Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/16/2006DE102004060442A1 Passivation film forming method for semiconductor device e.g. flash memory, involves forming buffer oxide film on metal wires before forming high density plasma film
02/16/2006DE102004040047B3 Process to manufacture an electrolytic capacitor by heat and oxidation treatment of two layers and formation of a third layer between
02/16/2006DE102004037191A1 Halbleiterbautelement mit einer Passivierungsschicht und Verfahren zu seiner Herstellung Halbleiterbautelement with a passivation layer and process for its preparation
02/16/2006DE102004035368A1 Substrat mit Leiterbahnen und Herstellung der Leiterbahnen auf Substraten für Halbleiterbauteile Substrate with conductor tracks and manufacture of the conductor tracks on substrates for semiconductor devices
02/16/2006DE102004033603A1 Mikroskopisches Abbildungssystem und Verfahren zur Emulation eines hochaperturigen Abbildungssystems, insbesondere zur Maskeninspektion Microscopic imaging system and method for emulating a high-aperture imaging system, in particular for mask inspection
02/16/2006DE102004033602A1 Abbildungssystem zur Emulation hochaperturiger Scannersysteme Imaging system for emulation of high-aperture scanning systems
02/16/2006DE102004026159B3 Production of an electronic component used in the production of integrated circuits comprises forming an insulating layer as a metal oxide layer by plasma-electrolytic oxidation of the metal
02/16/2006DE102004018468A1 Verfahren zum strukturierten Aufbringen einer laminierbaren Folie auf ein Substrat für ein Halbleitermodul Method for structured application of a laminatable film on a substrate for a semiconductor module
02/16/2006DE102004011702B4 Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte A process for producing a card body for a contactless chip card
02/16/2006DE102004005022B4 Verfahren zur Herstellung von metallischen Leitbahnen auf elektronischen Bauelementen A process for the production of metallic interconnects to electronic components
02/16/2006DE10060927B4 Heckstruktur eines Kraftfahrzeuges Rear structure of a motor vehicle
02/16/2006CA2576868A1 Solar cell (sliver) sub-module formation
02/16/2006CA2574591A1 Method for fabricating lateral semiconductor device
02/15/2006EP1626588A2 Miniaturized imaging device
02/15/2006EP1626441A2 Cascode device and corresponding circuit and manufacturing method
02/15/2006EP1626440A1 SOI wafer
02/15/2006EP1626439A1 Method of forming fluorinated carbon film
02/15/2006EP1626438A2 Anisotropic etching agent composition used for manufacturing of micro-structures of silicon and etching method
02/15/2006EP1626437A1 Method of fabricating a stack of islands made of a semiconductor material in another semiconductor material
02/15/2006EP1626436A2 Method of making a solid state imaging device
02/15/2006EP1626270A1 External view inspection method, master pattern used for the same, and external view inspection device having the master pattern
02/15/2006EP1626011A2 Overhead travelling carriage system
02/15/2006EP1625915A1 Double-sided polishing apparatus for thin workpieces, e.g. wafers
02/15/2006EP1625911A1 Wire bonder with a camera, a device for image treatment, memoires et comparing means and process using this wire bonder
02/15/2006EP1625627A2 Production of an optoelectronic component that is encapsulated in plastic, and corresponding methods
02/15/2006EP1625626A1 Photodiode passivation technique
02/15/2006EP1625625A1 Field effect transistor using insulator-semiconductor transition material layer as channel material and method of manufacturing the same
02/15/2006EP1625624A1 Power device with high switching speed and manufacturing method thereof
02/15/2006EP1625619A1 Interconnection pattern design
02/15/2006EP1625617A1 Method for manufacturing a multi-level interconnect structure
02/15/2006EP1625616A2 Use of voids between elements in semiconductor structures for isolation
02/15/2006EP1625615A2 Cmos-compatible integration of silicon-based optical devices with electronic devices
02/15/2006EP1625614A1 Method for the production of a bipolar transistor
02/15/2006EP1625613A1 Substrate holding apparatus and polishing apparatus
02/15/2006EP1625612A2 Manufacturing gallium nitride substrates by lateral overgrowth through masks and devices fabricated thereof
02/15/2006EP1625610A2 Plasma ashing apparatus and endpoint detection process
02/15/2006EP1625609A2 Wafer treatment system having load lock and buffer
02/15/2006EP1625589A2 Magnetoelectronics information device having a compound magnetic free layer
02/15/2006EP1625452A1 Scheduling multi-robot processing systems
02/15/2006EP1625409A2 Planarizing and testing of bga packages
02/15/2006EP1625372A1 Integrated resistor network for multi-functional use in constant current or constant voltage operation of a pressure sensor
