| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/23/2006 | DE19947020B4 Kompensationsbauelement mit variabler Ladungsbilanz und dessen Herstellungsverfahren Compensation component with variable charge balance and its manufacturing method |
| 02/23/2006 | DE19840226B4 Verfahren zum Aufbringen eines Schaltungschips auf einen Träger Method for applying a circuit chips on a carrier |
| 02/23/2006 | DE19746641B4 Verdrahtungsverfahren für Halbleiter-Bauelemente zur Verhinderung von Produktpiraterie und Produktmanipulation und Verwendung des Halbleiter-Bauelements in einer Chipkarte Wiring method for semiconductor devices to prevent piracy and product manipulation and use of the semiconductor device in a smart card |
| 02/23/2006 | DE19726308B4 Verfahren zur Bildung einer Polycidschicht bei einem Halbleiterbauelement sowie Halbleiterbauelement A method for forming a polycide layer on a semiconductor device and semiconductor device |
| 02/23/2006 | DE19709259B4 Mehrlagiges Bodenanschlussgehäuse A multi-layer floor connection housing |
| 02/23/2006 | DE19613611B4 Metallmagazineinheit zum Prüfen eines Halbleiterbauelements Metal magazine unit for testing a semiconductor device |
| 02/23/2006 | DE19608208B4 Verfahren zur Herstellung von Metallzwischenverbindungen in Halbleitereinrichtungen A process for the production of metal interconnections in semiconductor devices |
| 02/23/2006 | DE112004000578T5 Verfahren zur Herstellung eines Gates in einem Finfet-Bauelement und Dünnen eines Stegs in einem Kanalgebiet des Fifet-Bauelements Process for the preparation of a gate in a FinFET device and thinning of a fin in a channel region of the device Fifet- |
| 02/23/2006 | DE112004000257T5 Strahlungsempfindliche Harzzusammensetzung, Verfahren zur Herstellung derselben und Verfahren zur Herstellung einer Halbleiteranordnung mit derselben The radiation sensitive resin composition, method of producing the same and method of manufacturing a semiconductor device comprising the same |
| 02/23/2006 | DE10352055B4 Spannungsgesteuerter Schwingkreis A voltage controlled oscillator |
| 02/23/2006 | DE10334406B4 Verfahren zur Ausbildung eines Kontaktes in einem Halbleiterprozeß A method of forming a contact in a semiconductor process |
| 02/23/2006 | DE10320135B4 Verfahren zum Positionieren von Bumpmasken Method for positioning Bumpmasken |
| 02/23/2006 | DE102005038998A1 Metalloxidhalbleiter-Bauelement mit verbesserter Abschirmstruktur Metal oxide semiconductor device with improved shielding |
| 02/23/2006 | DE102005038873A1 Vielkammer-MOCVD-Aufwachsvorrichtung für hohe Geschwindigkeit/ hohen Durchsatz Multi-chamber MOCVD growth apparatus for high speed / high throughput |
| 02/23/2006 | DE102005038670A1 Verfahren zum Trennen eines Halbleitersubstrats A method for separating a semiconductor substrate |
| 02/23/2006 | DE102005038452A1 Halbleiterwafer und Prüfverfahren Semiconductor wafer and test methods |
| 02/23/2006 | DE102005037412A1 Laserbearbeitungsverfahren Laser processing method |
| 02/23/2006 | DE102005037348A1 Ein Maschinensichtanalysesystem und -verfahren A machine vision analysis system and method |
| 02/23/2006 | DE102005036551A1 Siliziumkarbid-Halbleitervorrichtung und Herstellungsverfahren davon Silicon carbide semiconductor device and manufacturing method thereof |
| 02/23/2006 | DE102005036521A1 Verfahren zum Testen von Pixeln für LCD TFT Displays A method for testing of pixels for LCD TFT displays |
| 02/23/2006 | DE102005033443A1 Semiconductor etching apparatus for use in fabrication of semiconductor device, comprises electrostatic chuck, edge ring and ring-shaped spacer within process chamber |
| 02/23/2006 | DE102005032280A1 Silberinsel-Antifuse Silver island anti-fuse |
| 02/23/2006 | DE102005030845A1 Nichtflüchtige Speichervorrichtungen mit Gräben und Verfahren zum Bilden derselben Non-volatile memory devices having trenches and methods of forming the same |
| 02/23/2006 | DE102005029493A1 Integrierte Speicherschaltungsanordnung und Verfahren Integrated circuit memory device and method |
| 02/23/2006 | DE102005027212A1 Spülzusammensetzung und Verfahren zum Spülen und Herstellen von Siliziumwafern Rinsing composition and methods for rinsing and preparing silicon wafers |
| 02/23/2006 | DE102005021835A1 Solarzellenmodul-Verbindungsglied und Verfahren zum Herstellen eines Solarzellenmodul-Panels A solar cell module-connecting member and method for manufacturing a solar cell module panels |
