Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/14/2006US6998302 Method of manufacturing mosfet having a fine gate width with improvement of short channel effect
02/14/2006US6998301 Method for forming a tri-gate MOSFET
02/14/2006US6998300 Methods for manufacturing semiconductor devices
02/14/2006US6998299 Semiconductor device and method of manufacturing thereof
02/14/2006US6998298 Thyristor semiconductor memory device and method of manufacture
02/14/2006US6998297 Wafer level packaging
02/14/2006US6998296 Electronic component and method for its production
02/14/2006US6998295 Method of manufacturing a device package
02/14/2006US6998293 Flip-chip bonding method
02/14/2006US6998292 Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier
02/14/2006US6998291 Cost-reducing and process-simplifying wiring board and manufacturing method thereof
02/14/2006US6998290 Economical high density chip carrier
02/14/2006US6998289 Multiple layer phase-change memory
02/14/2006US6998288 Use of doped silicon dioxide in the fabrication of solar cells
02/14/2006US6998287 Polycrystalline liquid crystal display device having large width channel and method of fabricating the same
02/14/2006US6998286 Thin film-structure and a method for producing the same
02/14/2006US6998285 Charge separation type heterojunction structure and manufacturing method therefor
02/14/2006US6998284 Semiconductor device having quantum well structure, and method of forming the same
02/14/2006US6998283 In-plane switching mode liquid crystal display device and method for fabricating the same
02/14/2006US6998282 Method of manufacturing a semiconductor device
02/14/2006US6998281 Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics
02/14/2006US6998280 Wafer packaging process of packaging light emitting diode
02/14/2006US6998279 Method of mounting light emitting element
02/14/2006US6998278 Method of fabricating a micro-electromechanical actuator that includes drive circuitry
02/14/2006US6998277 Method of planarizing spin-on material layer and manufacturing photoresist layer
02/14/2006US6998276 Magnetoresistive memory device and method for fabricating the same
02/14/2006US6998275 Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
02/14/2006US6998225 Lift-off process; resist remover consists of an amine or a cyclic nitrogen compound so that the residual resist mask need not be removed by ashing.
02/14/2006US6998224 Plasma deposited optical waveguide
02/14/2006US6998221 patterning an opening of predetermined width in a photoresist layer located over an intermediate layer covering a substrate, etching into the intermediate layer such that an intermediate opening is formed with decreased width, forming a via opening
02/14/2006US6998220 Resistor and contact layers are structured by laser light; one step; lithography
02/14/2006US6998216 Mechanically robust interconnect for low-k dielectric material using post treatment
02/14/2006US6998206 coating a photomask substrate with a chemically amplified photoresist containing a modified phenolic polymer, and an onium salt-containing chemical amplifier; coating ; baking such chemically amplified photoresist on said photomask substrate
02/14/2006US6998200 Reflection layer on a substrate, an absorber pattern on the reflection layer, and a capping layer on the reflection layer. The capping layer may be selected to decrease a reflectivity of the reflection photomask by less than about
02/14/2006US6998199 Alternating phase shifting masking; generating destructive interference
02/14/2006US6998198 Contact hole printing by packing and unpacking
02/14/2006US6998178 Organic compositions
02/14/2006US6998175 Heat-peelable pressure-sensitive adhesive sheet
02/14/2006US6998153 Nitriding silicon surface of wafer with nitrogen plasma; overcoating with nickel; annealing
02/14/2006US6998148 Porous materials
02/14/2006US6998066 and a chelating agent forming a chemical mechanical polishing emulsion; chemical stability, improved selectivity, corrosion inhibition, broad pH operating range
02/14/2006US6998059 Method for manufacturing a silicon sensor and a silicon sensor
02/14/2006US6998033 Providing an annular adapter body; providing an annular electrical-insulator ring; providing a replaceable annular adapter shield attachable to the outside surface of the body; providing a replaceable annular dark-space shield attachable
02/14/2006US6998027 Highly efficient compact capacitance coupled plasma reactor/generator and method
02/14/2006US6998014 Apparatus and method for plasma assisted deposition
