Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/09/2006US20060030087 Compliant substrate for a heteroepitaxial structure and method for making same
02/09/2006US20060030086 Method of manufacturing thin film transistor
02/09/2006US20060030085 Method of fabricating thin film transistor
02/09/2006US20060030084 Manufacture of electronic devices comprising thin-film circuit elements
02/09/2006US20060030083 Semiconductor device and fabricating method thereof
02/09/2006US20060030082 Semiconductor device and fabricating method thereof
02/09/2006US20060030081 Method for fabricating semiconductor package with circuit side polymer layer
02/09/2006US20060030080 Removable flash integrated memory module card and method of manufacture
02/09/2006US20060030079 Wafer level package structure of optical-electronic device and method for making the same
02/09/2006US20060030078 Methods of fabricating integrated circuitry
02/09/2006US20060030077 Substrate comprising a plurality of integrated circuitry die, and a substrate
02/09/2006US20060030076 Semiconductor device
02/09/2006US20060030075 Manufacturing method of semiconductor device
02/09/2006US20060030074 Method for connecting substrate and composite element
02/09/2006US20060030073 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components
02/09/2006US20060030072 Methods for securing packaged semiconductor devices to carrier substrates
02/09/2006US20060030071 Method for processing base
02/09/2006US20060030070 Packaging structure and method of an image sensor module
02/09/2006US20060030069 Packaging method for manufacturing substrates
02/09/2006US20060030068 Fabrication method for phase change diode memory cells
02/09/2006US20060030067 Method for manufacturing organic thin-film transistor with plastic substrate
02/09/2006US20060030066 Intermetallic spring structure
02/09/2006US20060030065 Semiconductor optical device and the fabrication method
02/09/2006US20060030064 Method and apparatus for addressing thickness variations of a trench floor formed in a semiconductor substrate
02/09/2006US20060030063 Package structure for light emitting diode and method thereof
02/09/2006US20060030062 Micromachined wafer strain gauge
02/09/2006US20060030061 Process for locating, displaying, analyzing, and optionally monitoring potential transient defect sites in one or more integrated circuit chips of a semiconductor substrate
02/09/2006US20060030060 Apparatus and method for testing defects
02/09/2006US20060030059 Apparatus and method for testing defects
02/09/2006US20060030058 High speed low power magnetic devices based on current induced spin-momentum transfer
02/09/2006US20060030057 Insulating film, capacitive element and semiconductor storage device including the insulating film, and fabrication methods thereof
02/09/2006US20060029994 Metal oxide semiconductor field effect transistor (MOSFET) on a semiconductor substrate; tin oxide film on substrate having immobilized penicillin G acylase film formed from photopolymerization; conductive wire; accurate, high speed response; disposable; industrial scale
02/09/2006US20060029885 Capable of forming a high resolution resist pattern with good shape and little film thinning; forming a resist layer from a chemically amplified positive resist; exposing; developing layer using an aqueous alkyl ammonium hydroxide solution
02/09/2006US20060029867 Device and method for controlling close contact of near-field exposure mask, and near-field exposure mask for the same
02/09/2006US20060029832 High surface quality GaN wafer and method of fabricating same
02/09/2006US20060029811 Resin composition, method of its composition, and cured formulation
02/09/2006US20060029781 Circuitized substrate and method of making same
02/09/2006US20060029762 Re-usable carrier structure
02/09/2006US20060029745 High throughput ILD fill process for high aspect ratio gap fill
02/09/2006US20060029738 Electrodeposition on semiconductors; purging
02/09/2006US20060029737 Atomic layer deposition method of forming an oxide comprising layer on a substrate
02/09/2006US20060029489 Apparatus for storing and moving a cassette
02/09/2006US20060029426 Active matrix display device
02/09/2006US20060028892 Ferroelectric memory device and method of making the same
02/09/2006US20060028879 Semiconductor device
02/09/2006US20060028866 Data storage device and associated method for writing data to, and reading data from an unpatterned magnetic layer
