| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 02/16/2006 | US20060033415 Electronic device containing a carbon nanotube |
| 02/16/2006 | US20060033391 Bearing assembly, stage device using same, and exposure apparatus using same |
| 02/16/2006 | US20060033218 Plug-in Connector |
| 02/16/2006 | US20060033217 Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same |
| 02/16/2006 | US20060033216 Stacked packages |
| 02/16/2006 | US20060033215 Diffusion barrier process for routing polysilicon contacts to a metallization layer |
| 02/16/2006 | US20060033210 Fine pitch low-cost flip chip substrate |
| 02/16/2006 | US20060033209 Hybrid integrated circuit device |
| 02/16/2006 | US20060033207 Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication |
| 02/16/2006 | US20060033206 Semiconductor cooling system and process for manufacturing the same |
| 02/16/2006 | US20060033204 Method of creating shielded structures to protect semiconductor devices |
| 02/16/2006 | US20060033203 Integrated circuit package and method for manufacturing same |
| 02/16/2006 | US20060033201 Systems and methods for wafer bonding by localized induction heating |
| 02/16/2006 | US20060033197 Power gridding scheme |
| 02/16/2006 | US20060033194 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 02/16/2006 | US20060033188 Electronic component packaging |
| 02/16/2006 | US20060033186 Broken die detect sensor |
| 02/16/2006 | US20060033182 Method of fabricating a 3D RRAM |
| 02/16/2006 | US20060033181 Buried conductors |
| 02/16/2006 | US20060033180 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers and method of making |
| 02/16/2006 | US20060033178 Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus |
| 02/16/2006 | US20060033171 Efficient transistor structure |
| 02/16/2006 | US20060033167 Reduced-step CMOS processes for low-cost radio frequency identification devices |
| 02/16/2006 | US20060033158 Method for fabricating a recessed channel field effect transistor (FET) device |
| 02/16/2006 | US20060033157 Field effect transistor and application device thereof |
| 02/16/2006 | US20060033155 Method of making and structure for LDMOS transistor |
| 02/16/2006 | US20060033151 Flash memory having memory section and peripheral circuit section and manufacturing the same |
| 02/16/2006 | US20060033148 Semiconductor device and method of fabricating the same |
| 02/16/2006 | US20060033147 Flash memory structure and fabrication method thereof |
| 02/16/2006 | US20060033141 Method of manufacturing a semiconductor device having trenches for isolation and capacitor |
| 02/16/2006 | US20060033140 Memory circuitry |
| 02/16/2006 | US20060033139 Semiconductor device and method of manufacturing the same |
| 02/16/2006 | US20060033137 Methods of forming capacitors for semiconductor memory devices and resulting semiconductor memory devices |
| 02/16/2006 | US20060033135 Ferroelectric element and method for manufacturing the same |
| 02/16/2006 | US20060033134 Ferroelectric random access memories (FRAMS) having lower electrodes respectively self-aligned to node conductive layer patterns and methods of forming the same |
| 02/16/2006 | US20060033130 Liquid crystal display device |
| 02/16/2006 | US20060033129 Low dark current image sensors with epitaxial SiC and/or carbonated channels for array transistors |
| 02/16/2006 | US20060033125 Transistor with nitrogen-hardened gate oxide |
| 02/16/2006 | US20060033124 Method for fabrication of semiconductor device |
| 02/16/2006 | US20060033123 Interconnect line selectively isolated from an underlying contact plug |
| 02/16/2006 | US20060033121 Chemical sensor using chemically induced electron-hole production at a Schottky barrier |
| 02/16/2006 | US20060033119 III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer |
| 02/16/2006 | US20060033118 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack |
| 02/16/2006 | US20060033111 Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices |
| 02/16/2006 | US20060033109 Liquid crystal display device and fabrication method thereof |
| 02/16/2006 | US20060033108 Transparent double-injection field-effect transistor |
| 02/16/2006 | US20060033107 Thin film transistor and method of fabricating the same |
| 02/16/2006 | US20060033106 Thin film transistor and method of fabricating the same |
| 02/16/2006 | US20060033105 Thin film transistor, liquid crystal display apparatus, manufacturing method of thin film transistor, and manafacturing method of liquid crystal display apparatus |
| 02/16/2006 | US20060033103 Display device, method of production of the same, and projection type display device |
| 02/16/2006 | US20060033102 Thin film transistor array panel used for a liquid crystal display and a manufacturing method thereof |
| 02/16/2006 | US20060033100 Anisotropically conductive connector and production process thereof, and probe member |
| 02/16/2006 | US20060033094 Resistance variable memory with temperature tolerant materials |
| 02/16/2006 | US20060033055 Surface position detection apparatus and method, and exposure apparatus and device manufacturing method using the exposure apparatus |
| 02/16/2006 | US20060033054 Method for fabricating a semiconductor device |
| 02/16/2006 | US20060033051 Lithographic apparatus, device manufacturing method, device manufactured thereby, and computer program |
