Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/08/2005US6963099 Magnetic memory device and method of manufacturing the same
11/08/2005US6963097 Ferroelectric random access memory capacitor and method for manufacturing the same
11/08/2005US6963096 Semiconductor element having a semi-magnetic contact
11/08/2005US6963095 Ferroelectric memory device and method for fabricating the same
11/08/2005US6963094 Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
11/08/2005US6963093 Solid-state imaging device and method for producing the same
11/08/2005US6963090 Enhancement mode metal-oxide-semiconductor field effect transistor
11/08/2005US6963088 Semiconductor component
11/08/2005US6963085 Solid-state display with improved color-mixing
11/08/2005US6963084 Semiconductor device having a storage capacitor
11/08/2005US6963083 Liquid crystal display device having polycrystalline TFT and fabricating method thereof
11/08/2005US6963080 Thin film transistors using solution processed pentacene precursor as organic semiconductor
11/08/2005US6963078 Dual strain-state SiGe layers for microelectronics
11/08/2005US6963077 Sublithographic nanoscale memory architecture
11/08/2005US6963072 Integral lens for high energy particle flow, method for producing such lenses and use thereof in analysis devices and devices for radiation therapy and lithography
11/08/2005US6963052 Heater module for semiconductor manufacturing equipment
11/08/2005US6963033 Ball grid array attaching means having improved reliability and method of manufacturing same
11/08/2005US6962954 Activated polyethylene glycol compounds
11/08/2005US6962902 Compounds for control of appetite, blood pressure, cardiovascular response, libido, and circadian rhythm
11/08/2005US6962884 Monitoring low temperature rapid thermal anneal process using implanted wafers
11/08/2005US6962883 Integrated circuit insulator and method
11/08/2005US6962882 Method of fabricating a semiconductor device having a nanoparticle porous oxide film
11/08/2005US6962881 Method for fabricating semiconductor integrated circuit device
11/08/2005US6962880 Method for fabricating semiconductor integrated circuit device
11/08/2005US6962879 Method of plasma etching silicon nitride
11/08/2005US6962878 Method to reduce photoresist mask line dimensions
11/08/2005US6962877 Methods of preventing oxidation of barrier metal of semiconductor devices
11/08/2005US6962876 Method for forming a low-k dielectric layer for a semiconductor device
11/08/2005US6962875 Variable contact method and structure
11/08/2005US6962874 Method for fabricating semiconductor device
11/08/2005US6962873 Nitridation of electrolessly deposited cobalt
11/08/2005US6962871 Composite polymer dielectric film
11/08/2005US6962870 Method of manufacturing semiconductor device and semiconductor device
11/08/2005US6962869 SiOCH low k surface protection layer formation by CxHy gas plasma treatment
11/08/2005US6962868 Semiconductor integrated circuit device and wiring arranging method thereof
11/08/2005US6962867 Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
11/08/2005US6962865 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
11/08/2005US6962864 Wire-bonding method for chips with copper interconnects by introducing a thin layer
11/08/2005US6962863 Semiconductor device having interconnection layer with multiply layered sidewall insulation film
11/08/2005US6962862 Manufacturing method of semiconductor device
11/08/2005US6962861 Method of forming a polysilicon layer comprising microcrystalline grains
11/08/2005US6962860 Method of manufacturing a semiconductor device
11/08/2005US6962859 Thin films and method of making them
11/08/2005US6962858 Method for reducing free surface roughness of a semiconductor wafer
11/08/2005US6962857 Shallow trench isolation process using oxide deposition and anneal
11/08/2005US6962856 Method for forming device isolation film of semiconductor device
11/08/2005US6962855 Method of forming a porous material layer in a semiconductor device
11/08/2005US6962853 Semiconductor device and method for fabricating the same
11/08/2005US6962852 Nonvolatile memories and methods of fabrication
11/08/2005US6962851 Nonvolatile memories and methods of fabrication
11/08/2005US6962850 Process to manufacture nonvolatile MOS memory device
11/08/2005US6962849 Hard mask spacer for sublithographic bitline
11/08/2005US6962848 Nonvolatile memory structures and fabrication methods
11/08/2005US6962847 Method for forming a self-aligned buried strap in a vertical memory cell
