Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/28/2006US7005658 Charged particle beam exposure apparatus and method
02/28/2006US7005650 Apparatus for fabricating a semiconductor device
02/28/2006US7005649 Mask blanks inspection method and mask blank inspection tool
02/28/2006US7005641 Electron beam apparatus and a device manufacturing method by using said electron beam apparatus
02/28/2006US7005640 Method and apparatus for the characterization of a depth structure in a substrate
02/28/2006US7005637 Backside thinning of image array devices
02/28/2006US7005601 Thermal flux processing by scanning
02/28/2006US7005585 Mounting board and electronic device using same
02/28/2006US7005577 Semiconductor chip package having an adhesive tape attached on bonding wires
02/28/2006US7005393 Method of fabricating a semiconductor device containing nitrogen in an oxide film
02/28/2006US7005392 Source reagent compositions for CVD formation of gate dielectric thin films using amide precursors and method of using same
02/28/2006US7005391 Method of manufacturing inorganic nanotube
02/28/2006US7005390 Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials
02/28/2006US7005389 Methods for forming a thin film on an integrated circuit device by sequentially providing energies to activate the reactants
02/28/2006US7005388 Method of forming through-the-wafer metal interconnect structures
02/28/2006US7005387 Method for preventing an increase in contact hole width during contact formation
02/28/2006US7005386 Method for reducing resist height erosion in a gate etch process
02/28/2006US7005385 Method for removing a resist mask with high selectivity to a carbon hard mask used for semiconductor structuring
02/28/2006US7005384 Chemical mechanical polishing method, and washing/rinsing method associated therewith
02/28/2006US7005383 Apparatus and methods of chemical mechanical polishing
02/28/2006US7005382 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
02/28/2006US7005381 Method for flat electrodes
02/28/2006US7005380 Simultaneous formation of device and backside contacts on wafers having a buried insulator layer
02/28/2006US7005379 Semiconductor processing methods for forming electrical contacts
02/28/2006US7005378 Processes for fabricating conductive patterns using nanolithography as a patterning tool
02/28/2006US7005377 Bimetal layer manufacturing method
02/28/2006US7005376 Ultra-uniform silicides in integrated circuit technology
02/28/2006US7005375 Method to avoid copper contamination of a via or dual damascene structure
02/28/2006US7005374 Method for forming contact hole
02/28/2006US7005373 Method for forming a metal silicide layer in a semiconductor device
02/28/2006US7005372 Deposition of tungsten nitride
02/28/2006US7005371 Method of forming suspended transmission line structures in back end of line processing
02/28/2006US7005370 Method of manufacturing different bond pads on the same substrate of an integrated circuit package
02/28/2006US7005369 Active area bonding compatible high current structures
02/28/2006US7005368 Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
02/28/2006US7005367 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer
02/28/2006US7005366 Tri-gate devices and methods of fabrication
02/28/2006US7005365 Structure and method to fabricate self-aligned transistors with dual work function metal gate electrodes
02/28/2006US7005364 Method for manufacturing semiconductor device
02/28/2006US7005363 Method of forming a semi-insulating region
02/28/2006US7005362 Method of fabricating a thin film transistor
02/28/2006US7005361 Providing high precision resistance in an integrated circuit using a thin film resistor of controlled dimension
02/28/2006US7005360 Method for fabricating a microelectronic circuit including applying metal over and thickening the integrated coil to increase conductivity
02/28/2006US7005359 Bipolar junction transistor with improved extrinsic base region and method of fabrication
02/28/2006US7005358 Technique for forming recessed sidewall spacers for a polysilicon line
02/28/2006US7005357 Low stress sidewall spacer in integrated circuit technology
02/28/2006US7005356 Schottky barrier transistor and method of manufacturing the same
02/28/2006US7005355 Method for fabricating semiconductor memories with charge trapping memory cells
02/28/2006US7005354 Depletion drain-extended MOS transistors and methods for making the same
02/28/2006US7005353 Method for improved MOS gating to reduce miller capacitance and switching losses