02/09/2006US20060028859 6F2 3-Transistor DRAM gain cell
02/09/2006US20060028858 Semiconductor memory pipeline buffer
02/09/2006US20060028856 Semiconductor memory devices and methods of fabricating semiconductor memory device
02/09/2006US20060028853 Semiconductor device
02/09/2006US20060028799 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
02/09/2006US20060028715 Catadioptric projection optical system, exposure apparatus having the same, device fabrication method
02/09/2006US20060028703 Method of using deformable mirror using piezoelectric actuators formed as an integrated circuit
02/09/2006US20060028655 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
02/09/2006US20060028631 Exposure apparatus and exposure method
02/09/2006US20060028629 Exposure apparatus
02/09/2006US20060028605 TFT active matrix liquid crystal display devices
02/09/2006US20060028378 Apparatus and methods for constructing antennas using wire bonds as radiating elements
02/09/2006US20060028310 Alignment apparatus, exposure apparatus, and device manufacturing method
02/09/2006US20060028266 Voltage generating circuit
02/09/2006US20060028231 System for manufacturing display panel, method to be used in same, and testing apparatus therefor
02/09/2006US20060028225 Process and a device for the calibration of a semiconductor component test system
02/09/2006US20060028223 Test method of semiconductor devices
02/09/2006US20060028218 Inspection method and apparatus for circuit pattern
02/09/2006US20060028217 System of detection and repair and method thereof
02/09/2006US20060028200 Chuck for holding a device under test
02/09/2006US20060027936 Method for processing base
02/09/2006US20060027934 Silicon chip carrier with conductive through-vias and method for fabricating same
02/09/2006US20060027932 Interconnect with composite barrier layers and method for fabricating the same
02/09/2006US20060027929 Exposed pore sealing post patterning
02/09/2006US20060027928 Semiconductor integrated circuit device
02/09/2006US20060027926 Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device
02/09/2006US20060027916 Mechanism and process for compressing chips
02/09/2006US20060027915 Device packages with low stress assembly process
02/09/2006US20060027914 Integrated heat spreader lid
02/09/2006US20060027912 Film carrier tape for mounting of electronic part
02/09/2006US20060027911 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures
02/09/2006US20060027907 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
02/09/2006US20060027902 Method and apparatus for stacked die packaging
02/09/2006US20060027897 P-type silicon wafer and method for heat-treating the same
02/09/2006US20060027895 Forming lateral bipolar junction transistor in CMOS flow
02/09/2006US20060027893 Field-enhanced programmable resistance memory cell
02/09/2006US20060027890 Deep trench isolation structure of a high-voltage device and method for forming thereof
02/09/2006US20060027889 Isolated fully depleted silicon-on-insulator regions by selective etch
02/09/2006US20060027888 Solid-state image pickup device and manufacturing method thereof
02/09/2006US20060027886 Apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
02/09/2006US20060027885 MEMS device with non-standard profile
02/09/2006US20060027883 Semiconductor device and manufacturing method thereof
02/09/2006US20060027882 Dielectric layer created using ALD to deposit multiple components
02/09/2006US20060027880 Semiconductor device including a high-breakdown voltage MOS transistor
02/09/2006US20060027879 Semiconductor device and method of manufacturing the same
02/09/2006US20060027875 Semiconductor device with gate space of positive slope and fabrication method thereof
02/09/2006US20060027873 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
02/09/2006US20060027869 Vertical double-channel silicon-on-insulator transistor and method of manufacturing the same
02/09/2006US20060027868 High mobility CMOS circuits
02/09/2006US20060027867 Sub-lithographics opening for back contact or back gate
02/09/2006US20060027866 Method of forming a recessed buried-diffusion device
02/09/2006US20060027864 Semiconductor device and method for fabricating such device
02/09/2006US20060027862 Semiconductor device and a method of manufacturing the same
02/09/2006US20060027859 Methods of forming memory cells with nonuniform floating gate structures