02/14/2006US6998002 Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure
02/14/2006US6998000 degassing and semi-hardening adhesive capable of hardening by heating, discharging desired amount of semi-hardened adhesive on substrate, mounting semiconductor chip to be affixed to substrate; bubble-free
02/14/2006US6997993 Susceptor supporting construction
02/14/2006US6997988 System for processing a workpiece
02/14/2006US6997985 Semiconductor, semiconductor device, and method for fabricating the same
02/14/2006US6997793 Polishing pad, polishing apparatus having the same, and bonding apparatus
02/14/2006US6997791 CMP polishing heads and methods of using the same
02/14/2006US6997782 Polishing apparatus and a method of polishing and cleaning and drying a wafer
02/14/2006US6997781 Fixed-abrasive chemical-mechanical planarization of titanium nitride
02/14/2006US6997779 Device for the simultaneous double-side grinding of a workpiece in wafer form
02/14/2006US6997778 Polishing apparatus
02/14/2006US6997776 Process for producing a semiconductor wafer
02/14/2006US6997670 Semiconductor wafer transfer apparatus
02/14/2006US6997403 Liquid vaporizer with positive liquid shut-off
02/14/2006US6997226 Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method
02/14/2006US6997217 Gas conduit for a load lock chamber
02/14/2006US6997197 Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid
02/14/2006US6997192 Control of dissolved gas levels in deionized water
02/14/2006US6997049 Wind tunnel and collector configuration therefor
02/14/2006US6996889 Electronic part mounting apparatus and method
02/14/2006CA2386577C System and method for making wallboard or backerboard sheets including aerated concrete
02/14/2006CA2278751C Atmospheric-pressure plasma jet
02/14/2006CA2251737C Silicon carbide cmos and method of fabrication
02/09/2006WO2006073622A2 Low-pressure removal of photoresist and etch residue
02/09/2006WO2006015254A2 Quick swap load port
02/09/2006WO2006015246A2 Method and system for fabricating a strained semiconductor layer
02/09/2006WO2006014783A2 Method for manufacturing a semiconductor device having silicided regions
02/09/2006WO2006014612A2 Method of controlling the film properties of a cvd-deposited silicon nitride film
02/09/2006WO2006014600A1 A method to form an interconnect
02/09/2006WO2006014472A1 Iii-nitride materials including low dislocation densities and methods associated with the same
02/09/2006WO2006014421A2 METHOD FOR WAFER BONDING (Al, In, Ga)N AND Zn(S, Se) FOR OPTOELECTRONIC APPLICATIONS
02/09/2006WO2006014401A1 A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
02/09/2006WO2006014346A2 Silicon-rich nickel-silicide ohmic contacts for sic semiconductor devices
02/09/2006WO2006014249A2 Use of a chalcogen plasma to form chalcogenide switching materials for nanoscale electronic devices
02/09/2006WO2006014241A2 Activation of carbon nanotubes for field emission applications
02/09/2006WO2006014231A2 High density bonding of electrical devices
02/09/2006WO2006014193A1 Processing system and method for chemically treating a tera layer
02/09/2006WO2006014188A2 Fully silicided metal gates
02/09/2006WO2006014003A1 Semiconductor device manufacturing method and tape for processing wafer
02/09/2006WO2006014000A1 Wafer processing tape
02/09/2006WO2006013974A1 Plasma ion source for metal-carbon binary cluster production apparatus
02/09/2006WO2006013968A1 Thin-film forming apparatus
02/09/2006WO2006013898A1 Semiconductor device manufacturing method
02/09/2006WO2006013867A1 Transparent electrode for semiconductor light-emitting device
02/09/2006WO2006013856A1 Stage device and exposure system
02/09/2006WO2006013850A1 Coating film forming apparatus and coating film forming method
02/09/2006WO2006013846A1 Method for forming p-type semiconductor region, and semiconductor element
02/09/2006WO2006013814A1 Method for forming crystallization film and its equipment
02/09/2006WO2006013808A1 Heat treatment apparatus and method of producing substrate
02/09/2006WO2006013806A1 Exposure equipment, exposure method and device manufacturing method
02/09/2006WO2006013773A1 Contact load measuring apparatus and inspecting apparatus
02/09/2006WO2006013763A1 Laser processing method and semiconductor device
02/09/2006WO2006013751A1 Bonding structure, wire bonding method, actuator device and liquid injecting head
02/09/2006WO2006013720A1 Thin film forming method and thin film forming apparatus
02/09/2006WO2006013644A1 Production system