Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/16/2006US20060057831 Wire bond pads
03/16/2006US20060057830 Method for producing bumps on an electrical component
03/16/2006US20060057829 Method of forming a damascene structure with integrated planar dielectric layers
03/16/2006US20060057828 Method of manufacturing semiconductor device
03/16/2006US20060057827 Method for manufacturing in electrically conductive pattern
03/16/2006US20060057826 System and method for suppression of wafer temperature drift in cold-wall cvd systems
03/16/2006US20060057825 Semiconductor devices with reduced active region defects and unique contacting schemes
03/16/2006US20060057824 Apparatus for producing nitride semiconductor, method for producing nitride semiconductor, and semiconductor laser device obtained by the method
03/16/2006US20060057823 Method for manufacturing a moulded MMC multi media card package obtained with laser cutting
03/16/2006US20060057822 Chip dicing
03/16/2006US20060057821 Low temperature methods of etching semiconductor substrates
03/16/2006US20060057820 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
03/16/2006US20060057819 Electronic part producing method and electronic part
03/16/2006US20060057818 Package structure and method for optoelectric products
03/16/2006US20060057817 Semiconductor device, its manufacture method and electronic component unit
03/16/2006US20060057816 Sensor element with trenched cavity
03/16/2006US20060057815 Method of manufacturing a semiconductor device
03/16/2006US20060057814 Fabricating a memory cell arrangement
03/16/2006US20060057813 Method of forming a polysilicon resistor
03/16/2006US20060057812 Full sequence metal and barrier layer electrochemical mechanical processing
03/16/2006US20060057811 Selective post-doping of gate structures by means of selective oxide growth
03/16/2006US20060057810 Surface preparation method for selective and non-selective epitaxial growth
03/16/2006US20060057809 Methods for selective deposition to improve selectivity
03/16/2006US20060057808 Reducing oxidation under a high K gate dielectric
03/16/2006US20060057807 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer
03/16/2006US20060057806 Method for manufacturing flash memory device
03/16/2006US20060057805 Method for forming a gate electrode in a non volatile memory device
03/16/2006US20060057804 Etching method and apparatus
03/16/2006US20060057803 Method to reduce a capacitor depletion phenomena
03/16/2006US20060057802 Method of making a finFET having suppressed parasitic device characteristics
03/16/2006US20060057801 Thin films and methods for the preparation thereof
03/16/2006US20060057800 Methods for treating pluralities of discrete semiconductor substrates
03/16/2006US20060057799 Substrate processing apparatus
03/16/2006US20060057798 Semiconductor device and its manufacturing method
03/16/2006US20060057797 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs
03/16/2006US20060057796 Silicon carbide semiconductor device and its method of manufacturing method
03/16/2006US20060057795 Method of manufacturing a semiconductor integrated circuit device
03/16/2006US20060057794 Semiconductor devices including high-k dielectric materials and methods of forming the same
03/16/2006US20060057793 Semiconductor device and manufacturing method of the same
03/16/2006US20060057792 Semiconductor device having conductive spacers in sidewall regions and method for forming
03/16/2006US20060057791 Method of fabricating micro-chips
03/16/2006US20060057790 HEMT device and method of making
03/16/2006US20060057789 Method for manufacturing semiconductor device
03/16/2006US20060057788 Exposure mask pattern for LCD and exposure method using the same
03/16/2006US20060057787 Strained finfet cmos device structures
03/16/2006US20060057786 Method of manufacturing a semiconductor film and method of manufacturing a semiconductor device
03/16/2006US20060057785 Method of manufacturing semiconductor device
03/16/2006US20060057784 Enhanced resurf HVPMOS device with stacked hetero-doping RIM and gradual drift region
03/16/2006US20060057783 Methods of forming fuses using selective etching of capping layers
03/16/2006US20060057782 Thin glass chip for an electronic component and manufacturing method
03/16/2006US20060057781 Plastic leadframe and compliant fastener
03/16/2006US20060057780 Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices
03/16/2006US20060057779 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
03/16/2006US20060057778 Fabricating method of wafer protection layers
03/16/2006US20060057777 Separating die on a substrate to reduce backside chipping
03/16/2006US20060057776 Wafer stacking package method
03/16/2006US20060057775 Method of forming a wafer backside interconnecting wire
03/16/2006US20060057774 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
03/16/2006US20060057773 Method for producing a stack of chips, a stack of chips and method for producing a chip for a multi-chip stack
03/16/2006US20060057772 Method for forming a redistribution layer in a wafer structure
03/16/2006US20060057771 Low cost fabrication of microelectrode arrays for cell-based biosensors and drug discovery methods
03/16/2006US20060057770 Method for packaging chip and package assembly produced thereby
03/16/2006US20060057769 Use of conductive carbon black/graphite mixtures for the production of low-cost electronics
03/16/2006US20060057768 Semiconductor element heat dissipating member, semiconductor device using same and manufacturing same
03/16/2006US20060057767 Nanoscale mass conveyors
03/16/2006US20060057766 Method for preparation of semiconductive films
03/16/2006US20060057765 Image sensor including multiple lenses and method of manufacture thereof
03/16/2006US20060057764 Image sensor and fabricating method thereof
03/16/2006US20060057763 Method of forming a surface mountable IC and its assembly
03/16/2006US20060057762 Method of building electronic label for electronic device
03/16/2006US20060057761 Method for fabricating microstructure and microstructure
03/16/2006US20060057760 Image sensor and method for forming the same
03/16/2006US20060057759 System and method to improve image sensor sensitivity
03/16/2006US20060057758 Semiconductor physical quantity sensor and method for manufacturing the same
03/16/2006US20060057757 Method of manufacturing semiconductor probe having resistive tip
03/16/2006US20060057756 Surface shape recoginition sensor and method of producing the same
03/16/2006US20060057755 Micromechanical component and suitable method for its manufacture
03/16/2006US20060057754 Systems and methods of actuating MEMS display elements
03/16/2006US20060057753 Methods for producing phosphor based light sources
03/16/2006US20060057752 Light emitting diode and method of making the same
03/16/2006US20060057751 LED package and method for producing the same
03/16/2006US20060057750 Method and apparatus for manufacturing display
03/16/2006US20060057749 Template type substrate and a method of preparing the same
03/16/2006US20060057748 Control of contact resistance in quantium well intermixed devices
03/16/2006US20060057747 Reloading of die carriers without removal of die carriers from sockets on test boards
03/16/2006US20060057746 Semiconductor device fabrication method and apparatus
03/16/2006US20060057745 Novel oxidation structure/method to fabricate a high-performance magnetic tunneling junction MRAM
03/16/2006US20060057744 Method of manufacturing a semiconductor device
03/16/2006US20060057743 Spintronic device having a carbon nanotube array-based spacer layer and method of forming same
03/16/2006US20060057742 Method of forming CNT containing wiring material and sputtering target material used for the method
03/16/2006US20060057491 Coating compositions for use with an overcoated photoresist
03/16/2006US20060057476 Antireflective coating; making semiconductors at lower wavelengths using reflective masks that can be effectively inspected at multiple wavelengths; wide bandwidth inspection contrast for extreme ultra-violet reticles
03/16/2006US20060057474 Photomasks; optics
03/16/2006US20060057473 photomasks; phase shifting
03/16/2006US20060057470 Method for producing mask blank and method for producing transfer mask
03/16/2006US20060057469 Photomask blank, photomask, and pattern transfer method using photomask
03/16/2006US20060057468 Method of pattern formation using ultrahigh heat resistant positive photosensitive composition
03/16/2006US20060057404 Laminating a plurality of unit layers, consisting of Zn, Bi or Sn single metal layer or alloy layer, by vapor deposition, plating; solder junction connects a semiconductor device; lead-free, uniformity as melting point, thickness
03/16/2006US20060057403 Use of thin SOI to inhibit relaxation of SiGe layers
03/16/2006US20060057293 Thermally controlled fluidic self-assembly