Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/09/2006US20060027858 Semiconductor device with split gate electrode structure and method for manufacturing the semiconductor device
02/09/2006US20060027857 Semiconductor device and semiconductor memory using the same
02/09/2006US20060027856 Nonvolatile memory devices and methods of fabricating the same
02/09/2006US20060027852 Bitline of semiconductor device having stud type capping layer and method for fabricating the same
02/09/2006US20060027851 Capacitive electrode having semiconductor layers with an interface of separated grain boundaries
02/09/2006US20060027849 Ferroelectric thin film, method of manufacturing the same, ferroelectric memory device and ferroelectric piezoelectric device
02/09/2006US20060027848 Ferroelectric memory device and method of forming the same
02/09/2006US20060027847 Ferroelectric memory and ferroelectric capacitor with Ir-alloy electrode or Ru-alloy electrode and method of manufacturing same
02/09/2006US20060027845 Imaging cell that has a long integration period and method of operating the imaging cell
02/09/2006US20060027844 Image sensor and method of manufacturing the same
02/09/2006US20060027840 Monolithic integrated enhancement mode and depletion mode field effect transistors and method of making the same
02/09/2006US20060027837 Solid-state imaging device, method for driving the same, method for manufacturing the same, camera, and method for driving the same
02/09/2006US20060027836 Semiconductor substrate
02/09/2006US20060027835 Semiconductor integrated circuit device
02/09/2006US20060027831 Method for fabricating Group III nitride compound semiconductors and Group III nitride compound semiconductor devices
02/09/2006US20060027819 Dual emitting method and device for active matrix organic electroluminescence
02/09/2006US20060027818 Diode having high brightness and method thereof
02/09/2006US20060027817 Light emitting device, semiconductor device, and method of fabricating the devices
02/09/2006US20060027811 Active matrix substrate, electro-optical device, electronic device, and method for manufacturing an active matrix substrate
02/09/2006US20060027810 Method for doping semiconductor layer, method for manufacturing thin film semiconductor device, and thin film semiconductor device
02/09/2006US20060027808 Method of forming strained silicon materials with improved thermal conductivity
02/09/2006US20060027807 Pixel current driver for organic light emitting diode displays
02/09/2006US20060027805 Thin film transistor and method of fabricating the same
02/09/2006US20060027803 Low temperature curable materials for optical applications
02/09/2006US20060027758 Photoelectric converter, its driving method, and system including the photoelectric converter
02/09/2006US20060027740 Snap lid camera module
02/09/2006US20060027728 Method and apparatus for forming metal contacts on a substrate
02/09/2006US20060027668 Method for making contactless cards
02/09/2006US20060027632 Method for forming metal contacts on a substrate
02/09/2006US20060027566 Multi-parameter process and control method
02/09/2006US20060027535 Method and equipment for manufacturing liquid crystal display device
02/09/2006US20060027534 Chemical mechanical machining for polishing surfaces such as semiconductors and oxidizers and/or abrasives
02/09/2006US20060027532 Method for selectively removing material from the surface of a substrate, masking material for a wafer, and wafer with masking material
02/09/2006US20060027526 Thin film resistor structure and method of fabricating a thin film resistor structure
02/09/2006US20060027525 Cantilever-type near-field probe for optical data storage and method of manufacturing the same
02/09/2006US20060027522 Method of producing a MEMS device
02/09/2006US20060027521 Substrate etching method for forming connected features
02/09/2006US20060027513 Wafer guides for processing semiconductor substrates
02/09/2006US20060027477 Thin plate storage container
02/09/2006US20060027452 Substrate processing apparatus and substrate plating apparatus
02/09/2006US20060027327 Apparatus and methods for a low inductance plasma chamber
02/09/2006US20060027326 Semiconductor substrate processing chamber and substrate transfer chamber interfacial structure
