices by introducing pressurized processing solution in vessel to expose surface to processing solution
11/03/2005DE102004018454A1 Verfahren und Vorrichtung zum Überwachen des Ätzvorgangs einer regelmässigen Tiefenstruktur in einem Halbleitersubstrat Method and apparatus for monitoring of the etching of regular deep structure in a semiconductor substrate
11/03/2005DE102004018250A1 Wafer-Stabilisierungsvorrichtung und Verfahren zu dessen Herstellung Wafer-stabilizing device and method of producing the
11/03/2005DE102004017690A1 Vorrichtung und Verfahren zur Aufnahme eines Gesamtbildes einer Oberfläche eines Halbleitersubstrats Device and method for recording an overall image of a surface of a semiconductor substrate
11/03/2005DE102004017452A1 Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece
11/03/2005DE102004017114A1 Vorrichtung zur Handhabung eines scheibenartigen Elements, insbesondere zur Handhabung eines Wafers A device for handling a disc-like element, in particular for handling of a wafer
11/03/2005DE102004015994A1 Vorrichtung zur Vereinzelung und Positionierung von Modulbrücken Apparatus for separating and positioning module bridges
11/03/2005DE102004015091A1 Verdrahtungsträger-Design Wiring board design
11/03/2005DE102004014752A1 Halbleiterbauelement mit kernlosem Wandler Semiconductor component with coreless transformer
11/03/2005DE10164880B4 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode
11/03/2005DE10162956B4 Substratbehandlungsvorrichtung The substrate processing apparatus
11/03/2005CA2563775A1 Arrayed ultrasonic transducer
11/03/2005CA2560688A1 Etching of substrates of light emitting devices
11/02/2005EP1592071A1 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device
11/02/2005EP1592069A2 High voltage field-effect transistor and method of manufacture thereof
11/02/2005EP1592065A1 Field-effect-transistor coding/decoding architectures and methods of forming the same
11/02/2005EP1592059A2 Heat sink and method for processing surfaces thereof
11/02/2005EP1592058A2 Method of selective thermal release from a heat peelable sheet and corresponding apparatus
11/02/2005EP1592057A2 Method and apparatus for removing and/or preventing surface contamination of a probe
11/02/2005EP1592055A2 Method of making a power semiconductor device
11/02/2005EP1592054A1 Display manufacturing method
11/02/2005EP1592053A1 Wiring fabricating method
11/02/2005EP1592052A1 Method for manufacturing display
11/02/2005EP1592051A1 Cvd method for forming silicon nitride film on target substrate
11/02/2005EP1592048A1 Semiconductor substrate, field-effect transistor, and their production methods
11/02/2005EP1592047A2 Integrated passive devices and method of manufacture
11/02/2005EP1592046A2 Semiconductor device manufacturing method
11/02/2005EP1592045A1 Silicon semiconductor substrate and its manufacturing method
11/02/2005EP1592044A1 Gas driven planetary rotation apparatus and methods of using the same
11/02/2005EP1592043A2 Device for measuring pressure for vacuum systems
11/02/2005EP1592024A2 Operation scheme with charge balancing erase for charge trapping non-volatile memory
11/02/2005EP1591853A2 Remote maintenance method, industrial device and semiconductor device
11/02/2005EP1591833A2 Exposure method and apparatus
11/02/2005EP1591832A2 Photosensitive composition, compound used in the same, and patterning method using the same
11/02/2005EP1591751A2 Method and apparatus for measuring micro-structure, and micro-structure analytical system
11/02/2005EP1591559A1 Film formation method and apparatus utizing plasma cvd
11/02/2005EP1591557A1 Coating method for In-line apparatus.
11/02/2005EP1591504A1 Pressure-sensitive adhesive tape for pasting wafer thereto
11/02/2005EP1591465A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
11/02/2005EP1591059A1 Application of a protective cover on an ophthalmologic device
11/02/2005EP1590837A2 High density and high programming efficiency mram design
11/02/2005EP1590836A2 Mram cells having magnetic write lines with a stable magnetic state at the end regions
11/02/2005EP1590832A2 Storage cell, storage cell arrangement, and method for the production of a storage cell
11/02/2005EP1590829A2 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
11/02/2005EP1590828A2 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency
11/02/2005EP1590827A2 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
11/02/2005EP1590510A2 Device for producing electroconductive passages in a semiconductor wafer by means of thermomigration
11/02/2005EP1590505A2 Composition and method for copper chemical mechanical planarization
11/02/2005EP1590498A1 Methods of making carbon nanotube films, layers, fabrics, ribbons, elements and articles
11/02/2005EP1590497A2 Method and apparatus for layer by layer deposition of thin films
11/02/2005EP1590421A2 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
11/02/2005EP1590413A1 Selective barrier metal polishing solution
11/02/2005EP1590307A2 Methods for transferring supercritical fluids in microelectronic and other industrial processes
11/02/2005EP1573788A3 Method and system for fabricating multi layer devices on a substrate
11/02/2005EP1482567A9 Light-emitting device comprising led chip and method for manufacturing this device
11/02/2005EP1482540A9 Method for forming thin film
11/02/2005EP1451854B1 Wafer transfer member with electric conductivity and its manufacturing method
11/02/2005EP1387808B1 Device for gripping and holding an object in a contactless manner
11/02/2005EP1307923B1 High-voltage diode and method for the production thereof
11/02/2005EP1307416B1 Process for preparing octafluorocyclobutane
11/02/2005EP1142002B1 Apparatus for processing wafers
11/02/2005EP1101145B1 Method and apparatus for providing rectangular shaped array of light beams
11/02/2005EP0860022B1 Electronic device manufacture
11/02/2005CN2738395Y Tube type polishing pressure ring
11/02/2005CN2737501Y Polising product for processing base material
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