| 02/16/2006 | US20060033050 Electron-beam drawing apparatus and electron-beam drawing method |
| 02/16/2006 | US20060033049 Design pattern data preparing method, mask pattern data preparing method, mask manufacturing method, semiconductor device manufacturing method, and program recording medium |
| 02/16/2006 | US20060033019 Polarization state detecting system, light source, and exposure apparatus |
| 02/16/2006 | US20060033012 System for compensating for dark current in sensors |
| 02/16/2006 | US20060032888 Concave face wire bond capillary and method |
| 02/16/2006 | US20060032848 Process and system for heating semiconductor substrates in a processing chamber containing a susceptor |
| 02/16/2006 | US20060032835 Method and apparatus for simulating standard test wafers |
| 02/16/2006 | US20060032781 Tray carrier with ultraphobic surfaces |
| 02/16/2006 | US20060032762 Method for forming patterns on a semiconductor device using a lift off technique |
| 02/16/2006 | US20060032741 Sputtering cathode adapter assembly and method |
| 02/16/2006 | US20060032587 Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer |
| 02/16/2006 | US20060032586 Reducing electrostatic charge by roughening the susceptor |
| 02/16/2006 | US20060032585 Plasma processing method and apparatus |
| 02/16/2006 | US20060032583 Apparatus and method for fabricating bonded substrate |
| 02/16/2006 | US20060032577 Method for the manufacture of a smart label inlet web, and a smart label inlet web |
| 02/16/2006 | US20060032529 Organic photosensitive devices |
| 02/16/2006 | US20060032520 High pressure processing method |
| 02/16/2006 | US20060032445 Substrate processing apparatus and method, and gas nozzle for improving purge efficiency |
| 02/16/2006 | US20060032441 Applying a topcoat onto the primer coating, prepared from an amine curing agent, toughening agents, fire retardant, a glass fiber thixotrope, a pigment, and an abrasive aggregate; non-skid surface for boat decks etc. |
| 02/16/2006 | US20060032440 Apparatus and method for depositing a material on a substrate |
| 02/16/2006 | US20060032432 Bulk single crystal gallium nitride and method of making same |
| 02/16/2006 | US20060032312 Acoustic wave sensor apparatus, method and system using wide bandgap materials |
| 02/16/2006 | US20060032148 Method of manufacturing polishing slurry for use in precise polishing process |
| 02/16/2006 | US20060032147 Method of preparing slurry composition for chemical mechanical polishing |
| 02/16/2006 | US20060032079 Serial thermal processor arrangement |
| 02/16/2006 | US20060032074 Vacuum processing apparatus and substrate transfer method |
| 02/16/2006 | US20060032073 Vacuum processing apparatus and operating method therefor |
| 02/16/2006 | US20060032072 Single-wafer type heat treatment apparatus for semiconductor processing system |
| 02/16/2006 | US20060032050 Methods of forming a contact array in situ on a substrate |
| 02/16/2006 | US20060032049 Circuit device manufacturing method |
| 02/16/2006 | DE19855924B4 Herstellungsverfahren für eine Verbindung Preparation process for a compound |
| 02/16/2006 | DE19837516B9 Verfahren und Vorrichtung zur Ausbildung einer dünnen Schicht Method and apparatus for forming a thin layer |
| 02/16/2006 | DE19712551B4 Zuleitungsrahmen und darauf angewendetes Herstellungsverfahren für Halbleitergehäuse in Chipgröße Lead frame and on-applied method for manufacturing semiconductor packages in chip size |
| 02/16/2006 | DE19710731B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation |
| 02/16/2006 | DE19611043B4 Verfahren zum Herstellen eines Siliciumwafers, Verfahren zum Bilden eines Siliciumwafers und Verfahren zur Herstellung eines Halbleiterbauelements A method for producing a silicon wafer, method for forming a silicon wafer and method for manufacturing a semiconductor device |
| 02/16/2006 | DE19521470B4 Datenausgabepuffer Data output buffer |
| 02/16/2006 | DE112004000586T5 Verfahren zur Herstellung von Strukturen in FinFET-Bauelementen A process for producing structures in FinFET devices |
| 02/16/2006 | DE10255830B4 Verfahren zur Herstellung eines mittels Feldeffekt steuerbaren Halbleiterbauelements A method for producing a controllable means of field-effect semiconductor device |
| 02/16/2006 | DE102005034881A1 Verfahren zum Positionieren einer Trennlinie eines Wafers A method for positioning a parting line of a wafer |
| 02/16/2006 | DE102005030322A1 Waferunterteilungsverfahren Wafer dividing method |
| 02/16/2006 | DE102005028494A1 Circuit substrate for preparing a semiconductor chip carrier by flip chip technique has contact lead frame and flip chip lead frame |
| 02/16/2006 | DE102005027445A1 Dünnschichttransistorarray-Substrat und Herstellungsverfahren für ein solches Thin film transistor array substrate and manufacturing method for such a |
| 02/16/2006 | DE102005026228A1 Fabricating gate all around transistor device, for use as GM type semiconductor device, involves subsequentially removing sacrificial layer and forming gate insulating layer and gate electrode in opening |
| 02/16/2006 | DE102005015036A1 Verfahren zur Montage eines Chips auf einer Unterlage und nach diesem Verfahren hergestellte Anordnung A method of mounting a chip on a substrate and produced by this process arrangement |