02/28/2006US7005352 Trench-type MOSFET having a reduced device pitch and on-resistance
02/28/2006US7005351 Method for fabricating a transistor configuration including trench transistor cells having a field electrode, trench transistor, and trench configuration
02/28/2006US7005350 Method for fabricating programmable memory array structures incorporating series-connected transistor strings
02/28/2006US7005349 Method of manufacturing twin-ONO-type SONOS memory using reverse self-alignment process
02/28/2006US7005348 Methods for fabricating semiconductor devices
02/28/2006US7005347 Structures of and methods of fabricating trench-gated MIS devices
02/28/2006US7005346 Method for producing a memory cell of a memory cell field in a semiconductor memory
02/28/2006US7005345 Non-volatile semiconductor memory device and its manufacturing method
02/28/2006US7005344 Method of forming a device with a gallium nitride or gallium aluminum nitride gate
02/28/2006US7005343 Semiconductor device and method of manufacturing the same
02/28/2006US7005342 Method to fabricate surface p-channel CMOS
02/28/2006US7005341 Dynamic random access memory cell and fabricating method thereof
02/28/2006US7005340 Method for manufacturing semiconductor device
02/28/2006US7005339 Method of integrating high voltage metal oxide semiconductor devices and submicron metal oxide semiconductor devices
02/28/2006US7005338 Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate
02/28/2006US7005337 Method for a parallel production of an MOS transistor and a bipolar transistor
02/28/2006US7005336 Process for forming CMOS transistors and MOS transistors of the drain extension type, with a low gate region resistance, in the same semiconductor substrate
02/28/2006US7005335 Array of nanoscopic mosfet transistors and fabrication methods
02/28/2006US7005334 Zero threshold voltage pFET and method of making same
02/28/2006US7005333 Transistor with silicon and carbon layer in the channel region
02/28/2006US7005332 Fabrication method of thin film transistor
02/28/2006US7005331 Method of manufacturing a thin film transistor array
02/28/2006US7005330 Structure and method for forming the gate electrode in a multiple-gate transistor
02/28/2006US7005329 Method for manufacturing semiconductor device
02/28/2006US7005328 Non-volatile memory device
02/28/2006US7005327 Process and structure for semiconductor package
02/28/2006US7005326 Method of making an integrated circuit package
02/28/2006US7005325 Semiconductor package with passive device integration
02/28/2006US7005324 Method of fabricating stacked semiconductor chips
02/28/2006US7005323 Method and apparatus for shielding integrated circuits
02/28/2006US7005322 Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates
02/28/2006US7005321 Stress-compensation layers in contact arrays, and processes of making same
02/28/2006US7005320 Method for manufacturing flip chip package devices with a heat spreader
02/28/2006US7005319 Global planarization of wafer scale package with precision die thickness control
02/28/2006US7005318 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
02/28/2006US7005317 Controlled fracture substrate singulation
02/28/2006US7005316 Method for package reduction in stacked chip and board assemblies
02/28/2006US7005315 Method and fabricating complementary metal-oxide semiconductor image sensor with reduced etch damage
02/28/2006US7005314 Sacrificial layer technique to make gaps in MEMS applications
02/28/2006US7005313 Semiconductor dynamic sensor, and methods of transport and collet suction for the same
02/28/2006US7005312 Method of manufacturing CMOS image sensor by means of double masking process
02/28/2006US7005311 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
02/28/2006US7005310 Manufacturing method of solid-state image sensing device
02/28/2006US7005308 Electro-optic device, method to manufacture the same and electronic apparatus
02/28/2006US7005306 Accurate thickness measurement of thin conductive film
02/28/2006US7005305 Signal layer for generating characteristic optical plasma emissions
02/28/2006US7005304 Micro-moving device and its manufacturing method
02/28/2006US7005303 Low temperature chemical vapor deposition process for forming bismuth-containing ceramic thin films useful in ferroelectric memory devices
02/28/2006US7005249 Apparatus for processing substrate and method of processing the same
02/28/2006US7005248 Method of forming cavity between multilayered wirings