02/09/2006US20060027325 Method and apparatus for photomask fabrication
02/09/2006US20060027324 Plasma processing apparatus and plasma processing method
02/09/2006US20060027323 Substrate processing apparatus which performs predetermined processing by supplying a processing liquid to a substrate which is held at a substrate processing position
02/09/2006US20060027168 Power supply antenna and power supply method
02/09/2006US20060027164 Method and apparatus for coating a photosensitive material
02/09/2006US20060027161 Method for heat-treating silicon wafer and silicon wafer
02/09/2006US20060026857 Multi-chambers system having compact installation set-up for an etching facility for semiconductor device manufacturing
02/09/2006DE19882415B4 Wascheinheit für eine Verbindungsabdichtung in einem Halbleiter-Badsystem Washing unit for a sealing compound in a semiconductor bath system
02/09/2006DE19736685B4 Bondgerät Bonder
02/09/2006DE19719156B4 Transistorstruktur und Verfahren zu ihrer Herstellung Transistor structure and process for their preparation
02/09/2006DE112004000591T5 Herstellungsverfahren für Photomaske und Photomaskenrohling Manufacturing process for photomask and photomask blank
02/09/2006DE10394148T5 Verbessertes Verfahren und verbesserte Vorrichtung zum Positionieren von integrierten Schaltungen auf Plättchenkontaktflächen Improved method and improved apparatus for positioning integrated circuits on die pads
02/09/2006DE10393769T5 Halbleitervorrichtung mit Klemmen zum Verbinden mit externen Elementen A semiconductor device having terminals for connection with external elements
02/09/2006DE10341467A1 Kristallisationsapparat, Kristallisationsverfahren und Phasenschieber Crystallization apparatus, crystallization method and phase shifter
02/09/2006DE10309997B4 Halbleiterbauelement mit Isolationsschichtstruktur und Herstellungsverfahren hierfür A semiconductor device comprising insulating layer structure and manufacturing method thereof
02/09/2006DE10232206B4 Sprühvorrichtung für eine Wafer-Behandlungsvorrichtung mit einer Zwischenraum-Steuervorrichtung Spray device for a wafer processing apparatus having a gap-control device
02/09/2006DE10213609B4 Elektrisches Bauelement mit einer Kontaktierungsfläche und Verfahren zum Ausbilden einer Kontaktierungsfläche auf einem Halbleitermaterial Electrical component with a contacting surface and method of forming a bonding pad on a semiconductor material
02/09/2006DE10212932B4 Trenchzelle für ein DRAM-Zellenfeld Trench Cell for a DRAM cell array
02/09/2006DE102005032520A1 Prober for electronic devices test system, has prober bar including two ends, and frame connection mechanism that allows for ready relocation of prober bar to frame at selected points
02/09/2006DE102005031389A1 Resistor component for semiconductor integrated circuit device, has complementary resistors electrically connected in parallel to resistors, where resistance of complementary resistors is complementary to resistance of resistors
02/09/2006DE102005026229A1 Semiconductor device package comprises substrate, first and second chip pads, insulating layer over substrate surface, conductive reference potential line, conductive signal line, and first and second external terminals
02/09/2006DE102005024417A1 CMOS-Transistor mit doppeltem High-k-Gatedielektrikum sowie zugehöriges Herstellungsverfahren CMOS-transistor dual high-k gate dielectric and associated production method
02/09/2006DE102005014619A1 Integriertes Schaltkreisbauelement mit Gatestruktur und zugehöriges Herstellungsverfahren Integrated circuit device having gate structure and manufacturing method thereof
02/09/2006DE102005001104B3 Electrical method for non destructive testing of the bonding rigidity in semiconductor and other wafers measures expansion of unbonded region
02/09/2006DE102004055511B3 Production process for a power semiconductor module forms solder layer between two partner layers then three hard fixing bridges and melts solder to give exact thickness
02/09/2006DE102004042459B3 Verfahren zur Herstellung einer Grabenisolationsstruktur mit hohem Aspektverhältnis A process for the preparation of a grave isolation structure with a high aspect ratio
