Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/28/2006US7005241 Process for making circuit board or lead frame
02/28/2006US7005240 Depositing a second layer on first layer; using a lithographic projection for forming elevated structure; conformally depositing a third layer on elevated first structure and on first layer; etching back third layer for forming spacer
02/28/2006US7005239 Method of forming metal line
02/28/2006US7005238 Exposing a chemically amplified photoresist on a substrate supported by a heating plate having a porous partition facing the surface where in the space over the partion an air stream formation mechanism discharges the acid evaporated formed
02/28/2006US7005236 Laying down two separate photoresist layers to eliminate distortion of features in the resist image close to cavity edge; the first reduces problems, e.g., air bubbles; the second's processed normally; thickness; uniformity; integrated circuits
02/28/2006US7005219 Defect repair method employing non-defective pattern overlay and photoexposure
02/28/2006US7005194 Aluminum alloy member superior in corrosion resistance and plasma resistance
02/28/2006US7005101 Virtual gate design for thin packages
02/28/2006US7005085 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces
02/28/2006US7005081 Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method
02/28/2006US7005046 Apparatus for electro chemical deposition
02/28/2006US7005032 Wafer table for local dry etching apparatus
02/28/2006US7005009 Film forming apparatus, film forming method and tray for substrate
02/28/2006US7004994 Method for making a film from silver-containing particles
02/28/2006US7004984 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature
02/28/2006US7004822 Chemical mechanical polishing and pad dressing method
02/28/2006US7004819 CMP systems and methods utilizing amine-containing polymers
02/28/2006US7004814 CMP process control method
02/28/2006US7004716 Device and method for aligning disk-shaped substrates
02/28/2006US7004715 Apparatus for transferring and loading a reticle with a robotic reticle end-effector
02/28/2006US7004711 Transporting apparatus
02/28/2006US7004708 Apparatus for processing wafers
02/28/2006US7004558 Fluid ejection device including integrated circuit with shielding element
02/28/2006US7004522 Suction unit
02/28/2006US7004376 Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof
02/28/2006US7004375 is slightly tacky at room temperature and useful for electronic component assembly; used in chip scale packages (CSP)
02/28/2006US7004372 Method for determining optimum bond parameters when bonding with a wire bonder
02/28/2006US7004369 Capillary with contained inner chamfer
02/28/2006US7004358 Dispenser
02/28/2006US7004244 Thermal interface wafer and method of making and using the same
02/28/2006US7004234 Vaporizer for generating feed gas for an arc chamber
02/28/2006US7004181 Apparatus for cleaning a substrate
02/28/2006US7004180 Electrostatic chuck cleaning method
02/28/2006US7004107 Method and apparatus for monitoring and adjusting chamber impedance
02/28/2006US7004054 In-process tape bur monitoring
02/28/2006US7004015 Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein
02/28/2006US7004012 Method of estimating thickness of oxide layer
02/28/2006US7003875 Method for manufacturing piezo-resonator
02/28/2006US7003874 Methods of bonding solder balls to bond pads on a substrate
02/23/2006WO2006020828A2 Top electrode for a dram capacitor
02/23/2006WO2006020645A1 Magnetic support structure for an elevator tube of a verticle rapid thermal processing unit
02/23/2006WO2006020565A2 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
02/23/2006WO2006020518A1 Method of planarizing a semiconductor substrate
02/23/2006WO2006020409A2 Apparatus and method for depositing a material on a substrate
02/23/2006WO2006020333A1 A semiconductor substrate processing apparatus and method thereof
02/23/2006WO2006020265A2 Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata
02/23/2006WO2006020158A2 Planarizing a semiconductor structure to form replacement metal gates
02/23/2006WO2006020134A2 Method and system for characterizing porous materials
02/23/2006WO2006020064A2 Asymmetric hetero-doped high-voltage mosfet (ah2mos)
02/23/2006WO2006019898A2 Schottky diode structure to reduce capacitance and switching losses and method of making same
02/23/2006WO2006019890A2 Systems and methods for forming integrated circuit components having matching geometries
02/23/2006WO2006019871A2 Method of discharging a semiconductor device