02/15/2006EP1625336A2 Methods of controlling uniformity of substrate temperature and self-contained heating unit and drug-supply unit employing same
02/15/2006EP1625335A2 Optically ignited or electrically ignited self-contained heating unit and drug-supply unit employing same
02/15/2006EP1625334A2 Percussively ignited or electrically ignited self-contained heating unit and drug-supply unit employing same
02/15/2006EP1625247A2 Method to passivate conductive surfaces during semiconductor processing
02/15/2006EP1440608B1 Method for opening the plastic housing of an electronic module
02/15/2006EP1425791A4 Trench dmos transistor with embedded trench schottky rectifier
02/15/2006EP1360554B1 Process control
02/15/2006EP1313896A4 Apparatus and method for flow of process gas in an ultra-clean environment
02/15/2006EP1247293A4 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
02/15/2006EP1186212B1 Integrated circuit package having a substrate vent hole
02/15/2006EP0870322B1 Trenched dmos transistor with buried layer for reduced on-resistance and ruggedness
02/15/2006EP0856070B1 Process for cleaning a vacuum processing chamber including the gas injection port
02/15/2006CN2758972Y Chip package for IC
02/15/2006CN2758971Y Wafer bearing device for wafer etching equipment
02/15/2006CN2758970Y Grinding cylinder for high-speed crystal edge grinding device
02/15/2006CN2758969Y Flat electrode structure
02/15/2006CN2758967Y Ion source suspension reflecting electrode
02/15/2006CN1735975A Boron phosphide-based semiconductor light-emitting device and production method thereof
02/15/2006CN1735972A Scalable nano-transistor and memory using back-side trapping
02/15/2006CN1735969A Grounded gate and isolation techniques for reducing dark current in CMOS image sensors
02/15/2006CN1735968A Semiconductor device and method of manufacturing thereof
02/15/2006CN1735967A Post CMP porogen burn out process
02/15/2006CN1735965A Method for producing microsystems
02/15/2006CN1735964A Semiconductor device
02/15/2006CN1735963A Semiconductor packaging with partially patterned lead frames and its making methods
02/15/2006CN1735962A Light irradiator
02/15/2006CN1735961A Light irradiator and light irradiating method
02/15/2006CN1735960A Plasma film forming system
02/15/2006CN1735959A Exposure device, exposure method, and semiconductor device manufacturing method
02/15/2006CN1735958A Space-efficient package for laterally conducting device
02/15/2006CN1735956A Tunable gas distribution plate assembly
02/15/2006CN1735945A Gas layer formation materials
02/15/2006CN1735943A Magnetic storage device using ferromagnetic tunnel junction element
02/15/2006CN1735866A Defect analyzer
02/15/2006CN1735843A Holographic or optically variable printing material and method for customized printing
02/15/2006CN1735794A Apparatus and process for measuring ultraviolet (UV) light intensities
02/15/2006CN1735710A A method and apparatus for forming a high quality low temperature silicon nitride layer
02/15/2006CN1735709A Method and apparatus for layer by layer deposition of thin films
02/15/2006CN1735671A Passivative chemical mechanical polishing composition for copper film planarization
02/15/2006CN1735670A Composition and method used for chemical mechanical planarization of metals
02/15/2006CN1735480A Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
02/15/2006CN1735467A Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
02/15/2006CN1735319A Photomask apparatus, photomask manufacturing method, and mask pattern forming method
02/15/2006CN1735313A Dry etching device and air pore device fixing on the same
02/15/2006CN1735290A Electroluminescence display device and method of manufacturing the same
02/15/2006CN1734803A Semiconductor light-emitting device and method of manufacturing the same
02/15/2006CN1734799A Method for preparing high quality GaInAlN material on silicon substrate
02/15/2006CN1734791A Channel-etch thin film transistor
02/15/2006CN1734789A Organic thin film transistor and flat panel display comprising the same
02/15/2006CN1734788A Thin film transistor and method of fabricating the same
02/15/2006CN1734787A Thin film transistor and method of fabricating the same
02/15/2006CN1734786A Transistor and method of making same
02/15/2006CN1734785A Semiconductor device and method for manufacturing the same
02/15/2006CN1734784A Isolated LDMOS IC technology
02/15/2006CN1734776A Display device, manufacturing method thereof, and television set
02/15/2006CN1734775A Semiconductor storage device and method of manufacturing same
02/15/2006CN1734774A Nonvolatile memory device and method for fabricating the same
02/15/2006CN1734773A Complementary nonvolatile memory device, methods of operating and manufacturing the same
02/15/2006CN1734772A Semiconductor device and method for manufacturing the same