02/09/2006DE102004035108A1 Verfahren zum selbstjustierenden Herstellen eines Transistors mit U-förmigem Gate A method for producing a self-aligned transistor with a U-shaped gate
02/09/2006DE102004034572A1 Verfahren zum Herstellen einer Struktur auf der Oberfläche eines Substrats A method of producing a structure on the surface of a substrate
02/09/2006DE102004034544A1 Method of analyzing a buried layer in a wafer with a semiconductor component such as a DRAM chip uses electromagnetic radiation to penetrate the wafer
02/09/2006DE102004034448A1 Measurement of layer thickness of a coating on a substrate useful in semiconductor production involves preparing composition of first material containing two substrates and depositing layers of second and third materials on first substrate
02/09/2006DE102004034421A1 Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern Method and device for the mutual contacting of two wafer
02/09/2006DE102004033825A1 Verfahren zur Herstellung einer Kondensatoranordnung sowie zugehörige Kondensatoranordnung A method of manufacturing a capacitor arrangement and associated capacitor assembly
02/09/2006DE102004033350A1 Method for correction of systematic line width fluctuations during transmission of pattern onto substrate is by exposure apparatus with aperture through local variation of width and/or transparency of aperture along one direction
02/09/2006DE102004033149A1 Verfahren zum Herstellen eines integrierten Schaltkreises und Substrat mit vergrabener Schicht A method of manufacturing an integrated circuit substrate and buried layer
02/09/2006DE102004033148A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement
02/09/2006DE102004033147A1 Planarer Doppel-Gate-Transistor und Verfahren zum Herstellen eines planaren Doppel-Gate-Transistors A planar double-gate transistor and method of manufacturing a planar double-gate transistor
02/09/2006DE102004031453A1 Verfahren zur Erzeugung eines Dielektrikums und Halbleiterstruktur A method for producing a dielectric and semiconductor structure
02/09/2006DE102004026142B3 Verfahren zum Steuern der mechanischen Spannung in einem Kanalgebiet durch das Entfernen von Abstandselementen und ein gemäß dem Verfahren gefertigtes Halbleiterbauelement A method for controlling the mechanical stress in a channel region by the removal of spacers and a product manufactured according to the method Semiconductor component
02/09/2006DE10151320B4 Scheibenträger Disk support
02/09/2006DE10013013B4 Chemisch synthetisierte und aufgebaute elektronische Bauelemente Chemically synthesized and structured electronic components
02/09/2006CA2572959A1 Silicon-rich nickel-silicide ohmic contacts for sic semiconductor devices
02/09/2006CA2572725A1 Surface microstructuring device
02/09/2006CA2570640A1 High density bonding of electrical devices
02/08/2006EP1624488A1 Soi wafer and process for producing the same
02/08/2006EP1624487A2 Semiconductor device having vertically stacked field effect transistors and methods of manufacturing the same
02/08/2006EP1624484A1 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
02/08/2006EP1624483A1 Semiconductor manufacturing system
02/08/2006EP1624482A2 Thermally annealed silicon wafers having improved intrinsic gettering
02/08/2006EP1624480A1 Exposure method, mask, semiconductor device manufacturing method, and semiconductor device
02/08/2006EP1624479A2 Ferroelectric memory and ferroelectric capacitor with Ir-alloy electrode or Ru-alloy electrode and method of manufacturing same
02/08/2006EP1624478A2 Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device
02/08/2006EP1624477A2 Adhesive injection apparatus and method
02/08/2006EP1624471A1 Method for improving electrical conductivity of metals, metal alloys and metal oxides by ion beam implantation
02/08/2006EP1624468A1 Liquid composition for forming ferroelectric thin film and method for forming ferroelectric thin film
02/08/2006EP1624467A2 Lithographic apparatus and device manufacturing method
02/08/2006EP1624338A2 Photomask, pattern formation method using photomask and mask data creation method for photomask
02/08/2006EP1624333A1 Display device, manufacturing method thereof, and television set
02/08/2006EP1624308A1 Probe for testing electric conduction