11/08/2005US6962846 Methods of forming a double-sided capacitor or a contact using a sacrificial structure
11/08/2005US6962845 Method for manufacturing semiconductor capacitor having double dielectric layer therein
11/08/2005US6962843 Method of fabricating a finfet
11/08/2005US6962842 Method of removing a sacrificial emitter feature in a BICMOS process with a super self-aligned BJT
11/08/2005US6962841 Suppression of cross diffusion and gate depletion
11/08/2005US6962840 Method of forming MOS transistor
11/08/2005US6962839 Apparatus and manufacturing process of carbon nanotube gate field effect transistor
11/08/2005US6962838 High mobility transistors in SOI and method for forming
11/08/2005US6962837 Method of manufacturing a semiconductor film and method of manufacturing a semiconductor device
11/08/2005US6962835 Method for room temperature metal direct bonding
11/08/2005US6962834 Wafer-level hermetic micro-device packages
11/08/2005US6962833 Magnetic shield for integrated circuit packaging
11/08/2005US6962832 Fabrication method for making a planar cantilever, low surface leakage, reproducible and reliable metal dimple contact micro-relay MEMS switch
11/08/2005US6962831 Method of making a thick microstructural oxide layer
11/08/2005US6962829 Method of making near chip size integrated circuit package
11/08/2005US6962828 Methods for manufacturing a light-emitting device
11/08/2005US6962827 Semiconductor device capable of shortening test time and suppressing increase in chip area, and method of manufacturing semiconductor integrated circuit device
11/08/2005US6962825 Exposure apparatus
11/08/2005US6962824 Method for controlling deposition of dielectric films
11/08/2005US6962771 formation of self-aligned dual damascene interconnects and vias, which incorporates two positive photoresist systems, which have different wavelength sensitivities, to form trench/via openings with only a two-step etching process
11/08/2005US6962769 For use during microlithography
11/08/2005US6962766 Positive photoresist composition
11/08/2005US6962732 Substrate temperature is controlled to establish a temperature profile particularly suited to the extreme temperature sensitivities of the deposition rates of organosilicate films
11/08/2005US6962728 Vapor depositing a silicon oxide/silicon nitride/silicon oxide on silicon wafer; high temperature low pressure deposition; forming a patterning gate layer; wet oxidation
11/08/2005US6962727 Organosiloxanes
11/08/2005US6962664 modifying plasma density profile in plasma reactor to achieve an improved etch, deposition or other plasma process uniformity without design complexities and shortcomings associated with present-day segmented electrodes
11/08/2005US6962649 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
11/08/2005US6962644 Tandem etch chamber plasma processing system
11/08/2005US6962630 Enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure
11/08/2005US6962613 Low-temperature fabrication of thin-film energy-storage devices
11/08/2005US6962524 Conductive polishing article for electrochemical mechanical polishing
11/08/2005US6962521 Edge polished wafer, polishing cloth for edge polishing, and apparatus and method for edge polishing
11/08/2005US6962511 Advanced microelectronic connector assembly and method of manufacturing
11/08/2005US6962477 Apparatus for and method of transferring substrates
11/08/2005US6962472 Vacuum processing apparatus and semiconductor manufacturing line using the same
11/08/2005US6962471 Substrate conveying module and system made up of substrate conveying module and workstation
11/08/2005US6962282 System for providing an open-cavity low profile encapsulated semiconductor package
11/08/2005US6962281 Bonding apparatus and bonding method having process for judging bonding state
11/08/2005US6962185 Device for sticking protective sheet on substrate surface
11/08/2005US6962161 Contacting workpiece with supercritical carbon dioxide and additives in a high-pressure chamber, removing the unnecessary substance on the workpiece, rinsing
11/08/2005US6962007 Method and device for drying substrate
11/08/2005US6962003 High-speed drying apparatus
11/08/2005US6961995 Absorbs the stresses that occur between a chip carrier and a printed wiring board during thermal cycling
11/08/2005US6961994 Method of high-speed and accurate alignment using a chip mounting device
11/08/2005US6961993 Method of transferring and mounting elements
11/07/2005WO2006051745A1 Temperature regulation method and system for low flow rate liquid
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