| 02/23/2006 | DE102004054147A1 Adhesive layer of material that is selectively hardened is bonded to thin semiconductor wafers |
| 02/23/2006 | DE102004043517A1 Halbleiterspeichergerät mit Speicherzellen mit Floating-Gate-Elektrode und Herstellungsverfahren A semiconductor memory device having memory cells with floating gate electrode and production method |
| 02/23/2006 | DE102004041679A1 Method of lithographic production of structures in a radiation sensitive layer especially for semiconductor devices such as DRAM chips uses radiation absorbing layer |
| 02/23/2006 | DE102004040503A1 Semiconductor element such as a conductive bridging RAM has chip in housing with screening layer on chip and housing for electric and or magnetic shielding |
| 02/23/2006 | DE102004040429A1 Doppelseiten-Poliermaschine Double-side polishing machine |
| 02/23/2006 | DE102004040238A1 Flexibler Nanotransistor und Verfahren zur Herstellung Flexible nano transistor and methods for making |
| 02/23/2006 | DE102004039763A1 Hard mask layer`s thickness determining method for manufacturing high integrated circuits, involves recording intensity of photoelectrons produced by x-ray energy, and finding layer thickness from intensity and/or energy of photoelectrons |
| 02/23/2006 | DE102004039693A1 Chipmodul Chip module |
| 02/23/2006 | DE102004039443A1 Verfahren zum thermischen Behandeln von scheibenförmigen Substraten A method for the thermal treatment of disk-shaped substrates |
| 02/23/2006 | DE102004039209A1 Verfahren zur Herstellung einer n-dotierten Feldstoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Feldstoppzone A process for producing an n-doped field stop zone in a semiconductor body and the semiconductor device having a field stop zone |
| 02/23/2006 | DE102004039208A1 Verfahren zur Herstellung einer vergrabenen n-dotierten Halbleiterzone in einem Halbleiterkörper und Halbleiterbauelement A process for producing a buried n-doped semiconductor region in a semiconductor body and the semiconductor component |
| 02/23/2006 | DE102004038997A1 Integrated circuit has at least two RAMS and at least two dummy holes in a layer that are spaced from the RAMs by at least a planarizing length |
| 02/23/2006 | DE102004038699A1 Kaskode, Kaskodenschaltung und Verfahren zur vertikalen Integration von zwei Bipolartransistoren zu einer Kaskodenanordnung Cascode cascode circuit and method for vertical integration of two bipolar transistors in a cascode arrangement |
| 02/23/2006 | DE102004037622A1 Prozesssystem sowie Vorrichtung zum Transport von Substraten Process system and apparatus for transporting substrates |
| 02/23/2006 | DE102004037336A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 02/23/2006 | DE102004033195A1 Vorrichtung zur Inspektion eines mikroskopischen Bauteils Apparatus for inspecting a microscopic component |
| 02/23/2006 | DE10164049B4 Passive Bauelementstruktur und diese enthaltendes integriertes Schaltkreisbauelement und Halbleiterbauelement Passive component structure and containing these integrated circuit device and semiconductor device |
| 02/23/2006 | DE10143256B4 Integrierter SOI-Halbleiterschaltkreis und Herstellungsverfahren hierfür SOI semiconductor integrated circuit, and manufacturing method thereof |
| 02/23/2006 | DE10125407B4 Verbesserte elektronische Sicherungen durch die lokale Verschlechterung der schmelzbaren Verbindung Improved electronic fuses by the local deterioration of the fusible link |
| 02/23/2006 | DE10111708B4 Halbleitervorrichtung und Herstellungsverfahren für dieselbe A semiconductor device and manufacturing method for the same |
| 02/23/2006 | DE10041565B4 Metallzwischenverbindung, Halbleitervorrichtung, Verfahren zum Bilden einer Metallzwischenverbindung und Verfahren zum Herstellen einer Halbleitervorrichtung Interconnect metal, semiconductor device, method for forming a metal interconnect and method for making a semiconductor device |
| 02/23/2006 | DE10035962B4 Vorrichtung und Verfahren zum Aufnehmen und Abgeben von Substraten Apparatus and method for receiving and discharging of substrates |
| 02/23/2006 | DE10024111B4 Verfahren zur Herstellung eines Bauelements aus übereinander gestapelten miteinander verlöteten Platten A method for producing a component of stacked plates soldered together |
| 02/23/2006 | CA2573907A1 Mems device and interposer and method for integrating mems device and interposer |
| 02/23/2006 | CA2573788A1 Non-aqueous microelectronic cleaning compositions containing fructose |
| 02/22/2006 | EP1628509A2 Electronic module with form in-place pedestal |