02/23/2006WO2006019761A2 Mems device and interposer and method for integrating mems device and interposer
02/23/2006WO2006019670A2 Vibratable die attachment tool
02/23/2006WO2006019603A2 Thin tungsten silicide layer deposition and gate metal integration
02/23/2006WO2006019460A2 Method of assembling a semiconductor component and apparatus therefor
02/23/2006WO2006019449A1 Formula-based run-to-run control
02/23/2006WO2006019402A1 Non-aqueous microelectronic cleaning compositions containing fructose
02/23/2006WO2006019178A1 Exposure method and device
02/23/2006WO2006019166A1 Alignment information display method, program thereof, alignment method, exposure method, device manufacturing method, display system, display device, program, and measurement/inspection device
02/23/2006WO2006019156A1 Method for manufacturing semiconductor device having three-dimensional multilayer structure
02/23/2006WO2006019133A1 Coating liquid for forming organic multilayer film, method for manufacturing field effect transistor, and field effect transistor
02/23/2006WO2006019124A1 Exposure apparatus and device manufacturing method
02/23/2006WO2006019089A1 Photosensitive transfer material and pattern forming method and pattern
02/23/2006WO2006018985A1 Method for purifying aqueous alkaline solution
02/23/2006WO2006018974A1 Semiconductor device and its manufacturing method
02/23/2006WO2006018972A1 Lighting optical device, regulation method for lighting optical device, exposure system, and exposure method
02/23/2006WO2006018960A1 Developing method
02/23/2006WO2006018948A1 Object processing device and its method
02/23/2006WO2006018821A1 Self-aligned epitaxially grown bipolar transistor
02/23/2006WO2006018820A2 Semiconductor devices and the manufacture thereof
02/23/2006WO2006018787A2 Method of detaching a thin semiconductor circuit from its base
02/23/2006WO2006018672A1 Packing tray
02/23/2006WO2006018387A2 Gripper unit, mounting head, and method for fitting substrates with electrical components
02/23/2006WO2006018267A2 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit
02/23/2006WO2006018013A1 Method for application of a zinc sulphide buffer layer to a semiconductor substrate by means of chemical bath deposition in particular on the absorber layer of a chalcopyrite thin-film solar cell
02/23/2006WO2006005321A3 Method for producing an integrated circuit and substrate comprising a buried layer
02/23/2006WO2005117111A3 Adhesive/spacer island structure for multiple die package
02/23/2006WO2005104190A3 Semiconductor processing methods for forming electrical contacts, and semiconductor structures
02/23/2006WO2005103818A3 Method for structuring at least one layer and electric component with structures from said layer
02/23/2006WO2005098949A3 Spacer die structure and method for attaching
02/23/2006WO2005081323A3 Trench-gate semiconductor devices and the manufacture thereof
02/23/2006WO2005070178A3 Test result marking of electronic packages
02/23/2006WO2005060548A3 Method of preventing damage to porous low-k materials during resist stripping
02/23/2006WO2005059962A3 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
02/23/2006WO2005055279A3 Wafer container with door actuated wafer restraint
02/23/2006WO2005042804A3 Method and apparatus for fluid processing a workpiece
02/23/2006WO2005038868A3 High-pressure processing chamber for a semiconductor wafer
02/23/2006WO2005029544A3 Systems and methods for processing thin films
02/23/2006WO2005001905A3 High-density finfet integration scheme
02/23/2006WO2004100258A3 Ribbon bonding
02/23/2006WO2004084267A3 System, method and apparatus for improved local dual-damascene planarization
02/23/2006WO2003017745A3 Architecture tool and methods of use
02/23/2006US20060041851 Renesting interaction map into design for efficient long range calculations
02/23/2006US20060041397 Method for checking a integrated circuit for electrostatic discharge bobustness
02/23/2006US20060041078 Polymer having a hydroxy group or a carboxy group; crosslinking agent; and an alkali-dissolution rate regulator that is a naphthoquinone compound or a compound having a t-butoxycarbonyl group, a hydroxy group, a carboxy group, or a phenyl group; for use in dual damascene processes
02/23/2006US20060041043 Composite media for ion processing
02/23/2006US20060040595 Method and system for chemical mechanical polishing pad cleaning
02/23/2006US20060040586 Method and apparatus for polishing a semiconductor device
02/23/2006US20060040514 Magnetic processing of electronic materials