| 02/22/2006 | EP1628363A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 02/22/2006 | EP1628349A2 Mis capacitor and production method of mis capacitor |
| 02/22/2006 | EP1628341A2 Antiferromagnetic/paramagnetic resistive device, non-volatile memory and method for fabricating the same |
| 02/22/2006 | EP1628340A1 Method of integrating three bipolar transistors in a semiconductor body, multilayer device and semiconductor apparatus |
| 02/22/2006 | EP1628339A1 Heat treatment prior to bonding two wafers |
| 02/22/2006 | EP1628338A1 The manufacturing method of a modularized leadframe |
| 02/22/2006 | EP1628337A1 P-channel power mis field effect transistor and swiching circuit |
| 02/22/2006 | EP1628336A2 Cleaning liquid and cleaning method |
| 02/22/2006 | EP1628334A1 Polishing liquid for cmp process and polishing method |
| 02/22/2006 | EP1628333A1 Method of producing film-thinning circuit board having penetrated structure and protecting adhesive tape |
| 02/22/2006 | EP1628332A2 Thin film device and method of fabrication |
| 02/22/2006 | EP1628331A1 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor |
| 02/22/2006 | EP1628328A2 Method for fabricating a three-dimensional capacitor |
| 02/22/2006 | EP1628327A2 Dielectric memory device and method for fabricating the same |
| 02/22/2006 | EP1628283A1 Pixel circuit, display unit, and pixel circuit drive method |
| 02/22/2006 | EP1628243A1 Ic card and ic card making method |
| 02/22/2006 | EP1627940A1 Method for producing single crystal of multi- element oxide single crystal containing bismuth as constituting element |
| 02/22/2006 | EP1627425A2 Method for the production of a chip arrangement and varnish for carrying out said method |
| 02/22/2006 | EP1627424A2 Method of using pre-applied underfill encapsulant |
| 02/22/2006 | EP1627423A1 Surgical holder for a blood vessel |
| 02/22/2006 | EP1627422A1 Method of delineating a conducting element which is disposed on an insulating layer, and device and transistor thus obtained |
| 02/22/2006 | EP1627265A2 In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration |
| 02/22/2006 | EP1627259A1 Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof |
| 02/22/2006 | EP1627257A2 Maintaining the dimensions of features being etched on a lithographic mask |
| 02/22/2006 | EP1535116A4 Improved photomask having an intermediate inspection film layer |
| 02/22/2006 | EP1502264B1 Layout for thermally selected cross-point mram cell |
| 02/22/2006 | EP1396014B1 Apparatus for the measurement or machining of an object, provided with a displacement stage with wedge-shaped guides |
| 02/22/2006 | EP1391140A4 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
| 02/22/2006 | EP1287544B1 Method and apparatus for controlling ion implantation during vacuum fluctuation |
| 02/22/2006 | EP1259165B1 Modelling and testing of an integrated circuit |
| 02/22/2006 | EP1157253B1 Specimen topography reconstruction |
| 02/22/2006 | EP1137967B1 Method for mask repair using defect compensation |
| 02/22/2006 | EP1060505B1 Method for producing a microelectronic semiconductor component |
| 02/22/2006 | EP0946988B1 Memory redundancy circuit using single polysilicon floating gate transistors as redundancy elements |
| 02/22/2006 | EP0876702B1 Integrated magnetic levitation and rotation system |
| 02/22/2006 | EP0734617B1 Transmission system utilizing different coding principles |
| 02/22/2006 | CN2760759Y 应变沟道半导体结构 Strained channel semiconductor structure |
| 02/22/2006 | CN2760754Y Clamp ring with flange for chemical machinery polishing |
| 02/22/2006 | CN2760753Y Superhigh vacuum gas ionization device |
| 02/22/2006 | CN2760713Y Static memory element using partially depleted and fully depleted transistor constructiveness |
| 02/22/2006 | CN1739198A Semiconductor device, process for producing the same and imaging device |
| 02/22/2006 | CN1739196A Shallow trench isolation for strained silicon processes |
| 02/22/2006 | CN1739195A Double pullback method of filling an isolation trench including two silicon nitride etching process |
| 02/22/2006 | CN1739194A Probe apparatus with optical length-measuring unit and probe testing method |
| 02/22/2006 | CN1739193A Diffusion barrier and method therefor |
| 02/22/2006 | CN1739192A Methods for planarization of group VIII metal-containing surfaces using complexing agents |
| 02/22/2006 | CN1739191A Nitrogen-free dielectric anti-reflective coating and hardmask |
| 02/22/2006 | CN1739190A Fluorine-free plasma curing process for porous Low-K-materials |